JP6243840B2 - Manufacturing method of multilayer printed wiring board - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer printed wiring board. Moreover, this invention relates to the multilayer laminated board utilized when manufacturing a multilayer printed wiring board.

  In general, a printed wiring board uses, as a basic constituent material, a dielectric material called “prepreg” obtained by impregnating a base material such as a synthetic resin plate, a glass plate, a glass nonwoven fabric, and paper with a synthetic resin. . Further, a sheet such as copper or copper alloy foil having electrical conductivity is bonded to the side facing the prepreg. The laminated body thus assembled is generally called a CCL (Copper Clad Laminate) material. The copper foil surface in contact with the prepreg is usually subjected to a rust preventive treatment for preventing oxidation after being subjected to a roughening treatment in order to increase the bonding strength. A foil made of aluminum, nickel, zinc or the like may be used instead of the copper or copper alloy foil. Their thickness is about 5 to 200 μm. This commonly used CCL (Copper Clad Laminate) material is shown in FIG.

  As a method for assembling a multilayer printed wiring board, a method using a copper foil with a carrier is described in Japanese Patent Application Laid-Open No. 2009-272589 (Patent Document 1). In Example 1 of the document, a copper foil is bonded to the front and back of the prepreg to form a copper foil with a carrier. On the copper foil with a carrier, a desired number of prepregs and then a two-layer printed circuit board called an inner layer core, A material assembly unit of a set of four-layer substrates is completed by sequentially stacking a prepreg and a copper foil with a carrier. Further, in Example 2 of the document, a plate-like carrier made of a prepreg and a metal foil with a carrier made of a metal foil mechanically and detachably adhered to at least one surface of the carrier are plated or metal foil thickness. A step of forming a circuit by etching about half of the above, then a step of forming a new metal foil layer by hot-pressing a prepreg and a metal foil on the circuit, and then forming the new metal foil layer The circuit is formed on the substrate, and after a predetermined number of layers are further stacked, the metal foil with a plate carrier is peeled from the interface between the prepreg and the metal foil, and the peeled surface is further etched to expose the circuit. Yes.

JP 2009-272589 A

  The manufacturing method of the multilayer printed wiring board described in Patent Document 1 is a metal foil in which a synthetic resin plate-like carrier and at least one surface of the carrier can be easily and manually peeled, that is, mechanically peelable. This is a completely different method from the conventional method for producing a multilayer printed wiring board using a CCL material in that a metal foil with a carrier is used.

  By using the metal foil with a carrier, the copper foil is supported over the entire surface by the synthetic resin, so that generation of wrinkles on the copper foil during lamination can be prevented. In addition, since the metal foil with carrier is in close contact with the synthetic resin without gaps, when the surface of the metal foil is plated or etched, it can be poured into the plating or etching chemical. . Furthermore, since the linear expansion coefficient of the synthetic resin is at the same level as the copper foil that is a constituent material of the substrate and the prepreg after polymerization, the circuit is not misaligned, resulting in fewer defective products, It has the outstanding effect that a yield can be improved.

  Thus, although the metal foil with a carrier described in Patent Document 1 provides various advantages in manufacturing a multilayer printed wiring board, the manufacture of the multilayer printed wiring board described in Patent Document 1 The method is limited, and it is considered that there are other methods for producing a multilayer printed wiring board using the metal foil with a carrier. Then, this invention makes it one subject to provide the manufacturing method of the new multilayer printed wiring board using the metal foil with a carrier with which the plate-shaped carrier made from a synthetic resin and metal foil are closely_contact | adhered so that peeling is possible. Another object of the present invention is to provide a multilayer laminate that can be used in the method for producing a multilayer printed wiring board according to the present invention.

In one aspect, the present invention provides the following method for producing a multilayer printed wiring board.
(1) Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is detachably adhered to both surfaces of the carrier;
Look including the step 2 of laminating the buildup layer of at least one layer having opposite sides in the insulating layer and the wiring pattern of the metal foil with carrier, the ten-point average roughness of the plate-shaped carrier not in contact with the side surface of the metal foil The manufacturing method of a buildup board | substrate whose thickness (Rz jis) is 0.4 micrometer or more and 10.0 micrometers or less .
(2) The method for manufacturing a buildup substrate according to (1), including a step of forming one or more buildup wiring layers on both surfaces of the metal foil with a carrier in the step 2.
(3) The buildup wiring layer manufacturing method according to (2), wherein the buildup wiring layer is formed using at least one of a subtractive method, a full additive method, and a semi-additive method.
(4) In step 2, resin is laminated on both surfaces of the carrier-attached metal foil, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin-made plate carrier and one side of the carrier Or the manufacturing method of the buildup board | substrate as described in (1) including repeatedly laminating | stacking the metal foil with a carrier which consists of metal foil closely_contact | adhered to both surfaces so that peeling is possible, or metal foil.
(5) In the method for producing a build-up board according to (4), a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin The manufacturing method of the buildup board | substrate which further includes the process of drilling a hole in and carrying out conductive plating to the side surface and bottom face of the said hole.
(6) In the method for manufacturing a buildup board according to (4) or (5), a metal foil constituting the single-sided or double-sided wiring board, a metal foil constituting a single-sided or double-sided metal-clad laminate, and a metal with a carrier The manufacturing method of the buildup board | substrate which further includes performing the process of forming wiring in at least 1 of the metal foil which comprises foil once or more.
(7) The method further includes a step of laminating a resin on the surface on which the wiring is formed, and laminating a metal foil with a carrier in which a metal foil is adhered to both surfaces of the resin. The manufacturing method of the build-up board | substrate of description.
(8) The manufacturing method of the buildup board | substrate in any one of (1)-(7) whose resin-made plate-shaped carrier contains a thermosetting resin.
(9) The manufacturing method of the buildup board | substrate in any one of (1)-(7) whose resin-made plate-shaped carrier is a prepreg.
(10) The manufacturing method of the buildup board | substrate in any one of (1)-(9) whose peeling strength of the plate-shaped carrier and metal foil which comprise metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less.
(11) The peel strength between the metal foil and the plate carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (1) to (10) The manufacturing method of the buildup board | substrate in any one of.
(12) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The build-up substrate according to any one of (1) to (11), wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product are bonded together using one or a combination thereof. Method.
(13) The manufacturing method of the buildup board | substrate in any one of (1)-(12) whose metal foil which comprises metal foil with a carrier is copper foil or copper alloy foil.
(14) A build-up substrate manufactured by the manufacturing method according to any one of (1) to (13).
(15) The manufacturing method according to any one of (1) to (13), further including a step 3 of separating and separating the metal foils on both sides from the metal foil with a carrier and separating them. .
(16) The buildup wiring board according to (15), further including a step 4 of forming a wiring pattern by etching the entire surface of the metal foil exposed in the step 3 or etching a part of the surface. Manufacturing method.
(17) In the step 4, the build-up wiring board manufacturing method according to (16), wherein a part of the surface of the metal foil exposed by peeling is etched to form a wiring pattern.
(18) a metal foil with a carrier comprising a resinous plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier, and
A buildup layer having an insulating layer and a wiring pattern laminated at least one layer on each side of the metal foil with a carrier ;
A build-up wiring board in which the ten-point average roughness (Rz jis) of the surface of the metal foil not contacting the plate-like carrier is 0.4 μm or more and 10.0 μm or less .
(19) A build-up wiring board manufactured by the manufacturing method according to any one of (15) to (17).
(20) The build-up wiring board according to (18) or (19), which is used for manufacturing a coreless multilayer printed wiring board.
(21) The build-up wiring board according to any one of (18) to (20), wherein the resinous plate-like carrier includes a thermosetting resin.
(22) The build-up wiring board according to any one of (18) to (20), wherein the resin-made plate carrier is a prepreg.
(23) The build-up wiring board according to any one of (18) to (22), wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less.
(24) The peel strength between the metal foil and the plate carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (18) to (23) The buildup wiring board according to any one of (23).
(25) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The build-up wiring board according to any one of (19) to (24), wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product are bonded together using one or a combination thereof.
(26) The buildup wiring board according to any one of (18) to (25), wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
(27) A method for producing a printed circuit board, comprising a step of producing a build-up substrate by the production method according to any one of (1) to (13).
(28) A method for producing a printed circuit board, comprising a step of producing a build-up wiring board by the production method according to any one of (15) to (17).
(29) Step 1 of preparing a metal foil with a carrier comprising a resinous plate-like carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
On both sides of the metal foil wherein the carrier, the resin is laminated, and then look including the step 2 of laminating a resin or a metal foil is repeated one or more times,
A method for producing a multilayer metal-clad laminate , wherein a ten-point average roughness (Rz jis) of a surface of the metal foil not contacting the plate-like carrier is 0.4 μm or more and 10.0 μm or less .
(30) In step 2, the resin is laminated on both sides of the metal foil with carrier, and then the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil is repeatedly laminated one or more times. The manufacturing method of the multilayer metal-clad laminate as described in (29) containing this.
(31) The method for producing a multilayer metal-clad laminate according to (29) or (30), wherein the resin-made plate-like carrier contains a thermosetting resin.
(32) The method for producing a multilayer metal-clad laminate according to any one of (29) to (31), wherein the resinous plate-like carrier is a prepreg.
(33) The production of the multilayer metal-clad laminate according to any one of (29) to (32), wherein the peel strength between the plate-like carrier and the metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less. Method.
(34) The peel strength between the metal foil and the plate carrier after heating at 220 ° C. for 3 hours, 6 hours or 9 hours is 10 gf / cm or more and 200 gf / cm or less (29) to (33) The manufacturing method of the multilayer metal clad laminated board in any one of.
(35) The plate-like carrier and the metal foil constituting the metal foil with the carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The multilayer metal-clad laminate according to any one of (29) to (34), wherein the silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product are bonded together using a single or a combination of two or more. Manufacturing method.
(36) The method for producing a multilayer metal-clad laminate according to any one of (29) to (35), wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.
(37) The method for producing a multilayer metal-clad laminate according to any one of (29) to (36), further comprising a step of peeling and separating the plate-like carrier and metal foil of the metal foil with carrier. A method for producing a metal-clad laminate.
(38) The method for producing a multilayer metal-clad laminate comprising the step of removing a part or all of the separated and separated metal foil by etching in the production method according to (37).
(39) A multilayer metal-clad laminate obtained by the production method according to any one of (29) to (38).

  According to the present invention, it is possible to efficiently manufacture a coreless multilayer printed wiring board excellent in quality stability.

An example of the configuration of CCL is shown. The structural example of the metal foil with a carrier which concerns on this invention is shown. The assembly example of the multilayer CCL using the copper foil with a carrier which concerns on this invention (The form which copper foil joined on both surfaces of the resin board) is shown.

In one embodiment of a method for producing a multilayer printed wiring board according to the present invention,
Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier;
Step 2 of laminating at least one buildup layer having an insulating layer and a wiring pattern on both sides of the metal foil with carrier,
including.

<Step 1>
In step 1, a metal foil with a carrier comprising a resin plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier is prepared. One structural example of the metal foil with a carrier used suitably for this invention is shown in FIG. 2 and FIG. In particular, the metal foil 11 with a carrier in which the metal foil 11a is detachably attached to both surfaces of a resin plate carrier 11c is shown at the beginning of FIG. The plate-like carrier 11c and the metal foil 11a are bonded together using a silane compound 11b described later.

  Although structurally similar to the CCL shown in FIG. 1, this metal foil with carrier has a structure in which the metal foil and the resin are finally separated and can be easily peeled manually. In this respect, since the CCL is not peeled off, the structure and function are completely different.

  Since the metal foil with carrier used in the present invention must be peeled off eventually, it is inconvenient that the adhesiveness is excessively high, but the plate-like carrier and the metal foil are chemicals such as plating performed in the printed circuit board manufacturing process. Adhesiveness that does not peel in the processing step is necessary. From such a viewpoint, the peel strength between the metal foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more. Therefore, it is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and still more preferably 80 gf / cm or less. By setting the peel strength of the metal foil and the plate-like carrier in such a range, it can be easily peeled off manually, while being not peeled off during transport or processing.

  In the production process of a multilayer printed wiring board, heat treatment is often performed in a lamination press process or a desmear process. Therefore, the heat history that the metal foil with a carrier receives becomes severer as the number of laminated layers increases. Therefore, when considering application to a multilayer printed wiring board in particular, it is desirable that the peel strength between the metal foil and the plate-like carrier is in the above-described range even after passing through a required thermal history.

  Accordingly, in a further preferred embodiment of the present invention, the metal after assuming at least one of heating for 3 hours, 6 hours or 9 hours at 220 ° C., assuming heating conditions in the production process of the multilayer printed wiring board. The peel strength between the foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, and even more preferably 50 gf / cm or more, but 200 gf / cm or less. It is preferably 150 gf / cm or less, more preferably 80 gf / cm or less.

  Regarding the peel strength after heating at 220 ° C., the peel strength was described above in both 3 hours and 6 hours, or both 6 hours and 9 hours from the viewpoint of being able to cope with various lamination numbers. It is preferable to satisfy the range, and it is further preferable that all peel strengths after 3 hours, 6 hours, and 9 hours satisfy the above-described range.

  In this invention, peel strength is measured based on the 90 degree peel strength measuring method prescribed | regulated to JISC6481.

  Hereinafter, specific constituent requirements of each material for realizing such peel strength will be described.

The resin that serves as the plate-like carrier is not particularly limited, and phenol resin, polyimide resin, epoxy resin, natural rubber, pine resin, and the like can be used, but a thermosetting resin is preferable. A prepreg can also be used. The prepreg before being bonded to the metal foil is preferably in a B-stage state. The linear expansion coefficient of the prepreg (C stage) is 12 to 18 (× 10 ⁻⁶ / ° C.), 16.5 (× 10 ⁻⁶ / ° C.) of the copper foil as the constituent material of the substrate, or 17 of the SUS press plate .3 (× 10 ⁻⁶ / ° C.) is advantageous in that it is difficult to cause circuit misalignment due to a phenomenon (scaling change) in which the substrate size before and after pressing differs from that at the time of design. Furthermore, as a synergistic effect of these merits, it becomes possible to produce a multilayer ultra-thin coreless substrate. The prepreg used here may be the same as or different from the prepreg constituting the circuit board.

  The plate-like carrier preferably has a high glass transition temperature Tg from the viewpoint of maintaining the peel strength after heating in an optimal range, for example, a glass transition temperature Tg of 120 to 320 ° C, preferably 170 to 240 ° C. . The glass transition temperature Tg is a value measured by DSC (differential scanning calorimetry).

  The thermal expansion coefficient of the resin is preferably within + 10% and −30% of the thermal expansion coefficient of the metal foil. As a result, it is possible to effectively prevent circuit misalignment due to the difference in thermal expansion between the metal foil and the resin, thereby reducing the occurrence of defective products and improving the yield.

  The thickness of the plate-like carrier is not particularly limited and may be rigid or flexible. However, if it is too thick, it will adversely affect the heat distribution during hot pressing, while if it is too thin, it will bend and will not flow through the printed wiring board manufacturing process. Therefore, it is usually 5 μm or more and 1000 μm or less, preferably 50 μm or more and 900 μm or less, and more preferably 100 μm or more and 400 μm or less.

  As the metal foil, copper or copper alloy foil is typical, but foils of aluminum, nickel, zinc and the like can also be used. In the case of copper or copper alloy foil, electrolytic foil or rolled foil can be used. Although not limited, the metal foil generally has a thickness of 1 μm or more, preferably 5 μm or more, and 400 μm or less, preferably 120 μm or less, considering use as a wiring of a printed circuit board. When metal foil is affixed on both surfaces of the plate-like carrier, metal foils having the same thickness may be used, or metal foils having different thicknesses may be used.

  Various surface treatments may be applied to the metal foil used. For example, metal plating for the purpose of imparting heat resistance (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating, Co-Ni alloy plating, etc. ), Chromate treatment (including the case where one or more alloy elements such as Zn, P, Ni, Mo, Zr, Ti, etc. are contained in the chromate treatment liquid) for imparting rust prevention and discoloration resistance, surface roughness Roughening treatment for adjusting the degree (eg: copper electrodeposited grains, Cu—Ni—Co alloy plating, Cu—Ni—P alloy plating, Cu—Co alloy plating, Cu—Ni alloy plating, Cu—Co alloy plating, And Cu-As alloy plating, Cu-As-W alloy plating and other copper alloy plating). The roughening treatment not only affects the peel strength between the metal foil and the plate carrier, but also the chromate treatment has a great influence. Chromate treatment is important from the viewpoint of rust prevention and discoloration resistance, but since it tends to significantly increase the peel strength, it is also meaningful as a means for adjusting the peel strength.

  In conventional CCL, since it is desired that the peel strength between the resin and the copper foil is high, for example, the matte surface (M surface) of the electrolytic copper foil is used as an adhesive surface with the resin, and surface treatment such as roughening treatment is performed. Thus, the adhesive strength is improved by the chemical and physical anchoring effects. On the resin side, various binders are added to increase the adhesive strength with the metal foil. As described above, in the present invention, unlike the CCL, since the metal foil and the resin need to be finally peeled, it is disadvantageous that the peel strength is excessively high.

  Therefore, in a preferred embodiment of the metal foil with a carrier according to the present invention, the surface roughness of the bonded surface is JIS B 0601: in order to adjust the peel strength between the metal foil and the plate-like carrier to the preferred range described above. Expressed by the ten-point average roughness (Rz jis) of the metal foil surface measured according to 2001, it is preferably 3.5 μm or less, and more preferably 3.0 μm or less. However, reducing the surface roughness indefinitely takes time and increases costs, so it is preferably 0.1 μm or more, and more preferably 0.3 μm or more. When electrolytic copper foil is used as the metal foil, it is possible to use either a glossy surface (shiny surface, S surface) or a rough surface (matte surface, M surface) by adjusting to such a surface roughness. However, it is easier to adjust the surface roughness by using the S-plane. On the other hand, it is preferable that the ten-point average roughness (Rz jis) of the surface of the metal foil not contacting the carrier is 0.4 μm or more and 10.0 μm or less.

  Moreover, in preferable one Embodiment of metal foil with a carrier which concerns on this invention, surface treatment for peeling strength improvement, such as a roughening process, is not performed with respect to the bonding surface with resin of metal foil. Moreover, in preferable one Embodiment of metal foil with a carrier which concerns on this invention, the binder for improving the adhesive force with metal foil is not added in resin.

  The peel strength is adjusted by using a silane compound represented by the following formula, or a hydrolysis product thereof, or a condensate of the hydrolysis product (hereinafter simply referred to as a silane compound) alone or in combination. Also good. This is because by sticking the plate-like carrier and the metal foil together using the silane compound, the adhesiveness is appropriately lowered and the peel strength can be easily adjusted to the above-described range.

formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)

  The silane compound needs to have at least one alkoxy group. A hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group in the absence of an alkoxy group, or any one of these hydrocarbons in which one or more hydrogen atoms are substituted with a halogen atom When a substituent is comprised only by group, there exists a tendency for the adhesiveness of a plate-shaped carrier and metal foil surface to fall too much. The silane compound is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group, or any one of these hydrocarbon groups in which one or more hydrogen atoms are substituted with a halogen atom. It is necessary to have at least one. This is because when the hydrocarbon group does not exist, the adhesion between the plate-like carrier and the metal foil surface tends to increase. The alkoxy group according to the present invention includes an alkoxy group in which one or more hydrogen atoms are substituted with halogen atoms.

In adjusting the peel strength between the plate-like carrier and the metal foil to the above-mentioned range, the silane compound has three alkoxy groups and the hydrocarbon group (a hydrocarbon group in which one or more hydrogen atoms are substituted with a halogen atom). It is preferable to have one). In terms of the above formula, both R ³ and R ⁴ are alkoxy groups.

Examples of the alkoxy group include, but are not limited to, methoxy group, ethoxy group, n- or iso-propoxy group, n-, iso- or tert-butoxy group, n-, iso- or neo-pentoxy group, n-hexoxy. Group, cyclohexyloxy group, n-heptoxy group, n-octoxy group, etc., linear, branched, or cyclic carbon number of 1 to 20, preferably 1 to 10, more preferably 1 to 5 alkoxy groups.
Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

  Examples of the alkyl group include, but are not limited to, methyl group, ethyl group, n- or iso-propyl group, n-, iso- or tert-butyl group, n-, iso- or neo-pentyl group, and n-hexyl. A linear or branched alkyl group having 1 to 20, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as a group, an n-octyl group, and an n-decyl group.

  Examples of the cycloalkyl group include, but are not limited to, cyclopropyl groups, cyclobutyl groups, cyclopentyl groups, cyclohexyl groups, cycloheptyl groups, cyclooctyl groups, and the like. An alkyl group is mentioned.

  As the aryl group, a phenyl group substituted with an alkyl group (eg, tolyl group, xylyl group), 1- or 2-naphthyl group, anthryl group, etc., having 6 to 20, preferably 6 to 14 carbon atoms. An aryl group is mentioned.

  In these hydrocarbon groups, one or more hydrogen atoms may be substituted with a halogen atom, and may be substituted with, for example, a fluorine atom, a chlorine atom, or a bromine atom.

  Examples of preferred silane compounds include methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo-pentyl. Trimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, phenyltrimethoxysilane; alkyl-substituted phenyltrimethoxysilane (eg, p- (methyl) phenyltrimethoxysilane), methyltriethoxysilane, ethyl Triethoxysilane, n- or iso-propyltriethoxysilane, n-, iso- or tert-butyltriethoxysilane, pentyltriethoxysilane, hexyltriethoxysilane, octyltriethoxy Lan, decyltriethoxysilane, phenyltriethoxysilane, alkyl-substituted phenyltriethoxysilane (eg, p- (methyl) phenyltriethoxysilane), (3,3,3-trifluoropropyl) trimethoxysilane, and trideca Fluorooctyltriethoxysilane, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, phenyltrichlorosilane, trimethylfluorosilane, dimethyldibromosilane, diphenyldibromosilane, their hydrolysis products, and condensates of these hydrolysis products Etc. Among these, propyltrimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane, and decyltrimethoxysilane are preferable from the viewpoint of availability.

  The metal foil with a carrier can be produced by bringing a plate-like carrier and the metal foil into close contact with each other by hot pressing. For example, after applying the silane compound to the bonding surface of the metal foil and / or the plate-like carrier as necessary, the B-stage resin plate-like carrier is hot to the bonding surface of the metal foil. It can be manufactured by press lamination.

  The silane compound can be used in the form of an aqueous solution. Alcohols such as methanol and ethanol can be added in order to increase the solubility in water. The addition of alcohol is particularly effective when a highly hydrophobic silane compound is used. By stirring the aqueous solution of the silane compound, hydrolysis of the alkoxy group is promoted, and when the stirring time is long, condensation of the hydrolysis product is promoted. In general, the peel strength between the metal foil and the plate carrier tends to decrease when a silane compound that has undergone hydrolysis and condensation after a sufficient stirring time has been used. Therefore, the peel strength can be adjusted by adjusting the stirring time. Although it is not limited, the stirring time after the silane compound is dissolved in water can be, for example, 1 to 100 hours, and typically 1 to 30 hours. Of course, there is a method of using without stirring.

  The higher the concentration of the silane compound in the aqueous solution of the silane compound, the lower the peel strength between the metal foil and the plate carrier, and the peel strength can be adjusted by adjusting the concentration of the silane compound. Although it is not limited, the density | concentration in the aqueous solution of a silane compound can be 0.01-10.0 volume%, and can be 0.1-5.0 volume% typically.

  The pH of the aqueous solution of the silane compound is not particularly limited and can be used on either the acidic side or the alkaline side. For example, it can be used at a pH in the range of 3.0 to 10.0. From the standpoint that no special pH adjustment is necessary, it is preferable to set the pH in the range of 5.0 to 9.0, which is near neutral, and more preferable to set the pH in the range of 7.0 to 9.0. .

As conditions for hot pressing, when a prepreg is used as a plate-like carrier, it is preferable to perform hot pressing at a pressure of 30 to 40 kg / cm ² and a temperature higher than the glass transition temperature of the prepreg.

<Process 2>
When manufacturing a buildup substrate, in step 2, buildup layers are formed on both surfaces of the metal foil with a carrier in the following procedure to obtain a buildup substrate.
That is, a resin is laminated on each of the metal foil sides on both sides of the metal foil with a carrier described above, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resin plate carrier and the carrier A metal foil with a carrier consisting of a metal foil that is peelably adhered to one side or both sides, or a metal foil is laminated one or more times, for example, 1 to 10 times. In addition, the metal foil with a carrier composed of a resin-made plate carrier and a metal foil that is peelably adhered to one or both surfaces of the carrier is the metal foil with a carrier described above. In addition to the closely attached metal foil with a carrier, this also includes a metal carrier that is adhered to only one side of a plate-like carrier.

  Alternatively, one or more build-up wiring layers are laminated on each of the metal foil sides on both sides of the metal foil with carrier described above. At this time, the build-up wiring layer can be formed using at least one of a subtractive method, a full additive method, and a semi-additive method.

  The subtractive method is a method of forming a conductor pattern by selectively removing unnecessary portions of metal foil on a metal-clad laminate or a wiring board (including a printed wiring board and a printed circuit board) by etching or the like. Point to. The full additive method is a method of forming a conductor pattern by electroless plating and / or electrolytic plating without using a metal foil for the conductor layer. The semi-additive method is an electroless method on a seed layer made of metal foil, for example. In this method, a conductor pattern is formed by using metal deposition and electrolytic plating, etching, or a combination thereof, and then an unnecessary seed layer is removed by etching.

  Furthermore, a hole is made in a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, a metal foil with a carrier, a plate-like carrier with a metal foil with a carrier, or a resin laminated by the above-described procedure. A step of conducting conductive plating on the side surface and the bottom surface. In addition, the step of forming wiring on at least one of the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal-clad laminate, and the metal foil constituting the metal foil with carrier is performed once. It can further include performing the above.

  Furthermore, it is possible to include a step of laminating a resin on the surface on which the wiring is formed and laminating the above-described metal foil with a carrier in which the metal foil is adhered to both surfaces of the resin.

  More specifically, at least one buildup layer 16 having an insulating layer 17 and a wiring pattern 18 is laminated on both sides of the metal foil with carrier 11. By alternately laminating the insulating layers 17 and the wiring patterns 18 a plurality of times, the build-up layers 16 having an arbitrary number of layers can be formed. The electrical connection between the metal foil 11a and the buildup layer 16 can be ensured by appropriately providing a via hole (not shown) penetrating the insulating layer 17 up and down. Such a build-up layer 16 may be formed by a known subtractive method, full additive method, and semi-additive method. FIG. 3 schematically shows an example of the multilayer laminate after the buildup layer 16 is formed in this manner.

  Furthermore, the buildup layer 16 is formed as follows. First, the resin sheet and metal foil which become the insulating layer 17 are affixed on both surfaces of the metal foil 11 with a carrier. This resin sheet is formed of a modified epoxy resin sheet, a polyphenylene ether resin sheet, a polyimide resin sheet, a cyanoester resin sheet, or the like. The thickness can generally be 20-80 μm. An inorganic filler may be dispersed in this resin sheet. As the metal foil, a copper foil having a thickness of 1 to 400 μm, preferably 1 to 70 μm can be used.

  Next, a through hole or a non-through via hole is formed on the surface of the attached metal foil by using a UV laser, a carbon dioxide laser, a YAG laser, an excimer laser, or the like. Subsequently, electroless copper plating is performed, a resist is formed on the electroless copper plating layer, exposed and developed, and then the electroless copper plating is applied to the non-resist forming portion, and then the resist is peeled off. The wiring pattern 18 is formed by etching the existing electroless copper plating. The conductor layer inside the through hole becomes a via hole. By repeating this procedure, the build-up layer can be multi-layered.

  Or you may include the process of half-etching the whole surface of metal foil and adjusting thickness as needed. Next, laser processing is performed at a predetermined position of the laminated metal foil to form a via hole penetrating the metal foil and the resin, and after applying a desmear process for removing smear in the via hole, the bottom of the via hole, the side surface and the metal foil Electroless plating is performed on the entire surface or a part of the substrate to form an interlayer connection, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each portion of the metal foil where electroless plating or electrolytic plating is unnecessary before performing each plating. In addition, when the electroless plating, the electrolytic plating, or the adhesion between the plating resist and the metal foil is insufficient, the surface of the metal foil may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, a circuit is formed by removing unnecessary portions of the metal foil and the electroless plating portion and the electrolytic plating portion by etching. Thereby, a build-up layer is formed. The steps from the lamination of the resin and the copper foil to the circuit formation may be repeated a plurality of times to form a multilayer build-up substrate.

  Further, on the outermost surface of the build-up layer, after laminating a resin plate once, one metal foil of the above-mentioned metal foil with a carrier in which the metal foil is adhered to both surfaces may be contacted and laminated.

As another method, a resin as an insulating layer such as a prepreg or a photosensitive resin is applied to the exposed surface of a metal foil of a laminate obtained by laminating a metal foil, such as a copper foil, on both sides of the plate carrier. Laminate. Thereafter, a via hole is formed at a predetermined position of the resin. For example, when a prepreg is used as the resin, the via hole can be formed by laser processing. After the laser processing, desmear treatment for removing smear in the via hole is preferably performed. When a photosensitive resin is used as the resin, the resin in the via hole forming portion can be removed by a photolithography method. Next, electroless plating is performed on the bottom and side surfaces of the via holes, the entire surface or a part of the resin to form interlayer connections, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance on each portion of the resin where electroless plating or electrolytic plating is unnecessary before performing each plating. Further, when the adhesion between electroless plating, electrolytic plating, plating resist and resin is insufficient, the surface of the resin may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, an unnecessary portion of the electroless plating portion or the electrolytic plating portion is removed by etching to form a circuit. Thereby, a build-up layer is formed. The steps from resin lamination to circuit formation may be repeated a plurality of times to form a multilayered build-up substrate.
Further, on the outermost surface of the build-up substrate, after the resin is once laminated, one metal foil of the above-described metal foil with a carrier having the metal foil adhered to both surfaces may be brought into contact with each other and laminated.

  In addition, when forming a buildup layer, each layer can be laminated | stacked by performing thermocompression bonding. This thermocompression bonding may be performed every time one layer is stacked, may be performed after being laminated to some extent, or may be performed collectively at the end.

When a multilayer metal-clad laminate is manufactured, in step 2, a resin layer and a metal foil layer are laminated on both surfaces of the metal foil with a carrier in the following procedure to obtain a multilayer metal-clad laminate.
That is, resin is laminated | stacked with respect to the metal foil side of both surfaces of the metal foil with a carrier mentioned above, and then resin or metal foil is laminated | stacked repeatedly 1 times or more, for example 1-10 times.

  Alternatively, a resin is laminated on both sides of the metal foil with carrier described above, and then the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil is once or more, for example, 1 to 10 times. Laminate repeatedly.

<Steps 3 and 4>
The build-up substrate obtained in step 2 is further subjected to step 3 (peeling) and step 4 (etching) as necessary to obtain a build-up wiring board.
In step 3, the plate-like carrier 11c of the metal foil with carrier 11 and the metal foils 11a on both sides are separated and separated to obtain a build-up wiring board or a multilayer metal-clad laminate having a metal foil on the outermost surface. This process can be performed before or after the build-up layer 16 is completed when manufacturing the build-up wiring board, but is usually performed after forming the wiring pattern 18 on the surface layer of the multilayer laminated board. It is preferable in terms of work efficiency. Further, in any of the build-up wiring board and the multilayer metal-clad laminate, a solder resist can be applied to the surface layer as necessary, but this may be performed at any stage before and after peeling.

  In step 4, after separating and separating the plate-like carrier 11c and the metal foil 11a of the metal foil with carrier 11, a part of the surface of the metal foil 11a exposed by the peeling is etched to appropriately perform wiring formation, It is good also as a buildup wiring board. Moreover, when the wiring pattern of the peeling surface of the metal foil 11a is unnecessary in the configuration of the multilayer printed wiring board, the entire surface of the metal foil 11a can be removed by etching. Or when manufacturing a multilayer metal-clad laminate, the multilayer metal-clad laminate from which at least one part or all metal foil was removed from the outermost surface is obtained.

  Furthermore, the printed circuit board is completed by mounting electronic components on the build-up board obtained in step 2 or the build-up wiring board obtained through step 3 or step 4.

  In the method for producing a multilayer printed wiring board according to the present invention, since the carrier in the metal foil with the carrier that is finally removed plays a role of ensuring mechanical strength, the coreless multilayer printed wiring board can be manufactured in large quantities with stable quality. This is advantageous in terms of manufacturing. In addition, after peeling the metal foil from the plate-like carrier, the wiring pattern is formed once on the peeling surface of the metal foil, so that it is not necessary to perform the etching process on the metal foil multiple times. The number of processes can be reduced.

  Examples of the present invention will be described below together with comparative examples, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.

(Metal foil with carrier)
<Experimental example 1>
A plurality of electrolytic copper foils (thickness 12 μm) were prepared, and nickel-zinc (Ni—Zn) alloy plating treatment and chromate (Cr—Zn) were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions. (Chromate) treatment, the ten-point average roughness (measured in accordance with JIS B 0601: 2001) of the bonded surface (here, S surface) is 1.5 μm, and the resin is Mitsubishi Gas Chemical Co., Ltd. A company-prepared prepreg (BT resin) was bonded to the S surface of the electrolytic copper foil and hot-pressed at 190 ° C. for 100 minutes to prepare a copper foil with a carrier.

(Nickel-zinc alloy plating)
Ni concentration 17g / L (added as NiSO ₄ )
Zn concentration 4g / L (added as ZnSO ₄ )
pH 3.1
Liquid temperature 40 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

(Chromate treatment)
Cr concentration 1.4g / L (added as CrO ₃ or K ₂ CrO ₇ )
Zn concentration 0.01 to 1.0 g / L (added as ZnSO ₄ )
Na ₂ SO ₄ concentration 10 g / L
pH 4.8
Liquid temperature 55 ℃
Current density 0.1-10A / dm ²
Plating time 0.1 to 10 seconds

  For some electrolytic copper foils, an aqueous solution of a silane compound is applied to the S surface using a spray coater, and then the copper foil surface is dried in air at 100 ° C., and then bonded to a prepreg. went. Regarding the use conditions of the silane compound, Table 1 shows the type of silane compound, the stirring time from when the silane compound is dissolved in water to before application, the concentration of the silane compound in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution. Show.

  Further, some of the copper foil with carrier has a heat history during further heat treatment such as hot pressing when a build-up layer is provided on the copper foil with carrier and subsequent circuit formation. Assuming this, heat treatment was performed under the conditions shown in Table 1 (here, 220 ° C. for 3 hours).

  The peel strength between the copper foil and the plate-like carrier (resin after heating) in the copper foil with carrier obtained by hot pressing and the copper foil with carrier after further heat treatment was measured. The results are shown in Table 1.

  Moreover, in order to evaluate peeling workability | operativity, the work time (time / piece) by the unit number per unit was evaluated. The results are shown in Table 2.

<Experimental Examples 2-18>
Copper foil with a carrier shown in Table 1 was prepared in the same procedure as in Experimental Example 1 using a silane compound as a copper foil and a resin (prepreg). In some experimental examples, heat treatment under the conditions shown in Table 1 was further performed. Each was evaluated in the same way as in Experimental Example 1. The results are shown in Tables 1 and 2.

  The type of copper foil bonding surface, surface treatment conditions and surface roughness Rz jis, silane compound usage conditions, prepreg type, and copper foil and prepreg lamination conditions are as shown in Table 1. is there.

  In the surface treatment conditions of the treated surface of the copper foil, specific conditions for epoxysilane (treatment) and roughening treatment are as follows.

(Epoxysilane treatment)
Treatment liquid: 0.9 volume% aqueous solution of 3-glycidoxypropyltrimethoxysilane
pH 5.0-9.0
Stirred at room temperature for 12 hours Treatment method: After applying the treatment liquid using a spray coater, the treated surface is dried in air at 100 ° C. for 5 minutes.

(Roughening treatment)
Cu concentration 20 g / L (added as CuSO ₄ )
H ₂ SO ₄ concentration 50-100g / L
As concentration 0.01-2.0 g / L (added as arsenous acid)
Liquid temperature 40 ℃
Current density 40-100A / dm ²
Plating time 0.1-30 seconds

<Experimental Examples 19-20>
A copper foil with a carrier shown in Table 3 was prepared in the same procedure as in Experimental Example 1 using a silane compound as a copper foil and a resin (prepreg). Further, heat treatment was performed under the conditions shown in Table 3. Evaluation similar to Experimental example 1 was performed about the copper foil with a carrier obtained in this way. The results are shown in Tables 3 and 4.

  In addition, the S surface was used as the bonding surface of the copper foil, and the surface was chromated under the conditions described above. In addition, the surface roughness Rz cis of the copper foil, the type of prepreg, the use conditions of the silane compound for the surface treatment of the prepreg, and the lamination conditions of the copper foil and the prepreg are as shown in Table 3.

  According to the table, even if the silane compound is treated on the surface of the copper foil or on the surface of the prepreg, the peel strength of the laminated body, the peel strength after heating, and the workability of peeling are equivalent. It turns out that the result was obtained.

(Build-up wiring board)
FR-4 prepreg (manufactured by Nanya Plastic Co., Ltd.) and copper foil (manufactured by JX Nippon Mining & Metals Co., Ltd., JTC 12 μm (product name)) are sequentially stacked on both sides of the copper foil with carrier thus produced. A four-layer copper clad laminate was produced by hot pressing under the heating conditions shown in each table under the pressure of.

  Next, a 100 μm diameter hole penetrating the copper foil on the surface of the four-layer copper-clad laminate and the insulating layer (cured prepreg) thereunder was drilled using a laser processing machine. Subsequently, electroless copper plating on the copper foil surface on the copper foil with carrier exposed at the bottom of the hole, the side surface of the hole, and the copper foil on the surface of the four-layer copper-clad laminate, and copper plating by electrolytic copper plating The electrical connection was formed between the copper foil on the copper foil with a carrier and the copper foil on the surface of the four-layer copper-clad laminate. Next, a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer buildup substrate was obtained.

  Subsequently, in the four-layer build-up substrate, the two-layer build-up wiring boards were obtained by peeling and separating the plate-like carrier of the copper foil with carrier and the copper foil.

  Subsequently, the copper foil that was in close contact with the plate-like carrier on the two sets of two-layer build-up wiring boards was etched to form a wiring to obtain two sets of two-layer build-up wiring boards. .

In each experimental example, a plurality of four-layer build-up substrates were prepared, and for each, the degree of adhesion between the prepreg and the copper foil constituting the copper foil with carrier in the build-up substrate manufacturing process was confirmed visually. In the build-up wiring board using the copper foil with a carrier produced under the conditions where the peel strength and the peel strength after heating are evaluated as “S” and “G” in Table 3, the resin of the copper foil with the carrier at the time of build-up The (plate-like carrier) could be peeled without being destroyed. However, with respect to the conditions evaluated as “G”, as described in Tables 1 and 3, there were some cases where the copper foil was peeled off from the plate-shaped carrier without a peeling operation during build-up.
As for the condition evaluated as “N”, the resin was destroyed at the time of build-up during the peeling operation of the copper foil in the carrier-attached copper foil, or the resin remained on the copper foil surface without being peeled off.
In addition, regarding the conditions evaluated as “−”, the resin was peeled off without being broken during the copper foil peeling operation in the copper foil with a carrier during build-up, but the copper foil was peeled off without any peeling operation. Sometimes peeled off.

11 Metal foil 11a with carrier 11a Metal foil 11b Silane compound 11c Plate carrier 16 Build-up layer 17 Insulating layer 18 Wiring pattern

Claims (39)

Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier;
And laminating at least one build-up layer having an insulating layer and a wiring pattern on both sides of the metal foil with a carrier, and
The ten-point average roughness (Rz jis) of the surface of the metal foil that does not contact the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and any one of the following (A) to (C) A method for manufacturing a build-up board that satisfies the above requirements.
(A) The peel strength measured according to the 90-degree peel strength measurement method prescribed in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 80 gf / cm or less. The metal foil with carrier is not a metal foil with carrier having a bonding interface layer composed of a metal layer / pure carbon layer. (B) The metal foil with carrier is at least one of 220 ° C. for 3 hours, 6 hours or 9 hours. The peeling strength measured according to the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after one heating is 10 gf / cm or more and 200 gf / cm or less (C) The plate-like carrier and metal foil constituting the metal foil with carrier are represented by the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. Step 1 of preparing a metal foil with a carrier comprising a resin-made plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier;
And laminating at least one build-up layer having an insulating layer and a wiring pattern on both sides of the metal foil with carrier,
The ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and one of the following (B) or (C) A method for manufacturing a build-up board that satisfies the above requirements.
(B) 90 degree peeling strength measurement prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after the said metal foil with a carrier is at least 1 time of heating for 3 hours, 6 hours, or 9 hours at 220 degreeC. The peel strength measured according to the method is 10 gf / cm or more and 200 gf / cm or less. (C) The plate-like carrier and the metal foil constituting the metal foil with a carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. The peel strength measured according to the 90-degree peel strength measurement method defined in JIS C6481 for the plate-like carrier and the metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the buildup board | substrate as described in 2.   The manufacturing method of the buildup board | substrate as described in any one of Claims 1-3 including the process of forming one or more buildup wiring layers in the said process 2 on both surfaces of the said metal foil with a carrier.   The buildup wiring board manufacturing method according to claim 4, wherein the buildup wiring layer is formed by using at least one of a subtractive method, a full additive method, and a semiadditive method.   In the step 2, a resin is laminated on both surfaces of the metal foil with a carrier, and then a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal-clad laminate, or a resinous plate-like carrier and one or both sides of the carrier The manufacturing method of the buildup board | substrate as described in any one of Claims 1-5 including repeating and laminating | stacking the metal foil with a carrier which consists of the metal foil closely_contact | adhered so that peeling is possible, or metal foil once or more.   In the manufacturing method of the buildup board | substrate of Claim 6, a hole is provided in the single-sided or double-sided wiring board, the single-sided or double-sided metal-clad laminate, the metal foil of the metal foil with carrier, the plate-like carrier of the metal foil with carrier, or the resin. A method for manufacturing a build-up substrate, further comprising the steps of opening and conducting conductive plating on the side surface and bottom surface of the hole.   In the manufacturing method of the buildup board | substrate of Claim 6 or 7, The metal foil which comprises the said single-sided or double-sided wiring board, the metal foil which comprises a single-sided or double-sided metal-clad laminate, and the metal which comprises a metal foil with a carrier A method for manufacturing a build-up substrate, further comprising performing the step of forming a wiring on at least one of the foils once or more.   The build according to any one of claims 4 to 8, further comprising a step of laminating a resin on a surface on which wiring is formed and laminating a metal foil with a carrier in which a metal foil is adhered to both surfaces of the resin. Method for manufacturing an up board.   The manufacturing method of the buildup board | substrate as described in any one of Claims 1-9 in which the resin-made plate-shaped carrier contains a thermosetting resin.   The manufacturing method of the buildup board | substrate as described in any one of Claims 1-10 whose resin-made plate-shaped carrier is a prepreg.   The metal foil which comprises the said metal foil with a carrier is a copper foil or a copper alloy foil, The manufacturing method of the buildup board | substrate as described in any one of Claims 1-11.   The manufacturing method as described in any one of Claims 1-12 WHEREIN: Furthermore, the manufacturing method of a buildup wiring board including the process 3 which peels and isolate | separates the metal foil of both surfaces from the said metal foil with a carrier.   Furthermore, the manufacturing method of the buildup wiring board of Claim 13 including the process 4 which removes the whole surface of the metal foil exposed at the said process 3, or etches a part of surface, and forms a wiring pattern. .   The method for manufacturing a build-up wiring board according to claim 14, wherein in step 4, a part of the surface of the metal foil exposed by peeling is etched to form a wiring pattern. A metal foil with a carrier comprising a resinous plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier, and
A buildup layer having an insulating layer and a wiring pattern laminated at least one layer on each side of the metal foil with a carrier;
The ten-point average roughness (Rz jis) of the surface of the metal foil that does not contact the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and any one of the following (A) to (C) Build-up board that meets the above requirements.
(A) The peel strength measured according to the 90-degree peel strength measurement method prescribed in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 80 gf / cm or less. The metal foil with carrier is not a metal foil with carrier having a bonding interface layer composed of a metal layer / pure carbon layer. (B) The metal foil with carrier is at least one of 220 ° C. for 3 hours, 6 hours or 9 hours. The peeling strength measured according to the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after one heating is 10 gf / cm or more and 200 gf / cm or less (C) Between the plate-like carrier and the metal foil constituting the metal foil with carrier, the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
Or a combination of a hydrolysis product thereof, a condensate of the hydrolysis product, or a combination thereof. A metal foil with a carrier comprising a resinous plate-like carrier and a metal foil that is peelably adhered to both surfaces of the carrier, and
A buildup layer having an insulating layer and a wiring pattern laminated at least one layer on each side of the metal foil with a carrier;
The ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and one of the following (B) or (C) Build-up board that meets the above requirements.
(B) 90 degree peeling strength measurement prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after the said metal foil with a carrier is at least 1 time of heating for 3 hours, 6 hours, or 9 hours at 220 degreeC. The peel strength measured according to the method is 10 gf / cm or more and 200 gf / cm or less. (C) Between the plate-like carrier and the metal foil constituting the metal foil with carrier, the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
Or a combination of a hydrolysis product thereof, a condensate of the hydrolysis product, or a combination thereof. The peel strength measured according to the 90-degree peel strength measurement method specified in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less. Build-up board as described in The buildup substrate according to any one of claims 16 to 18, which is used for manufacturing a coreless multilayer printed wiring board. The buildup substrate according to any one of claims 16 to 19, wherein the resin-made plate-shaped carrier includes a thermosetting resin. The build-up substrate according to any one of claims 16 to 20, wherein the resinous plate-like carrier is a prepreg. The build-up substrate according to any one of claims 16 to 21, wherein the metal foil constituting the metal foil with a carrier is a copper foil or a copper alloy foil.   The manufacturing method of a printed circuit board including the process of manufacturing a buildup board | substrate with the manufacturing method as described in any one of Claims 1-12.   The manufacturing method of a printed circuit board including the process of manufacturing a buildup wiring board with the manufacturing method as described in any one of Claims 13-15. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
A step of laminating a resin on both sides of the metal foil with a carrier, and then laminating the resin or the metal foil repeatedly at least once, and
The ten-point average roughness (Rz jis) of the surface of the metal foil that does not contact the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and any one of the following (A) to (C) A method for producing a multilayer metal-clad laminate satisfying the above.
(A) The peel strength measured according to the 90-degree peel strength measurement method prescribed in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 80 gf / cm or less. The metal foil with carrier is not a metal foil with carrier having a bonding interface layer composed of a metal layer / pure carbon layer. (B) The metal foil with carrier is at least one of 220 ° C. for 3 hours, 6 hours or 9 hours. The peeling strength measured according to the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after one heating is 10 gf / cm or more and 200 gf / cm or less (C) The plate-like carrier and metal foil constituting the metal foil with carrier are represented by the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
Step 2 of laminating a resin on both sides of the metal foil with carrier, and then laminating the resin or metal foil repeatedly one or more times,
The ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and one of the following (B) or (C) A method for producing a multilayer metal-clad laminate satisfying the above.
(B) The metal foil with a carrier is subjected to the 90-degree peel strength measurement method defined in JIS C6481 for a metal foil and a plate-like carrier after heating at 220 ° C. for at least one of 3, 6 or 9 hours. The peel strength measured in conformity is 10 gf / cm or more and 200 gf / cm or less. (C) The plate-like carrier and metal foil constituting the metal foil with carrier are represented by the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. 27. A peel strength measured according to a 90-degree peel strength measurement method defined in JIS C6481 for a plate-like carrier and a metal foil constituting the metal foil with a carrier is 10 gf / cm or more and 200 gf / cm or less. A method for producing a multilayer metal-clad laminate as described in 1.   In the step 2, including laminating a resin on both sides of the metal foil with carrier, and then laminating the resin, single-sided or double-sided metal-clad laminate, metal foil with carrier, or metal foil repeatedly, one or more times, The manufacturing method of the multilayer metal-clad laminate as described in any one of Claims 25-27.   The method for producing a multilayer metal-clad laminate according to any one of claims 25 to 28, wherein the resinous plate-like carrier contains a thermosetting resin.   The method for producing a multilayer metal-clad laminate according to any one of claims 25 to 29, wherein the resin-made plate carrier is a prepreg.   The metal foil which comprises the said metal foil with a carrier is a copper foil or a copper alloy foil, The manufacturing method of the multilayer metal-clad laminate as described in any one of Claims 25-30.   32. The method for producing a multilayer metal-clad laminate according to any one of claims 25 to 31, further comprising a step of peeling and separating the plate-like carrier and metal foil of the metal foil with carrier. A manufacturing method of a board.   33. The method for producing a multilayer metal-clad laminate according to claim 32, comprising a step of removing a part or all of the separated and separated metal foil by etching. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
And step 2 of peeling the metal foil from the metal foil with carrier.
The ten-point average roughness (Rz jis) of the surface of the metal foil that does not contact the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and any one of the following (A) to (C) A method for producing a plate-like carrier that satisfies the above.
(A) The peel strength measured according to the 90-degree peel strength measurement method prescribed in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 80 gf / cm or less. The metal foil with carrier is not a metal foil with carrier having a bonding interface layer composed of a metal layer / pure carbon layer. (B) The metal foil with carrier is at least one of 220 ° C. for 3 hours, 6 hours or 9 hours. The peeling strength measured according to the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after one heating is 10 gf / cm or more and 200 gf / cm or less (C) The plate-like carrier and metal foil constituting the metal foil with carrier are represented by the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
And step 2 of peeling the metal foil from the metal foil with carrier,
The ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and one of the following (B) or (C) A method for producing a plate-like carrier that satisfies the above.
(B) 90 degree peeling strength measurement prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after the said metal foil with a carrier is at least 1 time of heating for 3 hours, 6 hours, or 9 hours at 220 degreeC. The peel strength measured according to the method is 10 gf / cm or more and 200 gf / cm or less. (C) The plate-like carrier and the metal foil constituting the metal foil with a carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. The peel strength measured according to the 90-degree peel strength measurement method specified in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the plate-shaped carrier of description. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
After laminating at least one layer of the build-up layer having an insulating layer and a wiring pattern on both sides of the metal foil with carrier, and including the step 2 of peeling the metal foil from the metal foil with carrier, and
The ten-point average roughness (Rz jis) of the surface of the metal foil that does not contact the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and any one of the following (A) to (C) A method for manufacturing a build-up wiring board that satisfies the above requirements.
(A) The peel strength measured according to the 90-degree peel strength measurement method prescribed in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 80 gf / cm or less. The metal foil with carrier is not a metal foil with carrier having a bonding interface layer composed of a metal layer / pure carbon layer. (B) The metal foil with carrier is at least one of 220 ° C. for 3 hours, 6 hours or 9 hours. The peeling strength measured according to the 90 degree peeling strength measuring method prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after one heating is 10 gf / cm or more and 200 gf / cm or less (C) The plate-like carrier and metal foil constituting the metal foil with carrier are represented by the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. Step 1 of preparing a metal foil with a carrier comprising a resin plate carrier having a thickness of 5 μm or more and a metal foil that is peelably adhered to both surfaces of the carrier;
After laminating at least one layer of the buildup layer having an insulating layer and a wiring pattern on both sides of the metal foil with carrier, including the step 2 of peeling the metal foil from the metal foil with carrier, and
The ten-point average roughness (Rz jis) of the surface of the metal foil that is not in contact with the plate-like carrier is 0.4 μm or more and 10.0 μm or less, and one of the following (B) or (C) A method for manufacturing a build-up wiring board that satisfies the above requirements.
(B) 90 degree peeling strength measurement prescribed | regulated to JIS C6481 about the said metal foil and the said plate-shaped carrier after the said metal foil with a carrier is at least 1 time of heating for 3 hours, 6 hours, or 9 hours at 220 degreeC. The peel strength measured according to the method is 10 gf / cm or more and 200 gf / cm or less. (C) The plate-like carrier and the metal foil constituting the metal foil with a carrier have the following formula:

Wherein R ¹ is an alkoxy group or a halogen atom, and R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or one or more hydrogen atoms are halogen atoms Any one of these hydrocarbon groups substituted by R ³ and R ⁴ are each independently a halogen atom, an alkoxy group, or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group, and an aryl group Or any one of these hydrocarbon groups in which one or more hydrogen atoms are replaced by halogen atoms.)
The silane compound, the hydrolysis product thereof, and the condensate of the hydrolysis product shown in the above are used alone or in combination to be bonded together. The peel strength measured according to the 90-degree peel strength measurement method specified in JIS C6481 for the plate-like carrier and metal foil constituting the metal foil with carrier is 10 gf / cm or more and 200 gf / cm or less. The manufacturing method of the buildup wiring board as described in 2 ..

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