KR102084292B1 - Method for producing multilayer printed wiring board - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention aims to enable efficient production of a coreless multilayer printed wiring board with excellent quality stability, and includes a carrier made of a resin plate-shaped carrier and a metal foil that is mechanically detachable to one or both surfaces of the carrier. It is a manufacturing method of the buildup board | substrate including the process 1 of preparing a metal foil, and the process 2 of laminating | stacking at least 1 layer of buildup layers which have an insulation layer and a wiring pattern on one side or both sides of the said metal foil with a carrier.

Description

Manufacturing method of multilayer printed wiring board {METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD}

The present invention relates to a method for producing a multilayer printed wiring board. Moreover, this invention relates to the multilayer laminated board used when manufacturing a multilayer printed wiring board.

Generally, the printed wiring board uses the dielectric material called "prepreg" obtained by impregnating synthetic resin in base materials, such as a synthetic resin board, a glass plate, a glass nonwoven fabric, and paper, as a basic structural material. Moreover, the sheet | seats, such as copper or copper alloy foil which have electrical conductivity, are joined by the side which opposes a prepreg. The laminate thus assembled is commonly referred to as CCL (Copper Clad Laminate) material. It is common for the copper foil surface which contacts a prepreg to perform antirust process for oxidation prevention, after performing a roughening process in order to raise joint strength. Instead of copper or copper alloy foil, foil such as aluminum, nickel or zinc may be used. These thicknesses are about 5-200 micrometers. This commonly used CCL (Copper Clad Laminate) material is shown in FIG.

As an assembly method of a multilayer printed wiring board, the method of using copper foil with a carrier is described in Unexamined-Japanese-Patent No. 2009-272589 (patent document 1). In Example 1 of this document, a copper foil is bonded to the front and back of the prepreg to form a copper foil with a carrier, and on this copper foil with a carrier, a desired number of prepregs and a two-layer printed circuit board called an inner layer core next. Next, the prepreg and the copper foil with a carrier are piled up in order, and the material assembly unit of a 4-layer board | substrate is completed. Moreover, in Example 2 of this document, plating or metal foil with a carrier which consists of a plate-shaped carrier which consists of a prepreg and the metal foil which contacted at least one surface of the carrier so that peeling was possible was carried out by plating or metal foil about half the thickness. A step of forming a circuit, followed by a step of forming a new metal foil layer by hot pressing a prepreg and a metal foil on the circuit, followed by a step of forming a circuit in the new metal foil layer. After stacking the number of layers, the surface is peeled from the interface between the prepreg of the metal foil with a plate carrier and the metal foil, and the entire surface is etched to expose the circuit.

Japanese Unexamined Patent Publication No. 2009-272589

The manufacturing method of the multilayer printed wiring board of patent document 1 is a metal foil with a carrier which consists of a synthetic resin plate-shaped carrier and the metal foil which can be easily peeled by human hands, ie, it can be peeled mechanically, at least one surface of the carrier. In using, it is a method completely different from the manufacturing method of the multilayer printed wiring board using the conventional CCL material.

By using the said metal foil with a carrier, since copper foil is supported by synthetic resin over the whole surface, generation | occurrence | production of the wrinkle with respect to the copper foil in lamination can be prevented. In addition, since the metal foil with the carrier is in close contact with the metal foil and the synthetic resin without a gap, when the metal foil surface is plated or etched, it is possible to inject this into the plating or etching chemical. In addition, since the coefficient of linear expansion of the synthetic resin is at the same level as that of the copper foil which is the constituent material of the substrate and the prepreg after polymerization, the positional shift of the circuit is not caused. Therefore, the occurrence of defective products is reduced and the yield can be improved. That has an excellent effect.

Thus, although the said metal foil with a carrier described in patent document 1 provides various advantages in manufacturing a multilayer printed wiring board, the manufacturing method of the multilayer printed wiring board described in patent document 1 is limited, and with said carrier It is thought that the method of manufacturing a multilayer printed wiring board using metal foil exists elsewhere. Then, one object of this invention is to provide the manufacturing method of the new multilayer printed wiring board using the metal foil with carrier which the plate-shaped carrier made from synthetic resin and the metal foil contact | connected so that peeling is possible. Moreover, this invention makes it one of another subject to provide the multilayer laminated board which can be used for the manufacturing method of the multilayer printed wiring board which concerns on this invention.

This invention provides the manufacturing method of the following multilayer printed wiring board in one side.

(1) Process 1 of preparing metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contacted both surfaces of this carrier so that peeling was possible,

A step 2 of laminating at least one layer of build-up layers having an insulating layer and a wiring pattern on both sides of the metal foil with a carrier.

(2) In the said process 2, the manufacturing method of the buildup board | substrate of (1) containing the process of forming one or more layers of buildup wiring layers on both surfaces of the said metal foil with a carrier.

(3) The method for manufacturing a buildup substrate according to (2), wherein the buildup wiring layer is formed using at least one of a subtractive method, a full additive method, or a semiadditive method.

(4) In the said process 2, resin is laminated | stacked on both surfaces of the said metal foil with a carrier, and then resin, single-sided or double-sided wiring board, single-sided or double-sided metal clad laminated board, or resin plate-shaped carrier and one side or both sides of the carrier The manufacturing method of the buildup board | substrate in any one of (1)-(3) containing laminating | stacking the metal foil with a carrier which consists of metal foils which were peeled in close contact with each other, or metal foil repeatedly one or more times.

(5) In the manufacturing method of the buildup board | substrate as described in (4), a hole is made to single-sided or double-sided wiring board, single-sided or double-sided metal clad laminated board, metal foil of carrier foil, plate-shaped carrier of metal foil with carrier, or resin, The manufacturing method of the buildup board | substrate which further includes the process of conducting plating on the side surface and bottom surface of the said hole.

(6) In the manufacturing method of the buildup board | substrate as described in (4) or (5), Metal foil which comprises the said single-sided or double-sided wiring board, Metal foil which comprises single-sided or double-sided metal clad laminated board, and metal foil with carrier comprise The manufacturing method of the buildup board | substrate which further includes performing the process of forming wiring in at least one of metal foils 1 or more times.

(7) The build-up substrate according to any one of (2) to (6), further comprising a step of laminating a resin on the surface on which the wiring is formed, and laminating a metal foil with a carrier in which the metal foil is in close contact with both sides of the resin. Method of preparation.

(8) The manufacturing method of the buildup board | substrate in any one of (1)-(7) in which the resin plate-shaped carrier contains a thermosetting resin.

(9) The manufacturing method of the buildup board | substrate in any one of (1)-(8) whose resin plate-shaped carrier is a prepreg.

(10) The manufacturing method of the buildup board | substrate in any one of (1)-(9) whose peeling strength of the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.

(11) Any of (1)-(10) whose peeling strength of a metal foil and a plate-shaped carrier after heating at 220 degreeC for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the buildup board | substrate of one.

(12) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:

[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)

Manufacture of the buildup board | substrate in any one of (1)-(11) which uses and combines the silane compound shown to this, its hydrolysis product, and the condensate of this hydrolysis product individually or in combination. Way.

(13) The manufacturing method of the buildup board | substrate in any one of (1)-(12) whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil.

The buildup board | substrate manufactured by the manufacturing method in any one of (14) (1)-(13).

(15) The manufacturing method of a buildup wiring board in the manufacturing method in any one of (1)-(13) including the process 3 which peels and isolates both sides metal foil from the said metal foil with a carrier further.

(16) Furthermore, the manufacturing method of the buildup wiring board as described in (15) including the process 4 of removing the whole surface of the metal foil exposed by the said process 3 by etching, or etching a part of surface and forming a wiring pattern. .

In the said process 4, the manufacturing method of the buildup wiring board as described in (16) which forms a wiring pattern by etching part of the surface of the metal foil exposed by peeling.

(18) Metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contacted both surfaces of the carrier so that peeling was possible, And

The buildup wiring board provided with the buildup layer which has an insulation layer and wiring pattern laminated | stacked at least one layer by the both sides of the said metal foil with a carrier.

The buildup wiring board manufactured by the manufacturing method in any one of (19) (15)-(17).

The buildup wiring board as described in (18) or (19) which is for manufacture of a coreless multilayer printed wiring board.

(21) The buildup wiring board according to any one of (18) to (20), wherein the resin plate-shaped carrier contains a thermosetting resin.

(22) The build-up wiring board according to any one of (18) to (21), wherein the resin plate-shaped carrier is a prepreg.

The buildup wiring board as described in any one of (18)-(22) whose peeling strength of the plate-shaped carrier and metal foil which comprise the metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.

(24) Any of (18)-(23) whose peeling strength of a metal foil and a plate-shaped carrier is 10 gf / cm or more and 200 gf / cm or less after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. The buildup wiring board of one.

(25) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:

[Formula 2]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)

The build-up wiring board as described in any one of (18)-(24) which uses and combines the silane compound shown to this, the hydrolysis product, and the condensate of this hydrolysis product individually or in combination.

The buildup wiring board in any one of (18)-(25) whose metal foil which comprises the metal foil with a carrier is copper foil or copper alloy foil.

(27) The manufacturing method of the printed circuit board containing the process of manufacturing a buildup board | substrate by the manufacturing method in any one of (1)-(13).

The manufacturing method of the printed circuit board containing the process of manufacturing a buildup wiring board by the manufacturing method in any one of (28) (15)-(17).

(29) Process 1 of preparing metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contacted both surfaces of this carrier so that peeling was possible,

The manufacturing method of the multilayer metal coating laminated board containing the process 2 of laminating | stacking resin on both sides of the said metal foil with a carrier, and then laminating | stacking a resin or metal foil repeatedly one or more times.

(30) In the said process 2, including laminating | stacking resin on both sides of the said metal foil with a carrier, and then laminating | stacking resin, single-sided or double-sided metal clad laminated board, metal foil with a carrier, or metal foil repeatedly one or more times, The manufacturing method of the multilayer metal clad laminated board as described in (29).

(31) The manufacturing method of the multilayer metal coating laminated board as described in (29) or (30) in which the resin plate-shaped carrier contains a thermosetting resin.

(32) The manufacturing method of the multilayer metal clad laminated board in any one of (29)-(31) whose resin plate-shaped carrier is a prepreg.

(33) The manufacturing method of the multilayer metal coating laminated board as described in any one of (29)-(32) whose peeling strength of the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.

(34) Any of (29)-(33) whose peeling strength of a metal foil and a plate-shaped carrier after heating at 220 degreeC for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the multilayer metal clad laminated board as described in one.

(35) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:

[Formula 3]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)

The manufacturing method of the multilayer metal coating laminated board as described in any one of (29)-(34) which uses and combines the silane compound shown to this, the hydrolysis product, and the condensate of this hydrolysis product individually or in combination.

(36) The manufacturing method of the multilayer metal coating laminated board in any one of (29)-(35) whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil.

(37) The method for producing a multilayer metal-clad laminate according to any one of (29) to (36), wherein the multilayer metal-clad laminate includes a step of peeling and separating the plate-shaped carrier and the metal foil of the metal foil with a carrier. Manufacturing method.

(38) The manufacturing method of (37) WHEREIN: The manufacturing method of the multilayer metal coating laminated board containing the process of removing part or all of the metal foil which peeled and isolate | separated by etching.

The multilayer metal coating laminated board obtained by the manufacturing method in any one of (39) (29)-(38).

By this invention, it becomes possible to manufacture a coreless multilayer printed wiring board excellent in quality stability efficiently.

1 shows an example of the configuration of a CCL.
2 shows an example of the configuration of a metal foil with a carrier according to the present invention.
3 shows an example of assembling a multilayer CCL using the copper foil with a carrier according to the present invention (a form in which copper foil is bonded to both surfaces of a resin plate).

In one embodiment of the manufacturing method of the multilayer printed wiring board which concerns on this invention,

Step 1 which prepares the metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contacted both surfaces of this carrier so that peeling was possible,

Step 2 of laminating at least one layer of buildup layers which have an insulation layer and a wiring pattern on both sides of the said metal foil with a carrier is included.

<Process 1>

In process 1, the metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contacted both surfaces of this carrier so that peeling was prepared is prepared. One structural example of the metal foil with a carrier used suitably for this invention is shown to FIG. 2 and FIG. In particular, in the initial part of FIG. 3, the metal foil 11 with a carrier which adhere | attached the metal foil 11a so that peeling was possible on both surfaces of the resin plate-shaped carrier 11c is shown. The plate-shaped carrier 11c and the metal foil 11a are bonded together using the silane compound 11b mentioned later.

Structurally, although similar to CCL shown in FIG. 1, in this metal foil with a carrier, since metal foil and resin are finally separated, it has a structure which can be peeled easily by a human hand. Since this point and CCL are not peeled off, a structure and a function are completely different.

Since the metal foil with a carrier used in the present invention must be peeled off anyway, excessively high adhesion is a problem. However, the plate-shaped carrier and the metal foil are not peeled off in a chemical liquid treatment step such as plating performed in a printed circuit board manufacturing process. Adhesion is necessary. From such a viewpoint, the peeling strength of the metal foil and the plate-shaped carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, more preferably 50 gf / cm or more, and preferably 200 gf / cm or less. It is more preferable that it is 150 gf / cm or less, and it is still more preferable that it is 80 gf / cm or less. By making the peeling strength of a metal foil and a plate-shaped carrier into such a range, it does not peel off at the time of conveyance or processing, and can peel easily with a human hand.

Moreover, in the manufacturing process of a multilayer printed wiring board, it heat-processes in a lamination press process or a desmear process in many cases. Therefore, the heat history which the metal foil with a carrier receives becomes worse as the number of laminated sheets increases. Therefore, especially when considering application to a multilayer printed wiring board, it is preferable that the peeling strength of a metal foil and a plate-shaped carrier exists in the above-mentioned range even after passing a required heat history.

Therefore, in one more preferable embodiment of this invention, assuming the heating conditions in the manufacturing process of a multilayer printed wiring board, for example, after heating at least one of 3 hours, 6 hours, or 9 hours at 220 degreeC. It is preferable that the peeling strength of a metal foil and a plate-shaped carrier is 10 gf / cm or more, It is more preferable that it is 30 gf / cm or more, It is still more preferable that it is 50 gf / cm or more, It is preferable that it is 200 gf / cm or less, It is 150 gf / cm It is more preferable that it is cm or less, and it is still more preferable that it is 80 gf / cm or less.

The peel strength after the heating at 220 ° C., in terms of being able to cope with various laminations, satisfies the above-mentioned range in the peel strength in both after 3 hours and after 6 hours, or after 6 hours and 9 hours. It is preferable that all the peeling strengths after 3 hours, 6 hours, and 9 hours satisfy | fill the above-mentioned range.

In this invention, peeling strength is measured based on the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481.

Hereinafter, the specific structural requirements of each material for realizing such peeling strength are demonstrated.

Although there is no restriction | limiting in particular as resin used as a plate-shaped carrier, Although a phenol resin, a polyimide resin, an epoxy resin, a natural rubber, a paper feed etc. can be used, It is preferable that it is a thermosetting resin. Moreover, prepreg can also be used. It is preferable that the prepreg before bonding with metal foil is in a B stage state. The coefficient of linear expansion of the prepreg (C stage) is 12-18 (x 10 ^-6 / deg. C) and 16.5 (x 10 ^-6 / deg. C) of copper foil which is a constituent material of the substrate, or 17.3 (x 10 of SUS press plate). ^-6 / ° C), it is advantageous in that the positional shift of the circuit due to a phenomenon (scaling change) different from that at the time of design of the substrate size before and after the press hardly occurs. In addition, as a synergistic effect of these merit, the production of a multilayer ultra-thin coreless substrate is also possible. The prepreg used here may be the same as the prepreg which comprises a circuit board, or may differ.

It is preferable that this plate-shaped carrier has high glass transition temperature Tg from a viewpoint of maintaining peeling strength after heating in an optimal range, For example, it is 120-320 degreeC, Preferably it is 170-240 degreeC glass transition temperature Tg. In addition, glass transition temperature Tg is made into the value measured by DSC (differential scanning calorimetry).

Moreover, it is preferable that the thermal expansion coefficient of resin is within +10% and -30% of a metal foil thermal expansion coefficient. Thereby, the position shift of the circuit resulting from the thermal expansion difference of metal foil and resin can be prevented effectively, the occurrence of defective products can be reduced, and a yield can be improved.

Although the thickness of a plate-shaped carrier does not have a restriction | limiting in particular, It may be rigid or flexible, However, when too thick, it will adversely affect the heat distribution in a hot press, and when too thin, it will bend and will not flow through the manufacturing process of a printed wiring board, and it is 5 micrometers normally, It is 1000 micrometers or more, 50 micrometers or more and 900 micrometers or less are preferable, and 100 micrometers or more and 400 micrometers or less are more preferable.

As metal foil, although copper or copper alloy foil is typical, foil, such as aluminum, nickel, and zinc, can also be used. In the case of copper or copper alloy foil, an electrolytic foil or a rolled foil can be used. Although metal foil is not limited, it is common to have thickness of 1 micrometer or more, Preferably it is 5 micrometers or more, and 400 micrometers or less, Preferably it is 120 micrometers or less, considering the use as wiring of a printed circuit board. When affixing metal foil on both surfaces of a plate-shaped carrier, metal foil of the same thickness may be used and metal foil of a different thickness may be used.

Various surface treatment may be given to the metal foil to be used. For example, metal plating for the purpose of imparting heat resistance (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating, Co-Ni alloy plating Etc.), chromate treatment for imparting rust resistance and discoloration resistance (including the case where one or more alloying elements such as Zn, P, Ni, Mo, Zr, Ti are contained in the chromate treatment liquid), surface roughness (粗Harmonization treatment for adjustment (eg copper electrodeposition, Cu-Ni-Co alloy plating, Cu-Ni-P alloy plating, Cu-Co alloy plating, Cu-Ni alloy plating, Cu-Co Copper plating, such as alloy plating, Cu-As alloy plating, and Cu-As-W alloy plating, etc.) is mentioned. Not only the roughening treatment affects the peel strength of the metal foil and the plate-shaped carrier, but also the chromate treatment greatly affects it. Although chromate treatment is important from the viewpoint of rust resistance and discoloration resistance, since it tends to raise peeling strength significantly, it is also meaningful as an adjustment means of peeling strength.

In the conventional CCL, since the peel strength of resin and copper foil is high, it is desired, for example, by making the mat surface (M surface) of electrolytic copper foil into an adhesive surface with resin, and performing surface treatment, such as a roughening process. Adhesion is improved by chemical and physical anchor effects. Moreover, also in the resin side, in order to raise the adhesive force with metal foil, various binder is added. As mentioned above, in this invention, since it is different from CCL, and metal foil and resin need to peel finally, it is disadvantageous that excessively high peel strength is carried out.

Therefore, in one preferable embodiment of the metal foil with a carrier which concerns on this invention, in order to adjust the peeling strength of a metal foil and a plate-shaped carrier to the preferable range mentioned above, the surface roughness of a bonding surface is measured based on JISB0601-2001. It is preferable to set it as 10-point average roughness (Rz jis) of one metal foil surface, and to set it as 3.5 micrometers or less and further 3.0 micrometers or less. However, since reducing the surface roughness without causing a cost increase with time, it is preferable to set it to 0.1 micrometer or more, and it is more preferable to set it to 0.3 micrometer or more. When using an electrolytic copper foil as metal foil, if it adjusts to such surface roughness, although it is also possible to use either a glossy surface (shiny surface, S surface) and a rough surface (mat surface, M surface), S It is easier to adjust the surface roughness using the surface. On the other hand, it is preferable that 10-point average roughness Rz jis of the surface of the side of the said metal foil which is not in contact with the said carrier is 0.4 micrometer or more and 10.0 micrometers or less.

Moreover, in one preferable embodiment of the metal foil with a carrier which concerns on this invention, the surface treatment for peeling strength improvement, such as a roughening process, is not performed about the bonding surface with metal resin of resin. Moreover, in one preferable embodiment of the metal foil with a carrier which concerns on this invention, the binder for raising adhesive force with metal foil is not added in resin.

Adjustment of peeling strength may be used individually or in mixture of the silane compound shown by following formula, or its hydrolysis generating material, or the condensate (henceforth simply referred to as a silane compound) of this hydrolysis generating material. It is because adhesiveness falls suitably by bonding a plate-shaped carrier and metal foil using the said silane compound, and it becomes easy to adjust peeling strength to the above-mentioned range.

expression:

[Formula 4]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)

The silane compound needs to have at least one alkoxy group. When no alkoxy group is present and a hydrocarbon group is selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or when a substituent is constituted only by a hydrocarbon group of any of those in which at least one hydrogen atom is substituted with a halogen atom, the adhesion between the plate carrier and the surface of the metal foil It tends to be excessively low. Moreover, the said silane compound is a hydrocarbon group chosen from the group which consists of an alkyl group, a cycloalkyl group, and an aryl group, or it is necessary to have at least one hydrocarbon group in any one of these in which one or more hydrogen atoms were substituted by the halogen atom. It is because there exists a tendency for the adhesiveness of a plate-shaped carrier and the surface of a metal foil to rise when the said hydrocarbon group does not exist. In addition, the alkoxy group which concerns on this invention shall contain the alkoxy group in which one or more hydrogen atoms were substituted by the halogen atom.

In adjusting the peeling strength of a plate-shaped carrier and metal foil to the range mentioned above, the said silane compound has three alkoxy groups and the said hydrocarbon group (it contains the hydrocarbon group by which one or more hydrogen atoms were substituted by the halogen atom). It is preferable. When this is said by the above formula, both of R <^3> and R <^4> become an alkoxy group.

Examples of the alkoxy group include, but are not limited to, methoxy group, ethoxy group, n- or iso-propoxy group, n-, iso- or tert-butoxy group, n-, iso- or neo-pentoxy group, n-hexoxy group, Linear, branched, or cyclic C1-C20, preferably C1-C10, more preferably C1-C5 alkoxy, such as a cyclohexoxy group, n-heptoxy group, and n-octoxy group The group can be mentioned.

As a halogen atom, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom are mentioned.

Examples of the alkyl group include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, n-hexyl group, n-octa Linear or branched C1-C20, preferably C1-C10, More preferably, a C1-C5 alkyl group, such as a methyl group and an n-decyl group, is mentioned.

Although it is not limited as a cycloalkyl group, C3-C10, preferably C5-C7 cycloalkyl groups, such as a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, and a cyclooctyl group, are preferable. Can be mentioned.

Examples of the aryl group include aryl groups having 6 to 20 carbon atoms, preferably 6 to 14 carbon atoms such as a phenyl group, a phenyl group substituted with an alkyl group (e.g., tolyl group, xylyl group), 1- or 2-naphthyl group, and anthryl group. have.

At least one hydrogen atom may be substituted with a halogen atom in these hydrocarbon groups, and for example, may be substituted with a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo-pentyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, phenyltrimethoxysilane; alkyl substituted phenyltrimethoxysilane (eg, p- (methyl) phenyl Trimethoxysilane), methyltriethoxysilane, ethyltriethoxysilane, n- or iso-propyltriethoxysilane, n-, iso- or tert-butyltriethoxysilane, pentyltriethoxysilane, hexyl Triethoxysilane, octyltriethoxysilane, decyltriethoxysilane, phenyltriethoxysilane, alkyl substituted phenyltriethoxysilane (e.g. p- (methyl) phenyltriethoxysilane), (3, 3,3-trifluoropropyl) trimethoxysilane, tridecafluorooctyltriethoxysilane, methyltrichlorosil , Dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane, trimethylfluorosilane, dimethyldibromosilane, diphenyldibromosilane, their hydrolysis products, and condensates of these hydrolysis products, and the like. . Among these, propyl trimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane, and decyltrimethoxysilane are preferable from the viewpoint of the availability.

The metal foil with a carrier can be manufactured by bringing a plate-shaped carrier and metal foil into close contact with a hot press. For example, after apply | coating the said silane compound to the bonding surface of metal foil and / or plate-shaped carrier as needed, it can manufacture by hot-press laminating the resin plate-shaped carrier of B stage with respect to the bonding surface of metal foil.

The silane compound can be used in the form of an aqueous solution. In order to improve the solubility in water, alcohol, such as methanol and ethanol, can also be added. The addition of alcohol is particularly effective when using a highly hydrophobic silane compound. The aqueous solution of a silane compound promotes hydrolysis of the alkoxy group by stirring, and condensation of the hydrolysis product is accelerated when the stirring time is long. Generally, the peeling strength of a metal foil and a plate-shaped carrier tends to fall in the one using the silane compound which hydrolysis and condensation advanced through sufficient stirring time. Therefore, peeling strength can be adjusted by adjustment of stirring time. Although it is not limited, As stirring time after dissolving a silane compound in water, it can be set as 1 to 100 hours, for example, and can be made to 1 to 30 hours typically. Naturally, there is also a method of using without stirring.

The higher the concentration of the silane compound in the aqueous solution of the silane compound tends to lower the peel strength of the metal foil and the plate-shaped carrier, and the peel strength can be adjusted by adjusting the concentration of the silane compound. Although it is not limited, the density | concentration in the aqueous solution of a silane compound can be 0.01-10.0 volume%, and can be 0.1-5.0 volume% typically.

There is no restriction | limiting in particular in pH of the aqueous solution of a silane compound, Even if it is an acidic side or an alkaline side, it can use. For example, it can be used with pH in the range of 3.0-10.0. It is preferable to set it as pH of 5.0-9.0 range which is neutral vicinity from a viewpoint that a special pH adjustment is unnecessary, and it is more preferable to set it as pH of 7.0-9.0 range.

As conditions of a hot press, when using prepreg as a plate-shaped carrier, it is preferable to hot-press at temperature higher than the glass transition temperature of 30-40 kg / cm <2> and prepreg.

<Process 2>

When manufacturing a buildup board | substrate, in a process 2, buildup layers are formed in both surfaces of the metal foil with a carrier in the following procedures, and a buildup board | substrate is obtained.

That is, resin is laminated | stacked on each of the metal foil sides of both sides of the above-mentioned metal foil with a carrier, and then resin, a single-sided or double-sided wiring board, single-sided or double-sided metal clad laminated board, or a resin plate-shaped carrier and the single side | surface or both sides of the carrier The metal foil with a carrier which consists of a metal foil contacted so that peeling was possible, or metal foil is laminated | stacked repeatedly 1 or more times, for example 1 to 10 times. In addition, the metal foil with a carrier which consists of a resin plate-shaped carrier and the metal foil which contact | adhered to the single side | surface or both surfaces of the carrier so that peeling was possible, in the above-mentioned metal foil with carrier, in addition to the metal foil with carrier which adhered the metal foil to both surfaces of the plate-shaped carrier Means that the metal foil is in close contact with only one side of the plate-shaped carrier.

Or one or more buildup wiring layers are laminated | stacked on each of the metal foil side of the both sides of the metal foil with a carrier mentioned above. At this time, the buildup wiring layer can be formed using at least one of a subtractive method, a full additive method, or a semiadditive method.

The subtractive method refers to a method of selectively removing unnecessary portions of metal foil on a metal-clad laminate or a wiring board (including a printed wiring board and a printed circuit board) by etching to form a conductor pattern. A full additive method is a method of forming a conductor pattern by electroless plating or / and electrolytic plating, without using metal foil for a conductor layer, and the semiadditive method is electroless on the seed layer which consists of metal foil, for example. It is a method of obtaining a conductor pattern by etching a metal seed, electroplating, etching, or both together, forming a conductor pattern, and then etching and removing an unnecessary seed layer.

In addition, a single or double-sided wiring board, single-sided or double-sided metal-clad laminate, laminated metal foil with carrier, plate-shaped carrier with metal foil with carrier, or resin laminated in the above-described order are drilled to the side and bottom of the hole. It may include a process for conducting plating. The step of forming a wiring on at least one of the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal foil constituting the metal foil with carrier is further performed. It may also include.

Moreover, the process of laminating | stacking resin on the wiring-formed surface and laminating the above-mentioned metal foil with a carrier which adhere | attached the metal foil on both surfaces to the said resin may also be included.

More specifically, the buildup layer 16 having the insulating layer 17 and the wiring pattern 18 is stacked on at least one layer on both sides of the metal foil 11 with the carrier. By alternately stacking the insulating layer 17 and the wiring pattern 18 multiple times, it is possible to set it as the buildup layer 16 of arbitrary layer number. Electrical connection of the metal foil 11a and the buildup layer 16 can be ensured by appropriately forming a via hole (not shown) which penetrates the insulating layer 17 up and down. Such buildup layer 16 may be formed by a known subtractive method, a full additive method, and a semiadditive method. In FIG. 3, an example of the multilayer laminated board after the buildup layer 16 was formed in this way is typically described.

In addition, the buildup layer 16 is formed as follows. First, the resin sheet and metal foil which become the insulating layer 17 are affixed on both surfaces of the metal foil 11 with a carrier. This resin sheet is formed from a modified epoxy resin sheet, a polyphenylene ether resin sheet, a polyimide resin sheet, a cyano ester resin sheet and the like. Generally, thickness can be 20-80 micrometers. You may disperse an inorganic filler in this resin sheet. As metal foil, copper foil of 1-400 micrometers in thickness, Preferably 1-70 micrometers can be used.

Next, through-holes or non-penetrating via holes are formed on the surface of the metal foil affixed by a UV laser, a carbon dioxide laser, a YAG laser, an excimer laser, or the like. Subsequently, electroless copper plating was performed, a resist was formed on the electroless copper plating layer, exposed and developed, followed by electrolytic copper plating on the non-formed portion of the resist, and then the resist was peeled off, and the resist was present. The wiring pattern 18 is formed by etching the electroless copper plating of the part. The conductor layer inside the through hole becomes a via hole. By repeating this procedure, the buildup layer can be multilayered.

Or you may include the process of half-etching the whole surface of metal foil and adjusting thickness as needed. Next, laser processing is performed at a predetermined position of the laminated metal foil to form a via hole penetrating the metal foil and the resin, and a desmear treatment is performed to remove smear in the via hole. Electroless plating is performed on the surface or a part to form an interlayer connection, and electrolytic plating is further performed as necessary. Plating resists may be formed in advance on the portions of the metal foil where electroless plating or electrolytic plating is not necessary before each plating is performed. In addition, in the case where the adhesion between the electroless plating, the electrolytic plating, the plating resist and the metal foil is insufficient, the surface of the metal foil may be chemically harmonized in advance. If a plating resist is used, the plating resist is removed after plating. Next, the circuit is formed by removing unnecessary portions of the metal foil, the electroless plating portion, and the electrolytic plating portion by etching. As a result, a buildup layer is formed. The process from lamination of resin and copper foil to circuit formation may be repeated a plurality of times to further form a multilayer build-up substrate.

Moreover, after laminating | stacking a resin plate on the outermost surface of this buildup layer once, you may laminate | stack by contacting one metal foil of the above-mentioned metal foil with a carrier which adhered metal foil on both surfaces.

Moreover, as another method, resin as an insulating layer, for example, prepreg or photosensitive resin is laminated | stacked on the exposed surface of metal foil of the laminated body obtained by bonding metal foil, for example, copper foil, to both surfaces of the plate-shaped carrier mentioned above. do. Thereafter, via holes are formed at predetermined positions of the resin. When using prepreg, for example as resin, via hole can be implemented by laser processing. What is necessary is just to perform the desmear process which removes the smear in this via hole after laser processing. Moreover, when photosensitive resin is used as resin, resin of a formation part can be removed in a via hole by the photolithographic method. Next, electroless plating is performed on the via hole bottom part, the side surface, and the whole surface or part of resin, and an interlayer connection is formed, and electroplating is performed further as needed. The plating resist may be formed in advance on the resin where the electroless plating or the electrolytic plating is not necessary until the respective plating is performed. If the adhesion between the electroless plating, the electrolytic plating, the plating resist and the resin is insufficient, the surface of the resin may be chemically harmonized in advance. If a plating resist is used, the plating resist is removed after plating. Next, a circuit is formed by removing unnecessary portions of the electroless plating portion or the electrolytic plating portion by etching. As a result, a buildup layer is formed. The process from resin lamination to circuit formation may be repeated a plurality of times to further form a multilayer buildup substrate.

Moreover, after laminating resin once, you may laminate | stack on the outermost surface of this buildup board | substrate by contacting one metal foil of the above-mentioned metal foil with a carrier which adhered metal foil on both surfaces.

In addition, when forming a buildup layer, each layer can be laminated | stacked by carrying out thermocompression bonding. This thermocompression bonding may be performed every time one layer is laminated | stacked, may be carried out after laminating | stacking to some extent, and you may carry out by gathering at last.

Moreover, when manufacturing a multilayer metal coating laminated board, in process 2, a resin layer and a metal foil layer are laminated | stacked on both surfaces of the metal foil with a carrier in the following procedures, and a multilayer metal coating laminated board is obtained.

That is, resin is laminated | stacked on the metal foil side of both surfaces of the above-mentioned metal foil with a carrier, and resin or metal foil is then repeated 1 or more times, for example, 1-10 times repeatedly.

Or resin is laminated | stacked on the metal foil side of both surfaces of the metal foil with a carrier mentioned above, Then, resin, single-sided or double-sided metal clad laminated board, or metal foil with a carrier, or metal foil is repeated 1 or more times, for example, 1 to 10 times, Laminated.

<Process 3, 4>

About the buildup board | substrate obtained by the process 2, the process 3 (peeling) and a process 4 (etching) are performed further as needed, and a buildup wiring board is obtained.

In the process 3, the plate-shaped carrier 11c of the metal foil 11 with a carrier is peeled off, and the metal foil 11a of both surfaces is peeled off, and a multilayer metal coating laminated board whose buildup wiring board or outermost surface is metal foil is obtained. When manufacturing a buildup wiring board, although the said process may be performed before and after which the buildup layer 16 is completed, what is usually performed after forming the wiring pattern 18 in the surface layer of a multilayer laminated board. It is preferable in terms of working efficiency. Moreover, also in any of a buildup wiring board and a multilayer metal clad laminated board, although a soldering resist can also be coated to a surface layer as needed, you may implement this at any stage before and behind peeling.

In process 4, after peeling and isolate | separating the plate-shaped carrier 11c and metal foil 11a of the metal foil 11 with a carrier, a part of the surface of the metal foil 11a exposed by peeling is etched, and wiring formation is appropriately performed, It is good also as a buildup wiring board. Moreover, in the structure of a multilayer printed wiring board, when the wiring pattern of the peeling surface of the metal foil 11a is unnecessary, the whole surface of the metal foil 11a can also be removed by etching. Or when manufacturing a multilayer metal clad laminated board, the multilayer metal clad laminated board from which at least one part or all metal foil was removed from the outermost surface is obtained.

Moreover, a printed circuit board is completed by mounting electronic components further about the buildup board | substrate obtained at the process 2, or the buildup wiring board obtained through the process 3 or the process 4 further.

In the manufacturing method of the multilayer printed wiring board which concerns on this invention, since the carrier in the metal foil with carrier finally removed fulfills the role which ensures mechanical strength, from a viewpoint of mass-producing a coreless multilayer printed wiring board with stable quality in large quantities. It is advantageous. Moreover, after peeling a metal foil from a plate-shaped carrier, since a wiring pattern is formed at the peeling surface of the said metal foil at once, the number of processes can be reduced at the point which does not need to perform an etching process with respect to the said metal foil multiple times.

Example

Although the Example of this invention is shown with a comparative example below, these Examples are provided in order to understand this invention and its advantage better, and it does not intend that invention is limited.

(Metal foil with carrier)

<Experimental example 1>

A plurality of electrolytic copper foils (thickness: 12 µm) were prepared, and nickel-zinc (Ni-Zn) alloy plating treatment and chromate (Cr-Zn chromate) under the following conditions were performed on the shiny (S) surface of each electrolytic copper foil. ) And the 10-point average roughness (measured according to Rz jis: JIS B 0601: 2001) of the bonded surface (here, S surface in this case) is 1.5 µm, and then a prepreg manufactured by Mitsubishi Gas Chemical Co., Ltd. BT resin) was bonded to the S surface of the said electrolytic copper foil, the hot press process was performed at 190 degreeC for 100 minutes, and the copper foil with a carrier was manufactured.

(Nickel-zinc alloy plating)

Ni concentration 17 g / L (added as NiSO ₄ )

Zn concentration 4 g / l (added as ZnSO ₄ )

pH 3.1

40 ℃

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

(Chromate processing)

Cr concentration 1.4 g / l (added as CrO ₃ or K ₂ CrO ₇ )

Zn concentration 0.01 to 1.0 g / l (added as ZnSO ₄ )

Na ₂ SO ₄ concentration 10 g / ℓ

pH 4.8

Liquid temperature 55 ℃

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

About some electrolytic copper foil, after apply | coating the aqueous solution of a silane compound to the said S surface using a spray coater, after drying the copper foil surface in 100 degreeC air, it bonded together with the prepreg. Table 1 shows the types of the silane compounds, the stirring time before dissolving the silane compounds in water, the concentration of the silane compounds in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution with respect to the conditions for use of the silane compound.

In addition, it is assumed that some of the copper foil with a carrier is subjected to a heat history during additional heat treatment such as a hot press when forming at least one layer of the buildup layer with respect to the copper foil with a carrier, and subsequent circuit formation. Then, heat treatment was performed under the conditions shown in Table 1 (here, 3 hours at 220 ° C).

The peeling strength of the copper foil with a carrier obtained by hot press, and the copper foil with a carrier after heat-processing further, and copper foil and plate-shaped carrier (resin after heating) were measured. Each result is shown in Table 1.

Moreover, in order to evaluate peel workability, the work time (time / piece) by a human hand per unit number was evaluated, respectively. The results are shown in Table 2.

<Experimental example 2-18>

Copper foil, resin (prepreg), and some shown in Table 1 used the silane compound, and manufactured copper foil with a carrier in the same procedure as Experimental example 1. In some experimental examples, the heat treatment of the conditions shown in Table 1 was further performed. Evaluation similar to Experimental Example 1 was performed about each. The results are shown in Tables 1 and 2.

In addition, the kind of the bonding surface of copper foil, the conditions of surface treatment, surface roughness Rz jis, the use condition of a silane compound, the kind of prepreg, and the lamination conditions of copper foil and a prepreg are as Table 1 shown.

In the surface treatment conditions of the processed surface of copper foil, the specific conditions of an epoxy silane (treatment) and a roughening process are the following.

(Epoxysilane treatment)

Treatment solution: 0.9% by volume aqueous solution of 3-glycidoxypropyltrimethoxysilane

pH 5.0 to 9.0

Stirred at room temperature for 12 hours

Processing method: After apply | coating a process liquid using a spray coater, a process surface is dried for 5 minutes in 100 degreeC air.

(Harmony processing)

Cu concentration 20 g / l (added as CuSO ₄ )

H ₂ SO ₄ concentration 50 ~ 100 g / ℓ

As concentration 0.01-2.0 g / l (added as arsenic acid)

40 ℃

Current density 40 to 100 A / dm 2

Plating time 0.1-30 seconds

<Experimental Examples 19-20>

Copper foil shown in Table 3, resin (prepreg), and one part used the silane compound, and manufactured copper foil with a carrier in the same procedure as Experimental example 1. Furthermore, heat treatment of the conditions shown in Table 3 was performed. Evaluation similar to Experimental Example 1 was performed about the copper foil with a carrier obtained in this way. The results are shown in Tables 3 and 4.

In addition, the surface was chromate-treated under the conditions mentioned above using S surface as a bonding surface of copper foil. In addition, the surface roughness Rz jis of copper foil, the kind of prepreg, the use condition of the silane compound for surface treatment of a prepreg, and lamination conditions of copper foil and a prepreg are as Table 3 showing.

According to the table, even if the silane compound is processed on the surface of copper foil, or on the surface of a prepreg, it turns out that the same result is obtained in the peeling strength of the laminated body after that, the peeling strength after heating, and peeling workability. .

(Build-up wiring board)

Thus, FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nikko Niseki Kinzoku Co., Ltd., JTC 12 µm (product name)) were stacked in this order on both sides of the copper foil with a carrier. And hot pressing were carried out under the heating conditions shown in the tables at a pressure of 3 MPa to prepare a four-layer copper clad laminate.

Next, the hole of 100 micrometers in diameter which penetrates the copper foil on the surface of the said 4-layer copper clad laminated board, and the insulating layer (hardened prepreg) below was formed using the laser processing machine. Then, copper plating is performed by electroless copper plating and electro copper plating on the copper foil surface on the copper foil with a carrier exposed to the bottom part of the said hole, and the copper foil of the side surface of the said hole, and the said four-layer copper clad laminated board surface. It carried out and formed the electrical connection between the copper foil on copper foil with a carrier, and copper foil on the surface of a four-layer copper clad laminated board. Next, a part of copper foil on the surface of a four-layer copper clad laminated board was etched using the ferric chloride type etching liquid, and the circuit was formed. In this way, a four-layer build-up substrate was obtained.

Subsequently, in the said 4-layer buildup board | substrate, two sets of 2-layer buildup wiring boards were obtained by peeling and isolate | separating the plate-shaped carrier and copper foil of the said copper foil with a carrier.

Subsequently, the copper foil of the side in close contact with the plate-shaped carrier on the two sets of two-layer build-up wiring boards was etched to form wiring, thereby obtaining two sets of two-layer build-up wiring boards.

As for each experiment example, several four-layer buildup board | substrate manufactured, and the adhesion state of the prepreg and copper foil which comprise the copper foil with a carrier in a buildup board | substrate manufacturing process about each visually confirmed it, Table 1 In the build-up wiring board using the copper foil with a carrier manufactured on the conditions where peeling strength and the peeling strength after heating were evaluated as "S" and "G" in Table 3, resin of copper foil with a carrier at the time of buildup (plate-shaped carrier ) Was peeled without breaking. However, about the conditions evaluated as "G", as described in Table 1, 3, copper foil peeled from the plate-shaped carrier at the time of a buildup without peeling operation.

Moreover, about the conditions evaluated as "N", resin was destroyed at the time of peeling operation of the copper foil in copper foil with a carrier at the time of buildup, or resin remained on the copper foil surface without peeling.

Moreover, about the conditions evaluated as "-", although resin peeled at the time of peeling operation of the copper foil in copper foil with a carrier at the time of a buildup, resin peeled without peeling operation in that case. .

1: metal foil with carrier
11a: metal foil
11b: silane compound
11c: plate carrier
16: build up layer
17: insulation layer
18: wiring pattern

Claims (35)

Metal foil with a carrier consisting of a resin containing a thermosetting resin (except for a water-soluble resin) and a metal foil detachably adhered to both surfaces of the carrier so as to have a bonding interface layer composed of a metal layer / pure carbon layer. Step 1 for preparing the metal foil)
A step 2 of laminating at least one layer of build-up layers having an insulating layer and a wiring pattern on both sides of the metal foil with a carrier,
The build-up in which the ten-point average roughness Rz jis of the surface of the side of the metal foil that is not in contact with the plate-shaped carrier is 0.4 µm or more and 10.0 µm or less and satisfies any one or more of the following (A) to (C). Method of manufacturing a substrate.
(A) The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise the said metal foil with a carrier is 10 gf / cm or more and 80 gf / cm or less.
(B) The said metal foil with a carrier is based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 with respect to the said metal foil and the said plate-shaped carrier after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. Peel strength measured is 10 gf / cm or more and 200 gf / cm or less.
(C) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier are the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The silane compound, the hydrolysis product, and the condensation product of the hydrolysis product shown in the above are used alone or in combination of two or more, and are bonded. The method of claim 1,
The manufacturing method of the buildup board | substrate of the said process 2 including the process of forming one or more layers of buildup wiring layers in both surfaces of the said metal foil with a carrier. The method of claim 2,
The build-up wiring layer is formed using at least one of a subtractive method, a full additive method or a semi-additive method. The method of claim 1,
In the said process 2, resin is laminated | stacked on both surfaces of the said metal foil with a carrier, and then peeling is possible to resin, single-sided or double-sided wiring board, single-sided or double-sided metal clad laminated board, or the resin plate-shaped carrier and the single side | surface or both sides of the carrier. The manufacturing method of the buildup board | substrate which includes laminating | stacking metal foil with a carrier which consists of a metal foil which contacted, or metal foil repeatedly one or more times. The method of claim 4, wherein
And a step of forming a hole in a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil of metal foil with a carrier, a plate-shaped carrier of metal foil with a carrier, or a resin, and conducting plating on the side and bottom of the hole. The manufacturing method of the buildup board | substrate to make. The method of claim 4, wherein
Further comprising at least one step of forming a wiring on at least one of the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal clad laminate, and the metal foil constituting the metal foil with carrier. , Manufacturing method of build-up substrate. The method of claim 6,
The manufacturing method of the buildup board | substrate which further includes the process of laminating | stacking resin on the surface in which wiring was formed, and laminating | stacking the metal foil with a carrier which adhered metal foil on both surfaces to the said resin. The method according to any one of claims 1 to 7,
The manufacturing method of the buildup board | substrate whose peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less. The method according to any one of claims 1 to 7,
The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about metal foil and plate-shaped carrier after heating at 220 degreeC for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more. The manufacturing method of a buildup board | substrate which is 200 gf / cm or less. The method according to any one of claims 1 to 7,
The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The manufacturing method of the buildup board | substrate which uses together and combines the silane compound shown to this, the hydrolysis product, and the condensate of this hydrolysis product individually or in combination. The method according to any one of claims 1 to 7,
The manufacturing method of the buildup board | substrate whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil. The buildup board | substrate manufactured by the manufacturing method in any one of Claims 1-7. The manufacturing method of a buildup wiring board of the manufacturing method in any one of Claims 1-7 which further includes the process 3 which peels and isolates both surfaces metal foil from the said metal foil with a carrier. The method of claim 13,
Furthermore, the manufacturing method of the buildup wiring board containing the process 4 of removing the whole surface of the metal foil exposed by the said process 3 by etching, or etching a part of surface and forming a wiring pattern. The method of claim 14,
In the said process 4, the manufacturing method of the buildup wiring board which forms a wiring pattern by etching a part of surface of the metal foil exposed by peeling. Metal foil with a carrier consisting of a resin containing a thermosetting resin (except for a water-soluble resin) and a metal foil detachably adhered to both surfaces of the carrier so as to have a bonding interface layer composed of a metal layer / pure carbon layer. Except metal foil), and,
A build-up layer having an insulating layer and a wiring pattern stacked on at least one layer on both sides of the metal foil with a carrier,
The build-up in which the ten-point average roughness Rz jis of the surface of the side of the metal foil that is not in contact with the plate-shaped carrier is 0.4 µm or more and 10.0 µm or less and satisfies any one or more of the following (A) to (C). Board.
(A) The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise the said metal foil with a carrier is 10 gf / cm or more and 80 gf / cm or less.
(B) The said metal foil with a carrier is based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 with respect to the said metal foil and the said plate-shaped carrier after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. Peel strength measured is 10 gf / cm or more and 200 gf / cm or less.
(C) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier are the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The silane compound, the hydrolysis product, and the condensation product of the hydrolysis product shown in the above are used alone or in combination of two or more, and are bonded. The buildup wiring board manufactured by the manufacturing method of Claim 13. The method of claim 16,
The buildup board | substrate for manufacture of a coreless multilayer printed wiring board. The method according to claim 16 or 18,
The buildup board | substrate whose peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less. The method according to claim 16 or 18,
The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about metal foil and plate-shaped carrier after heating at 220 degreeC for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more. A build up substrate that is 200 gf / cm or less. The method according to claim 16 or 18,
The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:
[Formula 2]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The build-up board | substrate which consists of using the silane compound shown in the figure, its hydrolysis product, and the condensate of this hydrolysis product individually or in combination, and bonding them together. The method according to claim 16 or 18,
The buildup board | substrate whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil. The manufacturing method of the printed circuit board containing the process of manufacturing a buildup board | substrate by the manufacturing method in any one of Claims 1-7. The manufacturing method of a printed circuit board containing the process of manufacturing a buildup wiring board by the manufacturing method of Claim 13. Metal foil with a carrier consisting of a resin containing a thermosetting resin (except for a water-soluble resin) and a metal foil detachably adhered to both surfaces of the carrier so as to have a bonding interface layer composed of a metal layer / pure carbon layer. Step 1 for preparing the metal foil)
Laminating | stacking resin on both sides of the said metal foil with a carrier, and then laminating | stacking a resin or a metal foil repeatedly one or more times, and
10-layer average roughness Rz jis of the surface of the side which does not contact the said plate-shaped carrier of the said metal foil is 0.4 micrometer or more and 10.0 micrometer or less, and satisfy | fills any one or more of the following (A)-(C) Method for producing a coated laminate.
(A) The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise the said metal foil with a carrier is 10 gf / cm or more and 80 gf / cm or less.
(B) The said metal foil with a carrier is based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 with respect to the said metal foil and the said plate-shaped carrier after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. Peel strength measured is 10 gf / cm or more and 200 gf / cm or less.
(C) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier are the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The silane compound, the hydrolysis product, and the condensation product of the hydrolysis product shown in the above are used alone or in combination of two or more, and are bonded. The method of claim 25,
In the said process 2, resin is laminated | stacked on both sides of the said metal foil with a carrier, and then multilayer resin coating containing laminating | stacking a resin, single-sided or double-sided metal clad laminated board, metal foil with a carrier, or metal foil repeatedly one or more times. Method for producing a laminate. The method of claim 25 or 26,
The manufacturing method of the multilayer metal coating laminated board whose peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less. The method of claim 25 or 26,
The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about metal foil and plate-shaped carrier after heating at 220 degreeC for 3 hours, 6 hours, or 9 hours is 10 gf / cm or more. The manufacturing method of a multilayer metal clad laminated board which is 200 gf / cm or less. The method of claim 25 or 26,
The plate-shaped carrier and the metal foil constituting the metal foil with a carrier have the following formula:
[Formula 3]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The manufacturing method of the multilayer metal clad laminated board formed by bonding together and using the silane compound shown in the figure, the hydrolysis product, and the condensate of this hydrolysis product individually or in combination. The method of claim 25 or 26,
The manufacturing method of the multilayer metal coating laminated board whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil. The method of claim 25 or 26,
The manufacturing method of the multilayer metal clad laminated board which further includes the process of peeling and separating the plate-shaped carrier and metal foil of the said metal foil with a carrier. The method of claim 31, wherein
The manufacturing method of the multilayer metal coating laminated board containing the process of removing part or all of the metal foil which peeled and isolate | separated by etching. The multilayer metal coating laminated sheet obtained by the manufacturing method of Claim 25 or 26. Metal foil with a carrier consisting of a resin containing a thermosetting resin (except for a water-soluble resin) and a metal foil detachably adhered to both surfaces of the carrier so as to have a bonding interface layer composed of a metal layer / pure carbon layer. Step 1 for preparing the metal foil)
It includes the process 2 of peeling the said metal foil from the said metal foil with a carrier,
10-point average roughness Rz jis of the surface of the side which is not in contact with the said plate-shaped carrier of the said metal foil is 0.4 micrometer or more and 10.0 micrometer or less, and satisfy | fills any one or more of the following (A)-(C) Method of preparation.
(A) The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise the said metal foil with a carrier is 10 gf / cm or more and 80 gf / cm or less.
(B) The said metal foil with a carrier is based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 with respect to the said metal foil and the said plate-shaped carrier after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. Peel strength measured is 10 gf / cm or more and 200 gf / cm or less.
(C) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier are the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The silane compound, the hydrolysis product, and the condensation product of the hydrolysis product shown in the above are used alone or in combination of two or more, and are bonded. Metal foil with a carrier consisting of a resin containing a thermosetting resin (except for a water-soluble resin) and a metal foil detachably adhered to both surfaces of the carrier so as to have a bonding interface layer composed of a metal layer / pure carbon layer. Step 1 for preparing the metal foil)
Step 2 of laminating | stacking the said metal foil from the said metal foil with a carrier after laminating | stacking at least one layer the buildup layer which has an insulation layer and a wiring pattern on both sides of the said metal foil with a carrier,
The build-up in which the ten-point average roughness Rz jis of the surface of the side of the metal foil that is not in contact with the plate-shaped carrier is 0.4 µm or more and 10.0 µm or less and satisfies any one or more of the following (A) to (C). Method of manufacturing the wiring board.
(A) The peeling strength measured based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 about the plate-shaped carrier and metal foil which comprise the said metal foil with a carrier is 10 gf / cm or more and 80 gf / cm or less.
(B) The said metal foil with a carrier is based on the 90 degree peeling strength measurement method prescribed | regulated to JIS C6481 with respect to the said metal foil and the said plate-shaped carrier after heating at 220 degreeC for at least 1 time of 3 hours, 6 hours, or 9 hours. Peel strength measured is 10 gf / cm or more and 200 gf / cm or less.
(C) The plate-shaped carrier and the metal foil constituting the metal foil with a carrier are the following formula:
[Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrogen atom is a hydrocarbon group of any of these substituted with a halogen atom, R ³ And R ⁴ is each independently a halogen atom, or an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or one or more hydrocarbon groups in which one or more hydrogen atoms are substituted with halogen atoms.)
The silane compound, the hydrolysis product, and the condensation product of the hydrolysis product shown in the above are used alone or in combination of two or more, and are bonded.

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