KR20170130640A - Metallic foil having carrier, layered product comprising resin sheet-shaped carrier and metallic foil, and uses for same - Google Patents

Abstract

It is an object of the present invention to provide a metal foil to which a peel strength between a plate-like carrier made of a resin and a metal foil is controlled, and also a carrier corresponding to prevention of peeling of the metal foil from the carrier during transportation or processing A metal foil 120 having a carrier made of a resinous plate-like carrier 121 and a metal foil 122 adhered in peelable contact with at least one surface of the carrier 121, The metal foil 120 is a carrier to which the area of the metal foil 122 is smaller than that of the plate-like carrier 121.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a metal foil having a carrier, a laminated body comprising a resinous plate-like carrier and a metal foil,

The present invention relates to a metal foil to which a carrier is attached. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate composed of a resin-made plate-like carrier and a metal foil adhered to at least one surface of the carrier so as to be easily peelable. More particularly, the present invention relates to a metal foil or a laminate having a carrier used in the production of a single-sided, two-layer or more multi-layer laminate board or an ultra-thin coreless substrate used in a printed wiring board.

Generally, the printed wiring board is made of a dielectric material called " prepreg " obtained by impregnating a substrate such as a synthetic resin plate, a glass plate, a glass nonwoven fabric, or paper with a synthetic resin as a basic constituent material. A sheet such as copper or copper alloy foil having electrical conductivity is bonded to the side opposed to the prepreg. The thus assembled laminate is generally called a CCL (Copper Clad Laminate) material. The surface of the copper foil which is in contact with the prepreg is usually formed as a matte surface in order to increase the bonding strength. Instead of copper or copper alloy foil, foil of aluminum, nickel, zinc or the like may be used. Their thickness is about 5 to 200 mu m. This commonly used CCL (Copper Clad Laminate) material is shown in Fig.

Patent Document 1 proposes a metal foil having a plate-like carrier made of a synthetic resin and a carrier made of a metal foil closely attached to at least one surface of the carrier in a mechanically peelable manner, To be assembled into a single body. The peel strength between the plate-like carrier and the metal foil is preferably from 1 gf / cm to 1 kgf / cm. According to the metal foil to which the carrier is adhered, since the copper foil is supported over the entire surface by the synthetic resin, it is possible to prevent the occurrence of wrinkles in the copper foil during the lamination. Further, in the metal foil with the carrier, since the metal foil and the synthetic resin are in close contact with each other without gap, when the surface of the metal foil is plated or etched, it can be put into the plating solution for etching or etching. Further, since the coefficient of linear expansion of the synthetic resin is at a level equivalent to that of the copper foil as the constituent material of the substrate and the prepreg after polymerization, the positional deviation of the circuit does not occur, so that generation of defective products is reduced, It has an excellent effect.

Japanese Patent Application Laid-Open No. 2009-272589 Japanese Patent Application Laid-Open No. 2000-196207

The metal foil with the carrier described in Patent Document 1 is a revolutionary invention that contributes greatly to the manufacturing cost reduction by simplifying the manufacturing process of the printed circuit board and improving the yield. However, the optimization of the peel strength of the plate- There is room for review. Particularly, a significant problem for the present inventors is that the peel strength between the plate-like carrier and the metal foil becomes too high depending on the material of the plate-like carrier, and it is preferable that means for easily adjusting the peel strength is provided. In addition, the conventional metal foil with a carrier has a problem that the edge portion collides with another member during transportation or during processing (during handling) and the chemical liquid enters the interface between the plate-like carrier and the metal foil The carrier and the metal foil may be peeled off, resulting in defects. There is also a demand for improvement of this. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a metal foil to which a peel strength between a resin-made plate-like carrier and a metal foil is adjusted, and also a carrier corresponding to the prevention of peeling-off of the carrier and the metal foil during handling.

The inventors of the present invention have made intensive investigations on a method of adjusting the peel strength between the resin plate and the metal foil. As a result of intensive investigations on the manner in which the carrier and the metal foil are overlapped before the resin plate and the metal foil are bonded, The metal foil having an area smaller than the area occupied by the carrier is superimposed on one another, so that it is difficult to peel off only by an external force generated by collision of the other members after overlapping.

That is, the present invention is as follows.

(1) A laminate comprising a resin-made plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,

Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil.

(2) The metal foil according to (1), wherein the laminate described in (1) is a metal foil having a plate-like carrier made of resin and a carrier made of a metal foil adhered to at least one surface of the carrier,

Wherein at least a part of at least an end of the plate-like carrier is not covered with the metal foil when viewed from the plane.

(3) The metal foil with a carrier according to (2)

Wherein a whole of at least an end portion of the plate-like carrier is not covered with the metal foil when viewed from a plane.

(4) The metal foil according to (1), wherein the laminate is a resin-made plate-like carrier and a carrier having a carrier made of a metal foil adhered to at least one surface of the carrier,

Wherein the metal foil has an area smaller than an area of the plate-like carrier when viewed in plan.

(5) The metal foil with a carrier according to any one of (2) to (4), wherein the peel strength between the plate-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm.

(6) A metal foil with a carrier according to any one of (2) to (5), wherein the plate-like carrier has a polygonal shape when viewed in a plane.

(7) The metal foil with a carrier according to (6), wherein at least one apex of the plate-like carrier is not covered with the metal foil.

(8) The metal foil with a carrier according to (6) or (7), wherein at least two apexes of the plate-like carrier are not covered with the metal foil.

(9) The metal foil with a carrier according to any one of (6) to (8), wherein all the apexes of the plate-like carrier are not covered with the metal foil.

(10) The metal foil with the carrier according to any one of (2) to (9), wherein the metal foil is polygonal.

(11) When the total length of the edge (rim) of the plate-like carrier is A (mm) and the length of the edge (rim) covered by the metal foil of the plate carrier is B (2) to (10), wherein the ratio (B / A) of the ratio (B / A) is 0 to 0.8.

(12) A metal foil having a resin-made plate-like carrier and a carrier made of a metal foil adhered to at least one surface of the carrier in a peelable manner,

(2) to (11), wherein the metal foil is smaller than the plate-like carrier and at least one pair of opposing sides of the metal foil is 0.1 mm or less in each of both ends compared with the side of the plate- A metal foil having a carrier according to any one of claims 1 to 6.

(13) The carrier according to any one of items (2) to (12), wherein the ratio Sa / Sb of the area Sa of the metal foil to the area Sb of the plate- Metal foil.

(14) The metal foil with a carrier according to any one of (2) to (13), wherein a hole having a diameter of 0.01 mm to 10 mm is formed at 1 to 10 points in a region not covered with the metal foil of the plate-like carrier.

(15) The metal foil with a carrier according to any one of (2) to (14), wherein the resinous sheet-like carrier comprises a thermosetting resin.

(16) The metal foil according to any one of (2) to (15), wherein the resinous plate-like carrier is a prepreg.

(17) The metal foil with a carrier according to (15) or (16), wherein the plate-like carrier has a glass transition temperature Tg of 120 to 320 ° C.

(18) The metal foil according to any one of (2) to (17), wherein a ten-point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is 3.5 m or less.

(19) The metal foil according to any one of (2) to (18), wherein the surface roughness of the surface of the metal foil on the side not in contact with the carrier is in the range of 0.4 탆 to 10.0 탆, .

(20) The metal foil with a carrier according to any one of (2) to (19), wherein the thickness of the metal foil is 1 占 퐉 or more and 400 占 퐉 or less.

(21) The metal foil with a carrier according to any one of (2) to (20), wherein the thickness of the plate-like carrier is not less than 5 占 퐉 and not more than 1000 占 퐉.

(22) The metal foil with a carrier according to any one of (2) to (21), wherein the plate-like carrier and the metal foil are bonded together using a releasing agent.

(23) The mold release agent according to the following formula:

[Chemical Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.

(22), wherein a condensate of a silane compound represented by the general formula (1), a hydrolysis product thereof, and a hydrolysis product thereof is used singly or in combination.

(24) The metal foil with a carrier according to (22), wherein the releasing agent is a compound having two or less mercapto groups in the molecule.

(25) The mold releasing agent according to the following formula:

(2)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)

, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination.

(26) A method for producing a laminate of (2) to (21), wherein the plate-like carrier and the metal foil are laminated using a resin coating film composed of one or more resins selected from silicone, epoxy resin, melamine resin and fluororesin A metal foil having a carrier according to any one of claims 1 to 6.

(27) A steel sheet according to any one of (2) to (26), wherein the peel strength between the metal foil and the plate-like carrier is 10 gf / cm or more and 200 gf / cm or less after heating at 220 ° C for at least 3 hours, 6 hours, A metal foil having a carrier according to any one of claims 1 to 6.

(28) The metal foil according to any one of (2) to (27), wherein the metal foil is a copper foil.

(29) The laminate according to (1), wherein the laminated body is made of a resin-made plate-like carrier and a metal foil which is peelably adhered to at least one surface of the carrier,

Wherein the area of the metal foil is smaller than the area of the plate-like carrier when seen from a plane, and a part or all of the side face of the metal foil is covered with a resin.

(30) The laminate according to (1), wherein the laminate comprises a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,

Wherein a surface of the metal foil is smaller than an area of the plate-like carrier and a part or all of an end surface of the metal foil on the side not in contact with the plate-like carrier is covered with a resin.

(31) A laminate as described in (29) or (30), which is a laminated layer made of a resin plate-like carrier and a metal foil which is peelably adhered to at least one surface of the carrier.

(32) The laminate according to any one of (29) to (31), wherein the peel strength between the plate-like carrier and the metal foil is 10 gf / cm or more and 200 gf / cm or less.

(33) A multilayer body according to any one of (29) to (32), wherein the shape of the plate-like carrier is polygonal.

(34) The laminate according to (33), wherein at least one vertex of the plate-like carrier is not covered with the metal foil.

(35) The laminate according to (33) or (34), wherein at least two vertexes of the plate-like carrier are not covered with the metal foil.

(36) The laminate according to any one of (33) to (35), wherein all the apexes of the plate-like carrier are not covered with the metal foil.

(37) The laminate according to any one of (29) to (36), wherein the metal foil is polygonal.

(38) In the case where the total length of the edge (rim) of the plate-like carrier is A (mm) and the length of the edge (rim) covered by the metal foil of the plate-like carrier is B (29) to (37), wherein the ratio (B / A) of the ratio (B / A) is 0 to 0.8.

(39) A laminate for obtaining a metal plate having a resin-made plate-like carrier and a carrier made of a metal foil adhered to at least one surface of the carrier in a peelable manner,

Wherein the metal foil is smaller than the plate-like carrier, and at least one pair of opposing sides of the metal foil is at least one of (29) to (38) shorter than 0.1 mm in both ends in comparison with the side of the plate- A laminate according to any one of claims 1 to 6.

(29) to (39), wherein the ratio (Sa / Sb) of the area Sa of the metal foil to the area Sb of the plate-like carrier when viewed from the plane of the substrate 40 is 0.7 or more and less than 1.0, .

(41) The laminated body according to any one of (29) to (40), wherein a hole having a diameter of 0.01 mm to 10 mm is formed at 1 to 10 points in a region not covered with the metal foil of the plate-like carrier.

(42) The laminate according to any one of (29) to (41), wherein the resinous plate-like carrier comprises a thermosetting resin.

(43) The laminate according to any one of (29) to (42), wherein the resinous plate-like carrier is a prepreg.

(44) The laminate according to (42) or (43), wherein the plate-like carrier has a glass transition temperature Tg of 120 to 320 캜.

(45) The laminate according to any one of items (29) to (44), wherein a ten-point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is 3.5 m or less.

(46) The laminate according to any one of (29) to (45), wherein the ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 μm or more and 10.0 μm or less.

(47) The laminate according to any one of (29) to (46), wherein the metal foil has a thickness of 1 占 퐉 or more and 400 占 퐉 or less.

(48) The laminate according to any one of (29) to (47), wherein the thickness of the plate-like carrier is 5 占 퐉 or more and 1000 占 퐉 or less.

(49) The laminate according to any one of (29) to (48), wherein the plate-like carrier and the metal foil are laminated using a releasing agent.

(50) The mold release agent according to the following formula:

(3)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.

(49), wherein the silane compound represented by the general formula (1), the hydrolysis product thereof, and the condensation product of the hydrolysis product thereof are used singly or in combination.

(51) The laminate according to (49), wherein the releasing agent is a compound having two or less mercapto groups in the molecule.

(52) The mold release agent according to the following formula:

[Chemical Formula 4]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)

, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination.

(53) A method for manufacturing a semiconductor device, comprising the steps of (29) to (48), wherein the plate-like carrier and the metal foil are laminated using a resin coating film composed of any one or a plurality of resins selected from silicone, epoxy resin, melamine resin and fluororesin A laminate according to any one of claims 1 to 6.

(54) The steel sheet according to any one of (29) to (53), wherein the peel strength between the metal foil and the plate-like carrier is 10 gf / cm or more and 200 gf / cm or less after heating at 220 ° C for at least 3 hours, 6 hours, A laminate according to any one of claims 1 to 6.

(55) The laminate according to any one of (29) to (54), wherein the metal foil is a copper foil.

(56) A metal foil obtained by cutting the laminate described in any one of (29) to (55) on a metal foil of the laminate.

(57) The laminate according to (1), wherein the laminated body is made of a resin-made plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,

At least a part of the portion of the metal foil which is exposed outward than the end portion of the plate-like carrier and which is in contact with the metal foil without being interposed by the plate-shaped carrier is welded or adhered / RTI >

(58) The laminate according to (1), which is a laminate comprising a resin-made plate-like carrier and a metal foil peelably adhered to two faces of the carrier,

Wherein a laminated surface of the plate-like carriers is covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and a part of a portion where the metal foils contact each other without interposing the plate-shaped carrier is welded or bonded.

(59) The laminate according to (1), wherein the laminate is a laminate comprising a resin-made plate-like carrier and a metal foil peelably adhered to two faces of the carrier,

Wherein the laminated surfaces of the plate-like carriers are covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and outer circumferential portions of the metal foils are welded or bonded to each other over the entire circumference.

(60) The laminate according to (1), wherein the laminate is a resin laminate comprising a plate-like carrier made of resin and a metal foil peelably adhered to two surfaces of the carrier,

Wherein the laminated surface of the plate-shaped carriers is covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and the portions where the metal foils contact each other without interposing the plate-shaped carrier are welded or bonded over the entire surface.

(61) A laminate according to any one of (57) to (60), wherein the peel strength between the plate-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm.

(62) The laminate according to (1), wherein the laminate is a laminate comprising a resin-made plate-like carrier and a metal foil which is peelably adhered to two surfaces of the carrier,

The metal foil is laminated on the plate-like carrier so that there is a portion where the metal foils contact with each other without interposing the plate-like carrier on the outside of the plate-like carrier when viewed from the plane, Is welded or bonded.

(63) The laminate according to (1), wherein the laminated body is made of a resin-made plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,

The metal foil is laminated on the plate-like carrier so that there is a portion where the metal foils contact with each other without interposing the plate-like carrier when viewed from the plane, and the portion where the metal foils contact with each other without interposing the plate- And the laminated body is welded or bonded over the face.

(64) The laminate according to (62) or (63), wherein the peel strength between the plate-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm.

(57) to (64), wherein the ratio (Sb / Sa) of the area (Sa) of the metal foil to the area (Sb) of the plate-like carrier when viewed from the plane (65) .

(66) The method of (57), wherein the ratio (Sp / Sq) of the area (Sp) of the two metal foils welded or bonded to the area (Sq) of the metal foil containing the welded or bonded surface is 0.001 or more and 0.2 or less, To (65).

(67) The laminate according to any one of (57) to (66), wherein the resinous plate-like carrier comprises a thermosetting resin.

(68) The laminate according to any one of (57) to (67), wherein the resinous plate-like carrier is a prepreg.

(69) The laminate according to (67) or (68), wherein the plate-like carrier has a glass transition temperature Tg of 120 to 320 캜.

(70) The laminate according to any one of (57) to (69), wherein a ten-point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is 3.5 m or less.

(71) The laminate described in any one of (57) to (70), wherein the ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less.

(72) The laminate described in any one of (57) to (71), wherein the metal foil has a thickness of 1 占 퐉 or more and 400 占 퐉 or less.

(73) The laminate described in any one of (57) to (72), wherein the thickness of the plate-like carrier is not less than 5 占 퐉 and not more than 1000 占 퐉.

(74) The laminate described in any one of (57) to (73), wherein the metal foil has a diameter (diameter) in a portion contacting the plate- A laminate formed with 1 to 10 holes of 0.01 mm to 10 mm.

(75) A laminate according to any one of (57) to (74), wherein the plate-like carrier and the metal foil are laminated using a releasing agent.

(76) The mold release agent according to the following formula:

[Chemical Formula 5]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.

(75), wherein the silane compound represented by the general formula (1), the hydrolysis product thereof, and the condensation product of the hydrolysis product thereof are used singly or in combination.

(77) The laminate according to (75), wherein the releasing agent is a compound having two or less mercapto groups in the molecule.

(78) The mold release agent according to the following formula:

[Chemical Formula 6]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)

, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination.

(79) A laminate film as described in any one of (57) to (74), wherein the plate-like carrier and the metal foil are laminated using a resin coating film composed of any one or a plurality of resins selected from silicon, epoxy resin, melamine resin and fluororesin A laminate according to any one of claims 1 to 6.

(80) A steel sheet as set forth in any one of (57) to (79), wherein the peel strength between the metal foil and the plate-like carrier is not less than 10 gf / cm and not more than 200 gf / cm after heating at 220 ° C for at least 3 hours, A laminate according to any one of claims 1 to 6.

(81) The laminate described in any one of (57) to (80), wherein the metal foil is a copper foil.

(82) A metal foil having a carrier according to any one of (57) to (81), wherein the laminate is obtained by cutting the laminate from the inner side of the portion where the metal foil is welded or adhered when viewed in plan.

(83) A method for producing a multilayer metal clad laminate, comprising laminating a resin on at least one metal foil side of the laminate described in (1), and then laminating the resin or metal foil one or more times.

(84) A resin, a single-sided or double-sided metal clad laminate, or a laminate described in (1) or (2) to (28), wherein the resin is laminated on at least one metal foil side of the laminate described in (1) A metal foil having a carrier according to any one of (56), (82), or a laminate according to any one of (29) to (55), (57) And repeatedly laminating the multilayered metal clad laminate.

(85) A method for manufacturing a metal foil, comprising: laminating a resin on at least one metal foil side of a metal foil having a carrier according to any one of (2) to (28) A method for manufacturing a multilayer metal clad laminate.

(86) A resin laminated on a metal foil side of a metal foil having a carrier according to any one of (2) to (28), followed by laminating the resin, the one side or both side metal clad laminate, the laminate described in (1) A metal foil with a carrier according to any one of (2) to (28), (56) and (82), or a metal foil with a carrier according to any one of (29) to (55), (57) Sintered body, or metal foil is repeated one or more times to form a multilayer metal clad laminate.

(87) The method for producing a multilayer metal clad laminate according to any one of (83) to (86), wherein at least one of the resins is a prepreg.

(88) A process for producing a multilayer metal clad laminate according to any one of (83) to (87), which comprises a step of cutting at least one of the laminate or the laminate on a laminate surface of a metal foil and a metal foil Wherein the metal layer is a metal layer.

(89) The method according to any one of (84) to (87), further comprising a step of separating and separating the metal foil from the plate-like carrier of the metal foil on which the carrier is adhered and a method for producing the multilayer metal clad laminate .

(90) The production method described in (88), further comprising a step of peeling and separating the metal foil from the plate-like carrier of the laminated body, the laminate or the carrier with the carrier after the cutting, .

(91) A production method of a multilayer metal clad laminate comprising the steps of (89) to (90), wherein a part or all of the metal foil separated and removed is removed by etching.

(92) A multilayer metal clad laminate obtained by the manufacturing method described in any one of (83) to (91).

(93) A method for manufacturing a build-up substrate, comprising the step of forming at least one build-up wiring layer on the metal foil side of the laminate described in (1).

(94) A resin, a single-sided wiring board, a single-sided or double-sided metal clad laminate, a laminate described in (1), (2) to (28), and a resin laminated on the metal foil side of the laminate described in (1) , A metal foil with a carrier according to any one of (56) to (82), a laminate according to any one of (29) to (55) And repeating and laminating the laminate.

(95) A method for manufacturing a build-up board comprising the step of forming at least one build-up wiring layer on the metal foil side of the metal foil having the carrier according to any one of (2) to (28).

(96) The method for manufacturing a build-up substrate according to (93) or (95), wherein the build-up wiring layer is formed using at least one of a subtractive method or a full additive method or a semi-additive method.

(97) A resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, (1) a resin laminated on the metal foil side of the metal foil having the carrier described in any one of (2) (29) to (55) and (57) to (81) described in any one of (2) to (28), (56) , Or a metal foil is repeatedly laminated one or more times.

(98) A method for manufacturing a build-up board according to (94) or (97), wherein the method comprises the steps of: preparing a single-sided or double-sided wiring board, a single- A step of forming a hole in a plate-like carrier of a metal foil with a carrier, a metal foil of a laminate, a plate-like carrier of a laminate, a metal foil or a resin, and carrying out conduction plating on the side and bottom of the hole, ≪ / RTI >

(99) The method of manufacturing a build-up board according to (97) or (98), wherein the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single- Wherein the step of forming the wiring on at least one of the metal foil constituting the metal foil with the carrier and the metal foil and the metal foil constituting the laminate is carried out at least once.

The carrier described in any one of (2) to (28) and (56) wherein the metal foil is closely attached to the carrier side and one side of the laminate described in (1) The method according to (99), further comprising a step of contacting and laminating the carrier side of the laminate described in any one of (29) to (55), wherein the metal foil is in close contact with the carrier side or one side of the attached metal foil / RTI >

(2) to (28), (56), and (56) in which a resin is laminated on a wiring-formed surface and a metal foil is adhered to both surfaces of the resin, Wherein one of the metal foils of the laminate according to any one of (29) to (55), (57) to (81), wherein the metal foil having the carrier described in any one of (99). ≪ / RTI >

(102) The method for manufacturing a build-up board as described in any one of (94), (97) to (101), wherein at least one of the resins is a prepreg.

(103) A method of manufacturing a build-up board according to any one of (93) to (102), wherein a step of cutting at least one of the laminate or the laminate on the lamination surface of the plate- Wherein the method comprises the steps of:

(104) In the method of manufacturing a build-up board according to any one of (93) to (102), the step of separating and separating the plate-like carrier and the metal foil in at least one of the laminated metal foils with the carrier Further comprising a step of forming a buildup wiring board.

(105) The method for manufacturing a build-up wiring board according to (103), further comprising a step of separating and separating the metal foil from the plate-like carrier of the laminated body, the laminate or the metal foil with the carrier after the cutting, ≪ / RTI >

(106) The method of manufacturing a build-up wiring board according to (104) or (105), further comprising a step of removing a part or the whole of the metal foil in close contact with the plate- .

(107) A build-up wiring board obtained by the method described in (103) to (106).

(108) A method of manufacturing a printed circuit board comprising the steps of (103) to (106).

(109) A method for producing a laminated body according to any one of (29) to (55), (57) to (81) Layer laminated metal clad laminate.

(110) A resin, a single-sided or double-sided metal clad laminate, or (1) a laminate obtained by laminating a resin on the metal foil side of the laminate described in any one of (29) to (55) , Or a metal foil having a carrier according to any one of (2) to (28), (56), and (82) A method for producing a multilayer metal clad laminate comprising laminating a laminate or a metal foil according to any one of the claims one or more times.

(111) The method for producing a multilayer metal clad laminate according to any one of (109) and (110), wherein at least one of the resins is a prepreg.

(112) A process for producing a multilayer metal clad laminate according to any one of (109) to (111), wherein the laminate or the laminate is cut at a lamination surface of a plate-like carrier and a metal foil Wherein the metal layer is a metal layer.

(113) The method for producing a multilayer metal clad laminate according to any one of (109) to (111), further comprising a step of peeling and separating the laminated metal foil carrier with the metal foil from the laminated metal foil A method for manufacturing a multilayer metal clad laminate.

(114) The method for producing a multilayered metal clad laminate according to (112), further comprising a step of separating and separating the metal foil from the plate-like carrier of the laminated body, the laminate or the metal foil on which the carrier is adhered, A method for producing a clad laminate.

(115) A method of manufacturing a multilayer metal clad laminate including the step of removing part or all of a metal foil separated and peeled by etching in the manufacturing method according to (113) or (114).

(116) A multilayer metal clad laminate obtained by the production method described in any one of (109) to (115).

(117) A method for manufacturing a build-up substrate including a step of forming at least one build-up wiring layer on the metal foil side of the laminate according to any one of (29) to (55) .

(118) The method of manufacturing a build-up substrate according to (117), wherein the build-up wiring layer is formed using at least one of a subtractive method, a pull additive method or a semi-additive method.

(119) A resin laminated on the metal foil side of the laminate according to any one of (29) to (55), (57) to (81), and then a resin, a single side or double side wiring substrate, The laminate described in any one of (29) to (55), (57) to (81), or the laminate described in any one of (2) to (28), And a metal foil or a metal foil with a carrier according to any one of claims 1 to 82. The method for manufacturing a build-up board according to claim 1,

(120) A method for producing a build-up substrate according to (119), wherein the single-sided or double-sided wiring substrate, the single- A method for manufacturing a build-up board, comprising the steps of: forming a metal foil, a metal foil of a metal foil with a carrier, a plate-shaped carrier of a metal foil with a carrier, or a resin; and conducting conduction plating on side and bottom surfaces of the hole.

(121) A method of manufacturing a build-up board according to (119) or (120), wherein the metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single- Wherein the step of forming the wiring on at least one of the metal foil constituting the laminate, the metal foil constituting the metal foil with the carrier, and the metal foil is carried out at least once.

(122) The carrier side of the laminate according to any one of (29) to (55), in which the metal foil is closely attached to the carrier side or one side of the laminate described in (1) (121), further comprising a step of laminating the carrier side of the metal foil having the carrier described in any one of (2) to (28), (56) / RTI >

(55), (57), (55), (55), (57) and (58), in which a resin is laminated on the surface of the wiring board 123 on which a metal foil is adhered, A step of laminating a metal foil with a carrier described in any one of (2) to (28), (56), and (82) in which a metal foil is closely adhered to both surfaces, The method of manufacturing a build-up substrate according to (121), further comprising:

(124) The method for manufacturing a build-up board according to any one of (119) to (123), wherein at least one of the resins is a prepreg.

(125) A method of manufacturing a build-up substrate according to any one of (117) to (124), wherein a step of cutting at least one of the laminate or the laminate on the laminated surface of the plate- Wherein the method comprises the steps of:

(126) A method of manufacturing a build-up board according to any one of (117) to (124), further comprising a step of peeling and separating the laminated metal plate from the plate- A method of manufacturing an up-board.

(127) The method of manufacturing a build-up wiring board according to (125), further comprising a step of separating and separating the metal foil from the plate-like carrier of the laminated body, the laminate or the metal foil with the carrier after the cutting, ≪ / RTI >

(128) A method for manufacturing a build-up wiring board according to (126) or (127), further comprising a step of removing a part or all of the metal foil adhered to the plate-shaped carrier by etching .

(129) A build-up wiring board obtained by the manufacturing method according to any one of (125) to (128).

(130) A manufacturing method of a printed circuit board comprising the step of manufacturing a build-up wiring board by the manufacturing method according to any one of (125) to (128).

According to the present invention, it is possible to effectively reduce the exfoliation due to the external force caused by collision of other members. Therefore, the handling property of the metal foil with the carrier is improved, and the productivity of the printed wiring board using the metal foil with the carrier is improved.

1 shows a configuration example of a CCL.
Fig. 2 shows an example of a configuration of a metal foil with a carrier according to the present invention.
Fig. 3 shows a typical configuration example when the metal foil with the carrier according to the present invention is seen in a plan view.
Fig. 4 is a view seen in a direction perpendicular to the direction in which the metal foil with the carrier shown in Fig. 3 is superimposed.
Fig. 5 shows another typical configuration example of the metal foil to which the carrier related to the present invention is attached.
Fig. 6 is a view seen in a direction perpendicular to the direction in which the metal foil with the carrier shown in Fig. 5 is superimposed.
Fig. 7 shows another typical configuration example of the metal foil to which the carrier according to the present invention is adhered.
Fig. 8 shows another typical configuration example of the metal foil to which the carrier according to the present invention is attached.
Fig. 9 shows another typical configuration example of the metal foil to which the carrier according to the present invention is adhered.
Fig. 10 shows a typical configuration example when the laminate related to the present invention is viewed in a plan view.
11 is a sectional view taken along the line AA 'in Fig. 10.
12 shows another typical configuration example of the laminate related to the present invention.
Fig. 13 shows another typical configuration example of the laminate related to the present invention.
Fig. 14 shows another typical configuration example of the laminate related to the present invention.
15 is a sectional view of FF 'in the configuration example of Fig.
Fig. 16 is a schematic view for explaining a method of manufacturing a laminate related to the present invention. Fig.
Fig. 17 shows a typical configuration example when the laminate related to the present invention is viewed in a plan view.
18 is a cross-sectional view taken along line AA 'of FIG. 17.
Fig. 19 shows another typical configuration example of the laminate related to the present invention.
Fig. 20 shows an example of assembling a multilayer CCL using a copper foil with a carrier according to the present invention (a form in which a copper foil is bonded to one side of a resin plate).
Fig. 21 shows an example of assembling a multilayer CCL using a copper foil with a carrier according to the present invention (a form in which a copper foil is bonded to both sides of a resin plate).

The present invention provides a laminate comprising a resin-made plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner. And the area of the lamination surface of the plate-like carrier and the metal foil in this laminate is smaller than at least one area selected from the group of the plate-like carrier and the metal foil. Here, the " laminated surface of the plate-like carrier and the metal foil " refers to a plane (contact surface) where the plate-like carrier and the metal foil are in contact with each other in lamination of the plate-like carrier and the metal foil. When a laminate in which a metal foil is adhered to only one side of the plate-shaped carrier is used, the metal foil is subjected to a plate-like carrier and the metal foil to be "selected from the group of plate-like carriers and metal foils" When a closely laminated laminate is used, "a plate carrier and a metal foil" are used for the plate carrier and two metal foils adhered to both sides of the plate carrier.

Hereinafter, each embodiment of the present invention will be described in detail.

In the first embodiment related to the present invention, the laminate is a metal foil having a resin-made plate-like carrier and a carrier made of a metal foil adhered to at least one surface of the carrier in a peelable manner.

In the metal foil carrying the carrier, a metal foil having a carrier made of a resin-made plate-like carrier and a carrier made of a metal foil adhered on one or both surfaces, preferably both surfaces of the carrier, is prepared. Fig. 2 and Fig. 20 show one configuration example of the metal foil with the carrier according to the present invention. Particularly, in the first part of Fig. 20, a metal foil 11 having a carrier adhered to the metal foil 11a in a peelable manner is shown on both sides of the resinous plate-like carrier 11c. Between the plate-like carrier 11c and the metal foil 11a, a layer made of a releasing agent or a releasing member 11b described below is bonded. 2, 20, and 21 are views when viewed in a direction perpendicular to the direction in which the plate-like carrier and the metal foil are superimposed. 2, 20, and 21, the contact length between the plate-like carrier and the metal foil is the same, but the metal foil with the carrier described in Figs. 2, 20, Is smaller than the area of at least one of the plate-like carrier and the metal foil.

In the second embodiment related to the present invention, the laminate is a laminate composed of a resin-made plate-like carrier and a metal foil which is peelably adhered to at least one surface of the carrier.

In the third embodiment related to the present invention, the laminate is a laminate composed of a resin-made plate-like carrier and a metal foil which is peelably adhered to two surfaces of the carrier.

In this laminate, a plate-like carrier made of a resin and a metal foil adhered to one side or both sides, preferably both sides, of the carrier in a peelable manner. An example of the structure of this laminate is shown in Fig.

The metal foil and the laminate with each carrier are structurally similar to the CCL shown in Fig. 1, but the present invention has a structure in which the metal foil and the resin are finally separated and can be easily peeled off. At this point, the structure and function are completely different because the CCL is not peeled off.

The plate-like carrier and the metal foil with the carrier used in the present invention, or the plate-like carrier and the metal foil of the laminate must be peeled off anyway, so that it is problematic that the adhesion is excessively high. However, In the chemical liquid treatment process of the present invention.

From this viewpoint, the peel strength between the metal foil and the plate-like carrier is preferably 10 gf / cm or more, more preferably 30 gf / cm or more, more preferably 50 gf / cm or more, and more preferably 200 gf / cm or less More preferably 150 gf / cm or less, and even more preferably 80 gf / cm or less. When the peel strength between the metal foil and the plate-like carrier is set within the above range, peeling is not caused at the time of carrying or during processing, but the peeling strength can be easily peeled off by hand, that is, mechanically peeled off.

The adjustment of the peel strength for realizing such adhesion can be easily realized by using a layer or a release material composed of a specific mold releasing agent as described later. This is because when the layer or the release material comprising the releasing agent is used between the plate-like carrier and the metal foil, the adhesiveness is suitably deteriorated and the peel strength can be controlled within the above-mentioned range.

(First Embodiment)

The metal foil with the carrier of this embodiment has a structure in which the area of the metal foil is smaller than the area of the plate-like carrier when viewed in plan view. As a typical example of such a structure, there is a structure in which at least a part of at least an end portion of the plate-like carrier, for example, as shown in Fig. 3, is not covered with the metal foil.

Figs. 3 and 4 show a typical configuration example of a metal foil with a carrier. Fig. 3 is a plan view of this configuration example, and Fig. 4 is a view of the configuration example when viewed in a direction perpendicular to the overlapping direction.

3 and 4, the plate-like carrier 121 and the metal foil 122 are bonded to each other to form a metal foil 120 with a carrier. When the two are bonded, the surface of the plate-like carrier 121 is covered with a metal foil The exposed portion 123 appears.

3, the tops of the four corners of the metal foil have curved surfaces 124 and the overall area of the metal foil 122 is smaller than the area of the plate-like carrier 121 when the metal foil with the carrier is seen in a plane, The metal foil is smaller than the plate-like carrier. With this structure, even when another member collides, the frequency of direct contact with the interface between the plate-shaped carrier and the metal foil becomes smaller, and a large stress change at the interface at this time is less likely to occur. Can be reduced. It is sufficient for the exposed portion not covered with the metal foil to appear at at least one vertex of the plate-shaped carrier, but more preferably appears at two or more apexes from the viewpoint of reducing the frequency of collision with other members during handling, Lt; RTI ID = 0.0 > 3, < / RTI >

In addition, although the case where the plate-like carrier has a rectangular shape in a plan view is shown, other polygonal shapes may be used. On the other hand, the case where the metal foil has a curved surface at the apex of the metal foil is shown, but instead of this curved surface, a polygonal shape may be used as a whole.

Figs. 5 and 6 show another typical configuration example of the metal foil on which the carrier is attached. Fig. 5 is a plan view of this configuration, Fig. 6 is a view perpendicular to the direction in which this configuration example is superimposed, and Fig. 6 is a view seen from a direction in which the difference in size of the plate- to be.

5 and 6, the metal foil 130 having the carrier attached thereto in a laminated state with the plate-like carrier 131 and the metal foil 132 is formed. However, when both are bonded, the metal foil Exposed portions 133 not covered with a metal foil are present on both sides with the through-holes 132 therebetween.

5, the total length of the edge (rim) of the plate-like carrier is A (mm), the length of the edge (rim) covered by the metal foil of the plate carrier is B (mm) ), The ratio of B to A (= B / A) is from 0 to 0.8, preferably from 0 to 0.5. In the use of a metal foil with a carrier as described below, It is possible to provide a configuration in which both are not easily peeled off during handling while securing the required adhesion between the two. In order to simplify the explanation, in FIG. 5, the length of one side of the edge (rim) of the plate-like carrier is represented by A, but in this embodiment, A is the total length of the edge (rim) The sum of the lengths of the edges). 5, the length of one side of the edge (rim) covered with the metal foil of the plate-like carrier is represented by B (mm), but in the present invention, B is the length of the metal foil of the plate- Means the total length of the edges (rim) (the sum of the lengths of the edges of the ridges covered with the metal foil of the plate-like carrier).

5, the metal foil 132 is smaller than the plate-shaped carrier 131, and at least one pair of opposing sides of the metal foil 132 are provided on both sides of the plate-like carrier 131 in comparison with the side of the plate- Which is shorter than 0.1 mm. Here, the " corresponding side " refers to a side (the side C in Fig. 5) of the metal foil 132 when the plate-like carrier 131 and the metal foil 132 are bonded to each other, Indicates a side of the carrier 131 (a side D in Fig. 5). Although the width corresponding to the short side of the exposed portion 133 is sufficient, 0.1 mm or more is sufficient, but preferably 3 mm or more, more preferably 5 mm or more, more preferably 10 mm or more, and further preferably 15 mm or more, more preferably 20 mm or more, more preferably 25 mm or more, and further preferably 30 mm or more. Although it is the upper limit of the size of the exposed portion 133, it can be specified in terms of the area ratio from the viewpoint of securing the adhesion between the plate-like carrier and the metal foil. The area Sa of the metal foil in the plan view and the area It is preferable that the exposed portion 133 is formed so that the ratio Sa / Sb of the openings Sb to Sb is 0.7 or more, and preferably 0.8 or more.

3 to 6 show a mode in which a metal foil is bonded to only one side of the plate-like carrier, but a metal foil may be bonded on both sides.

Further, in addition to the metal foil with the carrier as shown in Figs. 3 to 6, it is also preferable that those shown in Figs. 7 to 9 are used.

7 shows a state in which the metal foil 142 has a curved surface 144 at the four corners of the metal foil 142. The metal foil 142 has a curved surface 144, That is, the metal foil 142 is smaller than the plate-like carrier 141. In addition, at least one pair of opposing sides of the metal foil 142 is 0.1 mm or less in each of both ends in comparison with the side of the plate-like carrier 141 corresponding to the side, preferably 3 mm or more, More preferably not less than 5 mm, more preferably not less than 10 mm, more preferably not less than 15 mm, more preferably not less than 20 mm, more preferably not less than 25 mm, and even more preferably not less than 30 mm. In the case of Fig. 7, the length of the side of the metal foil 142 is the length of the sides obtained by projecting toward the corresponding side of the plate-shaped carrier 141. That is, in Fig. 7, the same length as the side E is indicated. 7, the plate-like carrier 141 and the metal foil 142 are bonded together to form the metal foil 140 with the carrier. When the two are bonded, the metal foil 142 is bonded to the surface of the plate- Exposed portions 143 are not covered with metal foil on both sides. The vertexes of the four corners of the plate-shaped carrier 141 may have curved surfaces.

8 shows a state in which the metal foil 152 is bonded to the surface of the plate-like carrier 151 when the two are bonded to each other, An exposed portion 153 not covered with a metal foil appears. 8 shows a case in which a pair of sides of the metal foil 132 is shorter than a corresponding side of the plate-like carrier 131 in FIG. 5, but the other pair of side faces of the metal foil, Which is shorter than the sides. 5, it is considered that the frequency of direct contact with the interface between the plate-shaped carrier and the metal foil can be reduced even if other members collide with each other. As a result, the separation of the plate- can do.

9 shows a state in which the metal foil 160 attached with the carrier by the lamination of the plate-like carrier 161 and the metal foil 162 forms the metal foil 160 with the periphery of the metal foil 162 The exposed portion 163 is not covered with the metal foil. The embodiment of Fig. 9 shows an embodiment in which the four corners of the metal foil 152 are removed in Fig. Even in such a configuration, it is considered that even when another member collides, the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced, and as a result, peeling of the plate-like carrier and the metal foil during handling can be reduced.

Particularly, in the embodiment in which the exposed portion is sufficiently large as shown in Figs. 5 to 7, a drill or the like is used in a region of the plate-like carrier which is not covered with the metal foil, About 1 to 10 points may be formed. Such a hole formed in the exposed portion can be used as a means for fixing a positioning pin or the like in the production of a multilayer metal clad laminate to be described later or in the production of a build-up substrate.

(Second Embodiment)

The laminate of the present embodiment has a structure in which the area of the metal foil constituting the laminate is smaller than the area of the plate-like carrier constituting the copper laminate when viewed in plan. As a typical example of such a structure, a structure in which at least a part of at least an end of the plate-like carrier, for example, a part of the plate-like carrier 321 is not covered with the metal foil 322 as shown in Fig. .

Fig. 10 and Fig. 11 show a typical configuration example of the laminate. Fig. 10 is a plan view of this configuration example, and Fig. 11 is a cross-sectional view along the line A-A 'of this configuration example.

10 and 11, the laminated body 320 is formed by pasting the plate-like carrier 321 and the metal foil 322 through a press as described later, And rises along the edge of the metal foil 322 to cover the end side face of the metal foil 322 to form the covering layer 323. [

10 shows a case where the metal foil 322 is smaller than the plate-shaped carrier 321 and at least one pair of opposing sides of the metal foil 322 are provided on both sides of the plate carrier 321 Preferably 0.1 mm or shorter, preferably 3 mm or shorter, more preferably 5 mm or shorter, more preferably 10 mm or shorter, still more preferably 15 mm or shorter, still more preferably 20 mm or shorter, more preferably 25 mm or shorter, and more preferably 30 mm or shorter. Here, the " corresponding side " refers to a side (the side C 'in Fig. 10) of the metal foil 322 when the plate-like carrier 321 and the metal foil 322 are bonded, Indicates the side of the plate-like carrier 321 (side D 'in Fig. 10).

10 shows a case where a pair of sides of the metal foil 322 is shorter than the corresponding side of the plate-like carrier 321. However, as shown in Fig. 12, May be shorter. That is, according to Fig. 12, it is also possible to form the laminate 330 surrounded by the plate-like carrier 331 on the outer side of the metal foil 332 when viewed in plan. 12 is a cross-sectional view taken along the line A-A 'in Fig. 12, and is shown in Fig.

With this configuration, even when other members collide, the frequency of direct contact with the interface between the plate-like carrier and the metal foil can be reduced, and as a result, the separation of the plate-like carrier and the metal foil during handling can be reduced. In addition, by covering the side surface of the metal foil so as not to expose it, it is possible to prevent the entry of the chemical liquid into the interface in the chemical liquid treatment step as described above, and to further reduce the peeling between the plate carrier and the metal foil. 12, it is considered that the frequency of direct contact with the interface between the plate-shaped carrier and the metal foil can be reduced even if other members collide with each other as compared with the embodiment shown in Fig. 10. As a result, You can do even fewer.

In the laminate of Figs. 10 to 12, at least one pair of opposing sides of the metal foil before covering with the resin is shorter than 0.1 mm in each of both ends in comparison with the side of the plate-like carrier corresponding to the side But is preferably at least 3 mm shorter, more preferably at least 5 mm short, more preferably at least 10 mm short, more preferably at least 15 mm short, even more preferably at least 20 mm short, Is at least 25 mm shorter, more preferably at least 30 mm shorter. The larger the length, the smaller the metal foil. On the other hand, from the viewpoint of securing the adhesion between the plate-like carrier and the metal foil, it is also not preferable that the metal foil becomes too small. Therefore, from the viewpoint of securing the adhesion, the ratio (Sa / Sb) of the area Sa of the metal foil to the area Sb of the plate-like carrier when viewed in plan view is 0.7 or more and less than 1.0, It is preferable to set the size of the metal foil.

10, the total length of the edge (rim) of the plate-like carrier is A (mm), the length of the edge (rim) covered by the metal foil of the plate carrier is B (mm) ), The ratio of B to A (= B / A) is from 0 to 0.8, preferably from 0 to 0.5. In the use of a metal foil with a carrier as described below, It is possible to provide a configuration in which both are not easily peeled off during handling while securing the required adhesion between the two.

In addition to the laminated sheets as shown in Figs. 10 to 12, those shown in Fig. 13 are also preferable.

13 shows that the metal foil 342 has a curved surface 344 at the four corners of the metal foil 342. The metal foil 342 has a curved surface 344 which is larger in area than the area of the plate- That is, the metal foil 342 is smaller than the plate-like carrier 341. In addition, at least one pair of opposing sides of the metal foil 342 is 0.1 mm or less in each of both ends in comparison with the side of the plate-like carrier 341 corresponding to the side. In the case of Fig. 13, the length of the side of the metal foil 342 which is noticed is a side obtained by projecting toward the corresponding side of the plate-shaped carrier 341, and assumes the length of the side. In other words, in Fig. 13, it indicates the same length as the side E '. 13 is a cross-sectional view taken along the line A-A 'in Fig. 13, which is shown in Fig.

In addition to the embodiment as shown in Figs. 10 to 13, as shown in Figs. 14 and 15, also in the aspect that the end surface of the metal foil is coated with resin as seen from the plane, , The same effect can be obtained. Fig. 14 is a plan view of this configuration example, and Fig. 15 is a F-F 'cross-sectional view of this configuration example.

14 and 15, the plate-like carrier 351 and the metal foil 352 are combined with each other to form a laminate plate 350 through a press as described later. When this press is performed, Melted and rises along the edge of the metal foil 352 and also turns on the upper surface of the metal foil 352 to cover the side surface of the metal foil 352 and a part of the metal foil 352 to form a covering layer 353.

In addition, although the case where the plate-like carrier has a rectangular shape when viewed from the plane is shown, other polygonal shapes or other shapes such as a circle and an ellipse may be used. On the other hand, the case where the metal foil has a curved surface at the apex of the metal foil is shown, but instead of this curved surface, a polygonal shape may be used as a whole.

In Figs. 10 to 15, a mode in which the metal foil is bonded to only one side of the plate-like carrier is shown, but a metal foil may be bonded on both sides.

In the embodiment in which the exposed portion as shown in Figs. 10 to 15 is sufficiently large, a hole of about 0.01 mm to 10 mm in diameter is formed in a region of the plate-like carrier which is not covered with the metal foil, About 10 points may be formed. Such a hole formed in the exposed portion can be used as a means for fixing a positioning pin or the like in the production of a multilayer metal clad laminate to be described later or in the production of a build-up substrate.

Here, the metal foil on which the carrier is adhered is obtained by cutting the laminate 320, 330, 340, 350 shown in Figs. 10 to 15 at a portion of the metal foil on the laminate, for example, the cut line B. Alternatively, a wiring layer, a resin, a buildup layer and the like are laminated on the laminate as described later, and then the laminate is cut at the portion of the metal foil on the laminate, whereby the carrier is adhered to the outermost surface of the multilayer metal clad laminate or the build- So that the metal foil is formed.

(Third Embodiment)

The laminate according to the present embodiment has a structure in which at least a part of the metal foil comes out to the outside of the end portion of the plate-like carrier when seen from a plane, and the metal foil is contacted without interposing the plate- At least part of the portion is welded or glued.

17 and 18 show a typical configuration example of the laminate. Fig. 17 is a plan view of this configuration example, and Fig. 18 is a cross-sectional view taken along line A-A 'of this configuration example.

The two metal foils 222 are welded or adhered to each other on the outer side of the plate-like carrier 21 as viewed in a plan view, so that the laminate body ( 220).

The stacked body 220 is formed such that the laminated surface of the plate-shaped carriers 221 is covered with a metal foil 222 having a larger outer shape than the plate-like carrier, for example, an area larger than the plate-shaped carrier, And a part of the two metal foils is welded or bonded to the outside. It is preferable that the portion to be welded or adhered is the entire periphery of the periphery of the metal foil. Further, it is more preferable that the metal foil be the entire surface of the portion out of the plate-like carrier.

That is, in a preferred embodiment, Embodiment 1 in which a portion of a portion in contact with a metal foil without interposing a plate-like carrier therebetween is welded or bonded, Embodiment 2 in which outer circumferential portions of a metal foil are welded or bonded over an entire circumference, But it is preferable that the interface between the plate-like carrier and the metal foil is not exposed, and it is preferable that the metal foil is bonded or welded to a large area. From this viewpoint, the mode 2 is more preferable, and the mode 3 is further preferable.

With such a configuration, the interface (resin-metal foil interface) 224 between the plate-like carrier and the metal foil 224 can be covered with the metal foil, thereby preventing other members from contacting the resin-metal foil interface 224, The peeling between the plate-like carrier and the metal foil can be reduced. In addition, by covering the resin-metal foil interface 224 so as not to expose it, it is possible to prevent the entry of the chemical solution into the interface in the above-described chemical liquid treatment process, and to further reduce the peeling between the plate- have.

19, a stacked body 230 in which a part of the metal foil 232 is welded or bonded to the outside of the plate-like carrier 231 when seen in a plan view can be mentioned as an example of the present invention Since the interface between the plate-like carrier 231 and the metal foil 232 is exposed at the side not covered with the metal foil 232, the same effect can be obtained in this embodiment, It is difficult to prevent the penetration of the chemical liquid in the direction of the arrow. Therefore, when it is necessary to prevent the entry of the chemical liquid in the four directions, the embodiment of Fig. 17 is preferable.

Further, in the laminate of Figs. 17 to 19, in order to maintain the structure, the metal foil needs some degree of adhesion. When metal foils are brought into close contact with each other by adhesion, an adhesive such as an epoxy resin adhesive can be preferably used. As the adhesive, known adhesives can be used. Further, when a build-up substrate is produced, since heat may be applied to the laminate, it is preferable to use an adhesive having heat resistance. In the case of carrying out by welding, it can be carried out by a known welding method. For example, a welding method such as a resistance welding method, a seam welding method, an ultrasonic welding method, a TIG (tungsten inert gas) welding method, a metal inert gas welding method, a metal active gas welding (MAG) welding method, a friction stir welding method, Welding and the like. For example, it is preferable that the ultrasonic welding, the friction stir welding (FSW), and the seam welding are performed because the generation of the welding slug during welding is small. This adhesion can be effectively exerted when the region where the metal foil is bonded or welded is within a certain range. From this viewpoint, by setting the ratio (Sb / Sa) of the area (Sa) of the metal foil to the area (Sb) of the plate-like carrier when viewed in plan view to be 0.6 or more and less than 1.0, preferably 0.80 or more and 0.95 or less, Or a sufficient area necessary for welding can be ensured. From another viewpoint, it is preferable that the ratio (Sp / Sq) of the area (Sp) of the two metal foils welded or bonded to the area (Sq) of the metal foil containing the welded or bonded surfaces is not less than 0.001 and not more than 0.2 , Preferably not less than 0.01 and not more than 0.20, is preferable because it is possible to secure a sufficient area necessary for bonding or welding the metal foils. The two metal foils stacked on the top and bottom of the plate-like carrier preferably have the same area and shape but may be different. When the areas and shapes of the two metal foils are different, a metal foil having a larger area is used as the value of Sa and Sq.

In addition, although the case where the plate carrier has a quadrangular shape in the plane view is shown, other shapes may be used. The metal foil may have a shape other than a quadrangle.

In addition, although a description has been given of a mode in which the area of the metal foil is larger than the area of the plate-shaped carrier, even if the area of the plate-like carrier is larger than the area of the metal foil, Even if the metal foil is laminated on the plate-like carrier so that there is a portion in contact with the plate-like carrier, the part of the metal foil which are not in contact with each other without interposing the plate-like carrier is welded or bonded, The same effect can be obtained. In these embodiments, the portion of the plate-like carrier which is not laminated with the metal foil becomes a portion that is exposed without covering the metal foil when viewed in plan.

In a mode in which the metal foil is sufficiently larger than the plate-like carrier, a portion of the metal foil contacting with the plate-like carrier without being interposed therebetween, or a portion where the plate-like carrier is not covered with the metal foil, About 1 to 10 holes may be formed. The hole thus formed can be used as a means for fixing the positioning pin or the like in the production of a multilayer metal clad laminate to be described later or in the manufacture of a build-up substrate.

Here, when the laminate body 220, 230 as shown in Figs. 17 to 19 is cut at the inner side, for example, the cut line B, of the portion where the metal foil is welded or adhered when viewed from the plane, An attached metal foil is obtained. Alternatively, after the wiring layer, the resin, the buildup layer, and the like are laminated on the laminate as described later, the laminate is cut inward from the portion where the metal foil is welded or adhered when viewed from the plane, A state in which a metal foil having a carrier adhered to the surface of the build-up substrate is formed.

Next, a releasing agent or a releasing material which can be preferably used when the plate-like carrier and the metal foil are laminated is described in order to realize the adhesion required for the use of the "metal foil with a carrier" described later.

(1) Silane compound

A silane compound having a structure represented by the following formula or a hydrolysis product thereof or a condensate of a hydrolysis product thereof (hereinafter simply referred to as a silane compound) may be used singly or in combination, The adhesiveness is appropriately lowered, and the peel strength can be adjusted to a range as described below.

Expression:

(7)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.

The silane compound needs to have at least one alkoxy group. In the case where a substituent is constituted by only a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, the adhesion between the plate- It tends to deteriorate too much. The silane compound is preferably a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or at least one hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom. If the hydrocarbon group is not present, the adhesion between the plate-like carrier and the surface of the metal foil tends to increase. In addition, the alkoxy group according to the present invention includes an alkoxy group in which at least one hydrogen atom is substituted with a halogen atom.

In adjusting the peel strength between the plate-like carrier and the metal foil to the above-mentioned range, it is preferable that the silane compound has three alkoxy groups and the hydrocarbon group (one or more hydrogen atoms include a hydrocarbon group substituted with a halogen atom) . In the above formula, both R ³ and R ⁴ are referred to as alkoxy groups.

Examples of the alkoxy group include, but are not limited to, a methoxy group, an ethoxy group, an n- or iso-propoxy group, an n-, iso- or tert-butoxy group, n-, iso- or neo- Branched or cyclic C 1-20, preferably C 1-10, more preferably C 1-5 monovalent hydrocarbon groups such as a cyclohexyl group, an n-heptyl group, and an n-octyl group, And an alkoxy group.

Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom and an iodine atom.

The alkyl group includes, but is not limited to, methyl, ethyl, n- or iso-propyl, n-, iso- or tert-butyl, n-, , n-decyl, and the like, and alkyl groups having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, and more preferably 1 to 5 carbon atoms.

The cycloalkyl group includes, but is not limited to, cycloalkyl groups having 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group and cyclooctyl group. .

Examples of the aryl group include an aryl group having 6 to 20 carbon atoms, preferably 6 to 14 carbon atoms such as a phenyl group, a phenyl group substituted with an alkyl group (e.g., a tolyl group, a xylyl group), a 1- or 2-naphthyl group, have.

These hydrocarbon groups may be substituted with at least one hydrogen atom by a halogen atom, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred silane compounds are methyltrimethoxysilane, ethyltrimethoxysilane, n- or iso-propyltrimethoxysilane, n-, iso- or tert-butyltrimethoxysilane, n-, iso- or neo Phenyltrimethoxysilane, alkyl-substituted phenyltrimethoxysilane (for example, p- (methyl) phenyl tri (meth) acrylate, p-toluenesulfonyl methoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, Methoxysilane), methyltriethoxysilane, ethyltriethoxysilane, n- or iso-propyltriethoxysilane, n-, iso- or tert-butyltriethoxysilane, pentyltriethoxysilane, hexyltri Phenyl triethoxysilane, alkyl substituted phenyltriethoxysilane (for example, p- (methyl) phenyltriethoxysilane), (3,3 (meth) acryloxypropyltriethoxysilane, , 3-trifluoropropyl) trimethoxysilane, and tridecafluorooctyltriethoxysilane, methyltrichloro Condensates of hydrolysis products of these, and condensation products of these, and the like can be given as examples of the silane coupling agent, such as trimethylsilane, have. Of these, propyltrimethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, phenyltriethoxysilane and decyltrimethoxysilane are preferable from the viewpoint of availability.

The metal foil or laminate with the carrier can be manufactured by bringing the plate-shaped carrier and the metal foil into hot-press contact. For example, the silane compound can be coated on the surface of the metal foil and / or the plate-like carrier, and hot-press laminated with a B-stage resin plate-like carrier on the surface of the metal foil.

The silane compound can be used in the form of an aqueous solution. To increase the solubility in water, an alcohol such as methanol or ethanol may be added. The addition of alcohol is particularly effective when a silane compound having high hydrophobicity is used. The aqueous solution of the silane compound accelerates the hydrolysis of the alkoxy group by stirring, and the condensation of the hydrolysis product is promoted if the stirring time is long. In general, the use of a silane compound which has undergone hydrolysis and condensation through a sufficient stirring time tends to lower the peel strength between the metal foil and the plate-like carrier. Therefore, the peeling strength can be adjusted by adjusting the stirring time. The stirring time after dissolving the silane compound in water can be, for example, 1 to 100 hours, although not limited thereto, and typically 1 to 30 hours. Naturally, there is a method of using without stirring.

The higher the concentration of the silane compound in the aqueous solution of the silane compound is, the lower the peel strength between the metal foil and the plate-like carrier tends to be lowered, and the peel strength can be adjusted by adjusting the concentration of the silane compound. The concentration of the silane compound in the aqueous solution may be 0.01 to 10.0% by volume, and typically 0.1 to 5.0% by volume.

The pH of the aqueous solution of the silane compound is not particularly limited and can be used on the acidic side or on the alkaline side. For example, at a pH in the range of 3.0 to 10.0. From the viewpoint that no special pH adjustment is necessary, the pH is preferably in the range of about 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0.

(2) a compound having two or less mercapto groups in the molecule

Even when a compound having two or less mercapto groups in the molecule is used to join the plate-like carrier and the metal foil, the adhesiveness is suitably lowered, and the peel strength can be controlled within the range described below.

However, when the compound having three or more mercapto groups in the molecule or a salt thereof is interposed between the plate-like carrier and the metal foil, the resultant mixture is not suitable for the purpose of reducing the peel strength described herein. This is because when a mercapto group is excessively present in a molecule, a sulfide bond, a disulfide bond, or a polysulfide bond is excessively formed by a chemical reaction between a mercapto group or between a mercapto group and a plate-like carrier or between a mercapto group and a metal foil , And a strong three-dimensional cross-linking structure is formed between the plate-like carrier and the metal foil, so that the peel strength may be increased. Such an example is disclosed in Patent Document 2 (Japanese Patent Application Laid-Open No. 2000-196207).

Examples of the compound having two or less mercapto groups in the molecule include thiol, dithiol, thiocarboxylic acid or a salt thereof, dithiocarboxylic acid or a salt thereof, thiosulfonic acid or a salt thereof, and dithiosulfonic acid or a salt thereof And at least one selected from these can be used.

Thiol has one mercapto group in the molecule and is represented by, for example, R-SH. Here, R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group.

Dithiol has two mercapto groups in the molecule and is represented by, for example, R (SH) ₂ . R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The two mercapto groups may be bonded to the same carbon or may be bonded to different carbon or nitrogen, respectively.

The thiocarboxylic acid is one in which the hydroxyl group of the organic carboxylic acid is substituted with a mercapto group and is represented by, for example, R-CO-SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The thiocarboxylic acid can also be used in the form of a salt. Further, a compound having two thiocarboxylic acid groups can also be used.

The dithiocarboxylic acid is one in which two oxygen atoms in the carboxy group of the organic carboxylic acid are substituted with a sulfur atom and is represented by, for example, R- (CS) -SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The dithiocarboxylic acid can also be used in the form of a salt. Further, a compound having two dithiocarboxylic acid groups can also be used.

The thiosulfonic acid is obtained by replacing the hydroxyl group of the organic sulfonic acid with a mercapto group and is represented by, for example, R (SO ₂ ) -SH. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The thiosulfonic acid can also be used in the form of a salt.

The dithiosulfonic acid is represented by R - ((SO ₂ ) - SH) ₂ , in which two hydroxyl groups of the organic disulfonic acid are each substituted with a mercapto group. R represents an aliphatic or aromatic hydrocarbon group or heterocyclic group which may contain a hydroxyl group or an amino group. The two thiosulfonic acid groups may be bonded to the same carbon or may be bonded to different carbons, respectively. The dithiosulfonic acid can also be used in the form of a salt.

The aliphatic hydrocarbon group as R is preferably an alkyl group or a cycloalkyl group, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.

The alkyl group includes, but is not limited to, a methyl group, an ethyl group, an n- or iso-propyl group, an n-, iso- or tert- butyl group, n-, iso- or neopentyl group, An alkyl group having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as an octyl group and an n-decyl group.

Examples of the cycloalkyl group include, but are not limited to, cycloalkyl groups having 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group and cyclooctyl group .

Examples of the aromatic hydrocarbon group which is preferable as R include a phenyl group, a phenyl group substituted with an alkyl group (e.g., a tolyl group, a xylyl group), a 1- or 2-naphthyl group, Or an aryl group having 1 to 14 carbon atoms, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.

Examples of the heterocyclic group preferable as R include imidazole, triazole, tetrazole, benzimidazole, benzotriazole, thiazole, and benzothiazole, and any of the hydroxyl group and the amino group or both do.

Preferable examples of the compound having two or less mercapto groups in the molecule include 3-mercapto-1,2-propanediol, 2-mercaptoethanol, 1,2-ethanedithiol, 6-mercapto- , 1-octanethiol, 1-dodecanethiol, 10-hydroxy-1-dodecanethiol, 10-carboxy-1-dodecanethiol, , Thiophenol, thiobenzoic acid, 4-amino-thiophenol, p-toluenethiol, 2,4-dimethylbenzenethiol, 3-mercapto-1,2,4 triazole, 2- . Of these, 3-mercapto-1,2-propanediol is preferred from the viewpoint of water solubility and waste disposal.

The metal foil or laminate with the carrier can be manufactured by bringing the plate-shaped carrier and the metal foil into hot-press contact. For example, after a compound having two or less mercapto groups in the molecule is coated on the laminated surface of the metal foil and / or the plate-like carrier, the plate-like carrier made of resin of the B stage is hot Press lamination.

The compound having two or less mercapto groups in the molecule can be used in the form of an aqueous solution. To increase the solubility in water, an alcohol such as methanol or ethanol may be added. Addition of an alcohol is particularly effective when using a compound having two or less mercapto groups in a molecule having high hydrophobicity.

The concentration of the compound having two or less mercapto groups in the molecule in the aqueous solution is high and the peeling strength between the metal foil and the plate-like carrier tends to be lowered. By adjusting the concentration of the compound having two or less mercapto groups in the molecule The peel strength can be adjusted. The concentration of the compound having not more than two mercapto groups in the molecule in the aqueous solution may be from 0.01 to 10.0% by weight, and typically from 0.1 to 5.0% by weight, though not limited thereto.

The pH of the aqueous solution of the compound having two or less mercapto groups in the molecule is not particularly limited and can be used on the acidic side or on the alkaline side. For example, at a pH in the range of 3.0 to 10.0. From the viewpoint that no special pH adjustment is necessary, the pH is preferably in the range of about 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0.

(3) Metal alkoxide

A condensate of an aluminate compound, a titanate compound, a zirconate compound, a hydrolysis product thereof, or a hydrolysis product thereof (hereinafter, simply referred to as a metal alkoxide) having a structure represented by the following formula A plurality of them are mixed and used. When the plate-like carrier and the metal foil are bonded to each other, the adhesiveness is appropriately lowered, and the peel strength can be controlled within the range described below.

[Chemical Formula 8]

Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al , Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or less than the valence of M, and at least one of R ¹ is an alkoxy group. Also, m + n is 3 in the case of M, that is, Al, and 4 in case of Ti and Zr.

It is necessary that the metal alkoxide has at least one alkoxy group. In the case where a substituent is constituted by only a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, the adhesion between the plate- It tends to deteriorate too much. It is necessary that the metal alkoxide is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or 0 to 2 hydrocarbon groups in which at least one hydrogen atom is substituted with a halogen atom. If the number of the hydrocarbon groups is 3 or more, the adhesion between the plate-like carrier and the surface of the metal foil tends to be too low. In addition, the alkoxy group according to the present invention includes an alkoxy group in which at least one hydrogen atom is substituted with a halogen atom. In adjusting the peel strength between the plate-like carrier and the metal foil to the above-mentioned range, the metal alkoxide preferably has two or more alkoxy groups and one or two hydrocarbon groups (one or more hydrogen atoms include a hydrocarbon group substituted with a halogen atom) .

The alkyl group includes, but is not limited to, a methyl group, an ethyl group, an n- or iso-propyl group, an n-, iso- or tert- butyl group, n-, iso- or neopentyl group, An alkyl group having 1 to 20 carbon atoms, preferably 1 to 10 carbon atoms, more preferably 1 to 5 carbon atoms, such as an octyl group and an n-decyl group.

Examples of the cycloalkyl group include, but are not limited to, cycloalkyl groups having 3 to 10 carbon atoms, preferably 5 to 7 carbon atoms such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group and cyclooctyl group .

Preferred examples of the aromatic hydrocarbon group as R ² include a phenyl group, a phenyl group substituted with an alkyl group (e.g., a tolyl group, a xylyl group), a 1- or 2-naphthyl group, To 14 carbon atoms, and these hydrocarbon groups may contain either or both of a hydroxyl group and an amino group.

These hydrocarbon groups may be substituted with at least one hydrogen atom by a halogen atom, for example, a fluorine atom, a chlorine atom, or a bromine atom.

Examples of preferred aluminate compounds are trimethoxy aluminum, methyl dimethoxy aluminum, ethyl dimethoxy aluminum, n- or iso-propyl dimethoxy aluminum, n-, iso- or tert-butyl dimethoxy aluminum, n-, iso- Or phenyldimethoxyaluminum, alkyl substituted phenyl dimethoxyaluminum (for example, p- (methyl) phenyldimethoxyaluminum), or an alkyl substituted phenyldimethoxyaluminum such as neopentyldimethoxyaluminum, hexyldimethoxyaluminum, octyldimethoxyaluminum, decyldimethoxyaluminum, N-propyldiethoxy aluminum, n-propyldiethoxy aluminum, n-butyldiethoxy aluminum, pentyl diethoxy aluminum, pentyl diethoxy aluminum, Octyldiethoxy aluminum, decyl diethoxy aluminum, phenyl diethoxy aluminum, alkyl substituted phenyl diethoxy aluminum (for example, p- (methyl) Diisopropoxy aluminum, ethyl diisopropoxy aluminum, n- or iso-propyl diethoxy aluminum, n-, iso- or tert-butyl Diisopropoxy aluminum, diisopropoxy aluminum, pentyl diisopropoxy aluminum, hexyl diisopropoxy aluminum, octyl diisopropoxy aluminum, decyl diisopropoxy aluminum, phenyl diisopropoxy aluminum, alkyl substituted phenyl diisopropoxy aluminum ( For example, p- (methyl) phenyldiisopropoxyaluminum), dimethylisopropoxyaluminum, (3,3,3-trifluoropropyl) dimethoxyaluminum, and tridecafluorooctyldiethoxyaluminum, methyl Dichloro aluminum, dimethyl chloro aluminum, dimethyl chloro aluminum, phenyl dichloro aluminum, dimethyl fluoro aluminum, dimethyl bromo aluminum, diphenyl bromo Aluminum, lanthanum, hydrolysis products of these, and condensates of the hydrolysis products thereof. Of these, trimethoxyaluminum, triethoxyaluminum and triisopropoxyaluminum are preferable from the viewpoint of availability.

Preferred examples of the titanate compound include tetramethoxytitanium, methyltrimethoxytitanium, ethyltrimethoxytitanium, n- or isopropyltrimethoxytitanium, n-, iso- or tert-butyltrimethoxytitanium, n -, iso-or neopentyltrimethoxytitanium, hexyltrimethoxytitanium, octyltrimethoxytitanium, decyltrimethoxytitanium, phenyltrimethoxytitanium, alkyl-substituted phenyltrimethoxytitanium (for example, p - (methyl) phenyltrimethoxytitanium), dimethyldimethoxytitanium, tetraethoxytitanium, methyltriethoxytitanium, ethyltriethoxytitanium, n- or isopropyltriethoxytitanium, n-, iso- or butyltriethoxytitanium, pentyltriethoxytitanium, hexyltriethoxytitanium, octyltriethoxytitanium, decyltriethoxytitanium, phenyltriethoxytitanium, alkyl-substituted phenyltriethoxytitanium (for example, p- (methyl) phenyltriethoxytitanium), dimethyldiethoxytitanium, tetraisobutyl N-propyltriethoxytitanium, n-isopropyltriisopropoxytitanium, pentyltriisopropoxytitanium, isopropyltriisopropoxytitanium, methyltriisopropoxytitanium, ethyltriisopropoxytitanium, n- (For example, p- (methyl) phenyl (meth) acrylate) such as trimethylolpropane, trimethylolpropane, trimethylolpropane, trimethylolpropane, Triisopropoxytitanium), dimethyl diisopropoxytitanium, (3,3,3-trifluoropropyl) trimethoxytitanium, and tridecafluorooctyltriethoxytitanium, methyl trichlorotitanium, dimethyldichlorotitanium , Trimethylchlorotitanium, phenyltrichlorotitanium, dimethyldifluorotitanium, dimethyldibromotitanium, diphenyldibromotitan, hydrolysis products of these, and condensates of these hydrolysis products. Of these, tetramethoxytitanium, tetraethoxytitanium and tetraisopropoxytitanium are preferable from the viewpoint of availability.

Examples of preferred zirconate compounds include tetramethoxyzirconium, methyltrimethoxyzirconium, ethyltrimethoxyzirconium, n- or iso-propyltrimethoxyzirconium, n-, iso- or tert-butyltrimethoxyzirconium, (for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, n-butyl, iso- or neopentyltrimethoxyzirconium, hexyltrimethoxyzirconium, octyltrimethoxyzirconium, decyltrimethoxyzirconium, phenyltrimethoxyzirconium, isopropyltriethoxyzirconium, n-, iso- propyltriethoxyzirconium, n-, iso-, di- or p-toluenesulfonate), dimethyldimethoxyzirconium, tetraethoxyzirconium, methyltriethoxyzirconium, Or tert-butyltriethoxy zirconium, pentyltriethoxy zirconium, hexyl triethoxy zirconium, octyltriethoxy zirconium, decyl triethoxy zirconium, phenyl triethoxy zirconium, Keto-substituted phenyltriethoxyzirconium (for example, p- (methyl) phenyltriethoxyzirconium), dimethyldiethoxyzirconium, tetraisopropoxyzirconium, methyltriisopropoxyzirconium, ethyltriisopropoxyzirconium, n - or isopropyltriethoxyzirconium, n-, iso- or tert-butyltriisopropoxyzirconium, pentyltriisopropoxyzirconium, hexyltriisopropoxyzirconium, octyltriisopropoxyzirconium, decyl tri Phenyl triisopropoxy zirconium, alkyl substituted phenyl triisopropoxy zirconium (for example, p- (methyl) phenyl triisopropoxy titanate), dimethyl diisopropoxy zirconium, (3,3, 3-trifluoropropyl) trimethoxy zirconium, and tridecafluorooctyltriethoxy zirconium, methyl trichloro zirconium, dimethyldichlorozirconium, trimethyl chlorozircon Titanium, and the like can be mentioned phenyl trichloro zirconium, dimethyl-difluoro zirconium, dimethyl-dibromo zirconium, diphenyl dibromo-zirconium, and their hydrolysis products, and their degradation products of hydrolysis condensate. Of these, tetramethoxy zirconium, tetraethoxy zirconium and tetraisopropoxy zirconium are preferable from the viewpoint of availability.

The metal foil or laminate with the carrier can be manufactured by bringing the plate-shaped carrier and the metal foil into hot-press contact. For example, the metal alkoxide may be coated on the surface of the metal foil and / or the plate-like carrier, and hot-press laminated with a resin plate-shaped carrier of the B-stage on the surface of the metal foil .

The metal alkoxide can be used in the form of an aqueous solution. To increase the solubility in water, an alcohol such as methanol or ethanol may be added. Addition of an alcohol is particularly effective when a metal alkoxide having high hydrophobicity is used.

The concentration of the metal alkoxide in the aqueous solution is high. The peel strength between the metal foil and the plate-like carrier tends to be lowered, and the peel strength can be adjusted by adjusting the metal alkoxide concentration. The concentration of the metal alkoxide in the aqueous solution may be from 0.001 to 1.0 mol / l, and is typically from 0.005 to 0.2 mol / l, although not limited thereto.

The pH of the aqueous solution of the metal alkoxide is not particularly limited and can be used on the acidic side or on the alkaline side. For example, at a pH in the range of 3.0 to 10.0. From the viewpoint that no special pH adjustment is necessary, the pH is preferably in the range of about 5.0 to 9.0, which is near neutral, and more preferably in the range of 7.0 to 9.0.

(4) a releasing member made of a resin coating film

The adhesion of the sheet carrier and the metal foil to the metal foil is suitably deteriorated by using a resin coating film composed of any one or a plurality of resins selected from silicon, epoxy resin, melamine resin and fluorine resin , The peel strength can be adjusted to a range as described later.

The adjustment of the peel strength for realizing such adhesion is carried out by using a resin coating film composed of one or a plurality of resins selected from silicon, an epoxy resin, a melamine resin and a fluorine resin as described later. Such a resin coating film is subjected to a baking treatment under a predetermined condition as described later, and is used between the plate-like carrier and the metal foil to be hot-pressed to be adhered to each other. As a result, the adherence is suitably decreased and the peel strength can be adjusted to the above- .

Examples of the epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, brominated epoxy resin, amine type epoxy resin, flexible epoxy resin, hydrogenated bisphenol A type epoxy resin, phenoxy resin, And the like.

Examples of the melamine resin include methyl etherified melamine resin, butylated urea melamine resin, butylated melamine resin, methylated melamine resin, and butyl alcohol-modified melamine resin. The melamine resin may be a mixed resin of the above resin with a butylated urea resin, a butylated benzoguanamine resin, or the like.

The number average molecular weight of the epoxy resin is preferably 2000 to 3000, and the number average molecular weight of the melamine resin is preferably 500 to 1000. By having such a number average molecular weight, the resin can be made into a coating material, and the adhesion strength of the resin coating film can be easily adjusted to a predetermined range.

Examples of the fluororesin include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and polyvinyl fluoride.

Examples of the silicone include methylphenyl polysiloxane, methylhydrogen polysiloxane, dimethyl polysiloxane, modified dimethyl polysiloxane, and mixtures thereof. Here, the denaturation means, for example, an abrasion resistance, an abrasion resistance, an elastic modulus, an elastic modulus, an elastic modulus, an elastic modulus, an elastic modulus, an elastic modulus, Polyester modification, acyloxyalkyl modification, halogenated alkyl acyloxyalkyl modification, halogenated alkyl modification, aminoglycol modification, mercapto modification, and hydroxyl group-containing polyester modification.

If the film thickness is too small in the resin coating film, the resin coating film is too thin, which makes it difficult to form, and the productivity tends to deteriorate. Further, even if the film thickness exceeds a certain size, the peeling property of the resin coating film can not be further improved, and the manufacturing cost of the resin coating film tends to be increased. From this viewpoint, the resin coating film preferably has a film thickness of 0.1 to 10 mu m, more preferably 0.5 to 5 mu m. The film thickness of the resin coating film is achieved by applying the resin coating material in a predetermined coating amount in the procedure described below.

In the resin coating film, silicon functions as a releasing agent for the resin coating film. Therefore, if the total amount of the epoxy resin and the melamine resin is too large as compared with the silicon, the peel strength imparted by the resin coating film between the plate carrier and the metal foil becomes large, so that the peeling property of the resin coating film is deteriorated, There is a case that it does not exist. On the other hand, if the total amount of the epoxy resin and the melamine resin is too small, the peeling strength described above becomes small, so that the metal foil with the carrier may peel off during transportation or processing. From this viewpoint, it is preferable that the total amount of the epoxy resin and the melamine resin is contained in an amount of 10 to 1500 parts by mass, more preferably 20 to 800 parts by mass, relative to 100 parts by mass of silicon .

The fluororesin, like silicon, functions as a release agent and has an effect of improving the heat resistance of the resin coating film. If the amount of the fluorine resin is too large as compared with that of silicon, the above-mentioned peeling strength becomes small, so that the metal foil or the laminate with the carrier may be peeled off during transportation or processing, It becomes economical. From this viewpoint, the fluororesin is preferably 0 to 50 parts by mass, more preferably 0 to 40 parts by mass, per 100 parts by mass of silicon.

The resin coating film may contain at least one kind of surface harmony selected from SiO ₂ , MgO, Al ₂ O ₃ , BaSO ₄ and Mg (OH) ₂ , in addition to silicon and an epoxy resin and / or a melamine resin and, Or may further contain particles. When the resin coating film contains surface roughening particles, the surface of the resin coating film becomes irregular. By the unevenness, the surface of the plate-like carrier or metal foil coated with the resin coating film becomes concave and convex, resulting in a glossy removal surface. The content of the surface roughening particles is not particularly limited as long as the resin coating film is uneven, but it is preferably 1 to 10 parts by mass based on 100 parts by mass of silicon.

The particle size of the surface roughening particles is preferably 15 nm to 4 탆. Here, the particle diameter refers to an average particle diameter (average value of maximum particle diameter and minimum particle diameter) measured from a scanning electron microscope (SEM) photograph or the like. When the particle diameter of the surface roughening particles is in the above range, the amount of irregularity of the surface of the resin coating film can be easily adjusted, and consequently, the irregularity amount of the surface of the plate-like carrier or metal foil can be easily adjusted. Concretely, the amount of unevenness of the surface of the plate-like carrier or metal foil is about 4.0 탆 at the maximum height roughness Ry defined by JIS.

Here, a method of manufacturing a metal foil or a laminate with a carrier by a release material using a resin coating film will be described.

The metal foil to which the carrier is adhered is obtained by a step of applying the resin coating film described above to at least one surface of a plate-like carrier or a metal foil and a baking step of curing the applied resin coating film. The laminate of the second embodiment is obtained by a hot press to be described later after the baking process and the laminate of the third embodiment is obtained by welding or adhering the metal foils as described above after the baking process Loses. Each step will be described below.

(Coating step)

The application step is a step of forming a resin coating film on one surface or both surfaces of a plate-like carrier by applying silicone as a main component, epoxy resin as a hardening agent, melamine resin and, if necessary, a fluororesin as a releasing agent. Resin paints are obtained by dissolving an epoxy resin, a melamine resin, a fluorine resin and silicon in an organic solvent such as alcohol. It is preferable that the total amount of the epoxy resin and the melamine resin is 10 to 1500 parts by mass based on 100 parts by mass of the silicone. It is preferable that the fluororesin is 0 to 50 parts by mass relative to 100 parts by mass of silicon.

As the coating method in the coating step, a gravure coating method, a bar coating method, a roll coating method, a curtain flow coating method, a method using an electrostatic coating machine and the like are used as long as a resin coating film can be formed, The gravure coating method is preferable in terms of the uniformity of the resin coating film and the simplicity of the operation. The coating amount is preferably 1.0 to 2.0 g / m 2 as the resin amount so that the resin coating film 3 has a preferable film thickness of 0.5 to 5 탆.

The gravure coating method is a method of forming a resin coating film on the surface of a plate-like carrier by transferring a resin coating material filled in a concave portion (cell) formed on the roll surface to a plate-like carrier. Specifically, the lower portion of the lower roll having the cells on its surface is immersed in the resin coating, and the resin coating is pushed up into the cell by the rotation of the lower roll. By arranging the plate-shaped carrier between the lower roll and the upper roll disposed on the upper side of the lower roll while rotating the lower roll and the upper roll while pressing the plate carrier to the lower roll with the upper roll, , And the resin coating material poured into the cell is transferred (applied) to one side of the plate-like carrier.

In addition, by arranging the doctor blade so as to contact the surface of the lower roll on the carry-in side of the sheet-like carrier, excess resin paint superimposed on the roll surface other than the cells is removed, and a predetermined amount of resin paint . Further, when the number of cells (size and depth) is large, or when the viscosity of the resin coating material is high, the resin coating film formed on one side of the plate carrier becomes difficult to become smooth. Therefore, the smoothness of the resin coating film may be maintained by disposing a smoothing roll on the carry-out side of the plate-like carrier.

When a resin coating film is formed on both sides of the plate-shaped carrier, after the resin coating film is formed on one side of the plate-like carrier, the plate-shaped carrier is turned upside down and placed again between the lower side roll and the upper side roll. Then, similarly to the above, the resin paint in the cell of the lower roll is transferred (coated) onto the back surface of the plate-like carrier.

(Baking process)

The baking step is a step of baking the resin coating film formed by the coating step at 125 to 320 ° C (baking temperature) for 0.5 to 60 seconds (baking time). By subjecting the resin coating film formed of the predetermined amount of the resin coating material to the baking treatment under the predetermined condition, the peel strength between the plate carrier and the metal foil, which is imparted by the resin coating film, is controlled to a predetermined range. In the present invention, the baking temperature is the arrival temperature of the plate-like carrier. As a heating means used in the baking treatment, a conventionally known apparatus is used.

If the baking temperature is less than 125 占 폚 or the baking time is less than 0.5 seconds, the resin coating film becomes insufficient in curing, the peel strength is more than 200 gf / cm, do. When the baking is excessive, for example, when the baking temperature exceeds 320 DEG C, the resin coating film deteriorates, and the peel strength exceeds 200 gf / cm, deteriorating the workability in peeling. Alternatively, the plate-like carrier may be deteriorated by high temperature. When the baking time exceeds 60 seconds, the productivity is deteriorated.

In the method for producing a metal foil or a laminate with a carrier, the resin paint of the above coating step is preferably a mixture of silicon as a subject, epoxy resin as a hardening agent, melamine resin, fluororesin as a releasing agent, SiO ₂ , MgO, Al ₂ O ₃ , BaSO ₄ and Mg (OH) ₂ , may be used.

Specifically, the resin coating material is obtained by further adding surface roughening particles to the above-mentioned silicone resin solution. By additionally adding such surface roughening particles to the resin coating material, the surface of the resin coating film becomes irregular, and the plate-like carrier or metal foil becomes irregular due to the irregularities, resulting in a glossy removing surface. In order to obtain a plate-like carrier or a metal foil having such a gloss-removing surface, it is preferable that the blending amount (added amount) of the surface roughening particles in the resin paint is 1 to 10 parts by mass relative to 100 parts by mass of silicon. It is further preferable that the surface roughing particles have a particle diameter of 15 nm to 4 탆.

The manufacturing method according to the present invention is as described above. However, in carrying out the present invention, other steps may be included during or after each step in the range not adversely affecting each step. For example, a cleaning step may be performed to clean the surface of the plate-like carrier before the application step.

(Peeling strength in consideration of thermal history in the manufacturing process of the multilayer printed wiring board)

Generally, in the manufacturing process of the multilayer printed wiring board, the heat treatment is often performed in the lamination press process or the desmear process. Therefore, in the case of using the metal foil or the laminate with the carrier of the present invention, the thermal history of the metal foil or laminate with the carrier attached thereto becomes more severe as the number of laminations increases. Therefore, in consideration of application to a multilayer printed wiring board in particular, it is preferable that the peeling strength between the metal foil and the plate-like carrier in the metal foil with the carrier obtained from the metal foil or the laminate with the carrier, Range. ≪ / RTI >

Therefore, in a more preferred embodiment of the present invention, it is preferable that the heating conditions in the manufacturing process of the multilayered printed circuit board, for example, at 220 deg. C for at least 3 hours, 6 hours, or 9 hours after heating , The peel strength between the metal foil and the plate-like carrier is preferably 30 gf / cm or more, more preferably 50 gf / cm or more. The peel strength is preferably 200 gf / cm or less, more preferably 150 gf / cm or less, and even more preferably 80 gf / cm or less.

The peel strength after heating at 220 占 폚 is not particularly limited so long as the peel strength satisfies the above-described range in both of 3 hours and 6 hours after, or 6 hours and 9 hours after, , And it is more preferable that all peel strengths after 3 hours, 6 hours and 9 hours satisfy the above-described range.

In the present invention, the peel strength is measured in accordance with the 90 degree peel strength measurement method specified in JIS C6481.

Hereinafter, concrete constituent requirements of each material for realizing such peel strength will be described.

The resin to be the plate-like carrier is not particularly limited, and a phenol resin, a polyimide resin, an epoxy resin, a natural rubber, a paper, etc. can be used, but a thermosetting resin is preferable. A prepreg may also be used. It is recommended that the prepress before bonding with the metal foil is in the state of the B stage. Prepreg (C stage) linear expansion coefficient is ^{12 ~ 18 (× 10 -6 /} ℃) and a constituent material of the copper foil of the substrate of 16.5 (× 10 ^-6 / ℃), or SUS 17.3 (× 10 of a press plate of the ^{- 6} / 占 폚), it is advantageous in that the positional deviation of the circuit due to the development (scaling change) in which the substrate size before and after the press is different from that at the time of designing is hard to occur. In addition, as a synergistic effect of these advantages, it becomes possible to produce a multi-layered ultra-thin coreless substrate. The prepreg used here may be the same as or different from the prepreg constituting the circuit board. Further, conventionally, a metal plate has been used as a plate-like carrier of a metal foil with a carrier. In this case, the plate-like carrier and the metal foil were closely contacted by welding or an adhesive. In the case of using an adhesive, in many cases, it is not suitable for build-up in general from the viewpoint of heat resistance. In the case of adhering closely by welding, if the whole surface welding is used, the peeling strength is too high, It becomes difficult to peel off. Moreover, when partial welding is used, it is difficult to prevent the penetration of the chemical liquid between the plate-like carrier and the metal foil, and in any case, it is not suitable for build-up. Thus, by using a resin-made plate-like carrier, it is possible to exhibit a suitable peel strength with the metal foil, and to use the heat-resistant resin to sufficiently withstand the thermal history at the time of build-up. As the heat-resistant resin, known ones can be used.

Therefore, it is preferable that the plate-shaped carrier has a high glass transition temperature Tg in view of maintaining the peel strength after heating in the optimum range, and for example, a glass transition temperature of 120 to 320 占 폚, preferably 170 to 240 占 폚 Tg. The glass transition temperature Tg is a value measured by DSC (differential scanning calorimetry).

It is also preferable that the coefficient of thermal expansion of the resin be within +10% and -30% of the thermal expansion coefficient of the metal foil. This makes it possible to effectively prevent the positional deviation of the circuit due to the difference in thermal expansion between the metal foil and the resin, to reduce the generation of defective products, and to improve the yield.

The thickness of the sheet-like carrier is not particularly limited, and may be rigid or flexible. However, if the sheet-like carrier is excessively thick, adverse effects are exerted on the heat distribution in the hot press, while if it is too thin, Mu] m or more and 1000 mu m or less, more preferably 50 mu m or more and 900 mu m or less, and more preferably 100 mu m or more and 400 mu m or less.

As the metal foil, copper or a copper alloy foil is typical, but foils of aluminum, nickel, and zinc may be used. In the case of copper or copper alloy foil, electrolytic foil or rolled foil may be used. The metal foil generally has a thickness of not less than 1 占 퐉, preferably not less than 5 占 퐉, and not more than 400 占 퐉, preferably not more than 120 占 퐉, in consideration of its use as a wiring of a printed circuit board. In the case of attaching the metal foil to both surfaces of the plate-like carrier, metal foils of the same thickness may be used, or metal foils of different thickness may be used.

The metal foil to be used may be subjected to various surface treatments. For example, a metal plating (Ni plating, Ni-Zn alloy plating, Cu-Ni alloy plating, Cu-Zn alloy plating, Zn plating, Cu-Ni-Zn alloy plating, Co-Ni alloy plating Chromate treatment (including the case where one or more alloying elements such as Zn, P, Ni, Mo, Zr and Ti are contained in the chromate treatment liquid) and surface roughness adjustment Copper alloy plating, Cu-Ni alloy plating, Cu-Ni alloy plating, Cu-Co alloy plating, Cu-Ni alloy plating, Cu- Copper alloy plating such as Cu-As-W alloy plating). The roughening treatment not only affects the peel strength between the metal foil and the plate-like carrier, but also the chromate treatment has a great influence. The chromate treatment is important from the viewpoints of rust resistance and discoloration resistance, but it tends to significantly increase the peel strength, which is also important as a means for adjusting the peel strength.

In the conventional CCL, it is desired that the resin and the copper foil have high peel strength. For example, the matte surface (M-plane) of the electrolytic copper foil is used as a bonding surface with the resin, And an improvement of the adhesive force by the physical anchor effect is also being carried out. Also, in the resin side, various binders are added to improve the adhesive force with the metal foil. As described above, in the present invention, unlike the CCL, since the metal foil and the resin need to be finally peeled off, it is disadvantageous that the peel strength is excessively high.

Therefore, in a preferred embodiment of the metal foil or laminate with the carrier according to the present invention, in order to adjust the peel strength between the metal foil and the plate-like carrier to the preferable range described above, the surface roughness of the co- (Rz jis) of the surface of the metal foil measured in accordance with JIS B 0601: 2001, and it is preferable that the average roughness is 3.5 mu m or less and 3.0 mu m or less. However, it is troublesome to reduce the surface roughness without limitation, which causes a rise in cost, and therefore, it is preferably 0.1 탆 or more, more preferably 0.3 탆 or more. When an electrolytic copper foil is used as the metal foil, it is possible to use any of a glossy surface (shiny surface, S-surface) and a roughened surface (matte surface or M-surface) if such surface roughness is adjusted. However, It is easy to adjust the surface roughness. On the other hand, the 10-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is preferably 0.4 μm or more and 10.0 μm or less.

In a preferred embodiment of the metal foil or the laminate having the carrier according to the present invention, the surface of the metal foil to be laminated with the resin is not subjected to surface treatment for improving the peel strength such as roughening treatment. In a preferred embodiment of the metal foil with the carrier according to the present invention, no binder is added to the resin to improve the adhesion with the metal foil.

As the conditions of the hot press for producing the metal foil or the laminate with the carrier, when the prepreg is used as the plate carrier, the hot press is performed at a pressure of 30 to 40 kg / cm 2 and a temperature higher than the glass transition temperature of the prepreg .

16, the metal foil 322 is applied onto the plate-shaped carrier 321, and then the metal foil 322 is further adhered to the upper surface of the metal foil 322. In this case, The cover plate 325 is placed and pressed from the cover plate 325 toward the press machine 326 in the direction P, Thus, the molten resin component from the plate-like carrier flows in the direction r and can be coated so as not to expose the interface between the plate-like carrier 321 and the metal foil 322 when viewed in a direction perpendicular to the plane direction. In this way, when viewed in a direction perpendicular to the plane direction, a laminated plate in which a metal foil end side face or a part or all of the upper end face is covered with a resin can be constituted.

The surface of the metal foil or resin is measured by a device such as a scanning electron microscope equipped with XPS (X-ray photoelectron spectroscopy), EPMA (electron beam microanalyzer), EDX (energy dispersive X-ray analysis) It can be concluded that the silane compound exists on the surface of the metal foil or the resin and when S is detected, it can be presumed that a compound having not more than two mercapto groups in the molecule exists on the surface of the metal foil or resin , And when Al, Ti and Zr are detected, it can be presumed that the metal alkoxide exists on the surface of the metal foil or the resin.

Further, in another aspect, the present invention provides the use of the above-described laminate.

Examples of the application of the laminate of the present invention include a method of producing a multilayered metal clad laminate comprising laminating a resin on at least one metal foil side of a laminate and then laminating a resin or metal foil repeatedly at least once.

Further, a resin, a single-side or double-sided metal clad laminate, or a laminate of the present invention, or a metal foil with a carrier of the present invention, or a laminate of the present invention, Or a method of producing a multilayer metal clad laminate including the step of laminating a metal foil or a metal foil with a carrier obtained from the laminate of the present invention one or more times repeatedly. In addition, the lamination after the resin laminated on the first laminate is performed only a desired number of times, and the resin laminate, the one-side or both-side metal clad laminate, the laminate of the present invention, the metal foil with the carrier of the present invention, The laminate of the present invention and the metal foil.

The above-described method for producing a multilayer metal clad laminate may include a step of cutting at least one of the laminate or the laminate on the lamination surface of the plate-like carrier and the metal foil. As a result, the plate-like carrier and the metal foil can be separated from each other in the laminate portion of the second and third embodiments. Therefore, it is preferable that the laminated surface to be cut is a surface on which the plate-like carrier to be peeled and the metal foil can be peeled off. Here, the term " cut at the lamination face of the plate-like carrier and the metal foil " means that the cut face is cut so as to intersect the lamination face of the plate-like carrier and the metal foil. The step of cutting is not indispensable for peeling the metal foil from the plate-like carrier of the metal foil portion with the carrier at the rear end.

Further, the cut multilayer copper clad laminate may include a step of peeling and separating the plate-like carrier and the metal foil. The point at which the plate-like carrier and the metal foil are separated is a laminate before or after the cutting treatment, a metal foil with a carrier after the cutting treatment or before the cutting treatment, or a laminate after the cutting treatment. (Hereinafter the same)

Furthermore, the method may further include a step of removing the part or all of the metal foil by etching after peeling and separating the plate-like carrier from the metal foil.

Alternatively, a build-up substrate manufacturing method including a step of forming one or more build-up wiring layers on the metal foil side of the laminate can be mentioned. At this time, the build-up wiring layer can be formed using at least one of a subtractive method, a pull additive method or a semi-additive method.

In addition, the resin may be laminated on the metal foil side of the laminate, and then the resin, the one side or the both side wiring board, the one side or both side metal clad laminate, the laminate of the present invention, the metal foil with the carrier of the present invention, Or a method for producing a build-up substrate which comprises laminating a metal foil with a carrier obtained from the laminate of the present invention or a metal foil repeatedly at least once. Further, the lamination after the resin laminated on the first laminate is performed only a desired number of times, and the lamination of the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal clad laminate, the laminate of the present invention, A metal foil with a carrier, a laminate of the present invention, and a metal foil.

As shown in the below-described method for producing a build-up substrate using a metal foil or laminate with a carrier, holes are formed in the constituent layers of each build-up substrate and / or wiring is formed as necessary, If necessary, the laminate of the present invention, the metal foil with the carrier of the present invention, or the laminate of the present invention may be laminated on the wiring on the outermost surface.

The above-mentioned method of manufacturing a build-up substrate may include a step of cutting at least one of the laminate or the laminate on the laminated surface of the plate-like carrier and the metal foil. As a result, the plate-like carrier and the metal foil can be separated from each other in the laminate portion of the second and third embodiments. Therefore, it is preferable that the laminated surface to be cut is a surface on which the plate-like carrier to be peeled and the metal foil can be peeled off. The step of cutting is not indispensable for peeling the metal foil from the plate-like carrier of the metal foil portion with the carrier at the rear end.

Further, the cut multilayer copper clad laminate may include a step of peeling and separating the plate-like carrier and the metal foil.

Furthermore, the method may further include a step of removing the part or all of the metal foil by etching after peeling and separating the plate-like carrier from the metal foil.

On the basis of the above, in one aspect, the present invention provides the use of the above-described carrier-adhered metal foil.

First, a multilayer metal sheath including a resin laminated on at least one metal foil side of the above-mentioned carrier-adhered metal foil, followed by laminating the resin or metal foil one or more times, for example, A method for producing a laminated board is provided.

Second, a resin, a one-sided or double-sided metal clad laminate, a laminate of the present invention or a metal foil with a carrier of the present invention, or a laminate of the present invention A metal foil with a carrier obtained from the laminate of the present invention, or a metal foil is laminated one or more times, for example, 1 to 10 times, to produce a multilayer metal clad laminate. The lamination after the resin laminated on the first carrier-adhered metal foil is performed only a desired number of times, and the lamination of resin, single-side or double-sided metal clad laminate, laminate of the present invention, A metal foil, a laminate of the present invention, and a metal foil.

In the above-described method for producing a multilayer metal clad laminate, a step of cutting on a metal foil of a metal foil, on which the carrier is adhered, on a lamination surface of a plate-like carrier and a metal foil in at least one of the laminate or the laminate, And further, for example, a step of separating and separating the metal foil from the plate-like carrier of the metal foil to which the carrier after the cutting is attached.

Further, the method may further include a step of removing a part or the whole of the metal foil by etching after peeling and separating the plate-like carrier from the metal foil.

Third, a resin, a one-side or double-sided wiring board, a single-sided or double-sided metal clad laminate, or a laminate of the present invention, or a carrier of the present invention, is laminated on the metal foil side of the above- Up of a build-up substrate comprising laminating a metal foil or a metal foil having a carrier obtained from the laminate of the present invention or a metal foil one or more times, for example, 1 to 10 times, Method is provided. The lamination after the resin laminated on the first carrier-adhered metal foil is performed only a desired number of times, and the lamination of the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal clad laminate, The metal foil having the carrier of the present invention, the laminate of the present invention, and the metal foil.

Fourthly, there is provided a method of manufacturing a build-up substrate including a step of laminating at least one build-up wiring layer on the metal foil side of the above-described carrier-adhered metal foil. At this time, the build-up wiring layer can be formed using at least one of a subtractive method, a pull additive method or a semi-additive method.

Further, in another aspect, the present invention provides the use of the above-described laminate.

First, a multilayer metal clad laminate including a resin laminated on at least one metal foil side of the above-described laminate and then laminated by repeating the resin or metal foil one or more times, for example, 1 to 10 times Method is provided.

Second, a resin, a single-side or double-sided metal clad laminate, a laminate of the present invention, a metal foil with a carrier of the present invention, a laminate of the present invention, or a laminate of the present invention is laminated with a resin laminated on the metal foil side of the above- Layered metal clad laminate comprising laminating a metal foil or a metal foil with a carrier obtained by cutting at a predetermined position of the laminate according to the present invention one or more times, for example, 1 to 10 times Method is provided. In addition, the lamination after the resin laminated on the first laminate is carried out only a desired number of times, and the lamination of resin, single-side or double-side metal clad laminate, laminate of the present invention, , A metal foil with a carrier of the present invention, a metal foil with a carrier obtained from the laminate of the present invention, and a metal foil.

In the above-described method for producing a multilayer metal clad laminate, it is preferable that the step of cutting on the metal foil of the laminate, for example, on the lamination surface of the plate-like carrier and the metal foil in at least one of the laminate or the laminate, And separating and separating the plate-like carrier and the metal foil of the stacked body after the cutting. In the method for producing a multilayer metal clad laminate as described above, it may include a step of cutting the laminate from the inner side of the portion where the metal foil is welded or adhered when viewed in plan view.

Further, the method may further include a step of removing a part or the whole of the metal foil by etching after peeling and separating the plate-like carrier from the metal foil.

Third, a resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, or a laminate of the present invention or a laminate of the present invention, a laminate of the present invention, A metal foil with a carrier or a metal foil or a metal foil with a carrier obtained by cutting at a predetermined position of the laminate of the present invention as described above is laminated one or more times, for example, 1 to 10 times A method of manufacturing a build-up substrate is provided. Further, the lamination after the resin laminated on the first laminate is carried out only a desired number of times, and the lamination of the resin, the single-sided or double-sided wiring board, the single-sided or double-sided metal clad laminate, the laminate of the present invention, A metal foil with a carrier of the present invention, a metal foil with a carrier obtained from the laminate of the present invention, and a metal foil.

Fourthly, there is provided a method of manufacturing a build-up substrate including a step of laminating at least one build-up wiring layer on the metal foil side of the above-described laminate. At this time, the build-up wiring layer can be formed using at least one of a subtractive method, a pull additive method or a semi-additive method.

Here, in the method for manufacturing a fourth build-up substrate using a metal foil or a laminate with a carrier, the subtractive method is a method in which a metal foil on a metal clad laminate or a wiring board (including a printed wiring board and a printed circuit board) Or the like is selectively removed by etching or the like to form a conductor pattern. The pull additive method is a method of forming a conductor pattern by electroless plating and / or electrolytic plating without using a metal foil for a conductor layer. The semi-additive method is a method in which a seed layer made of, for example, A conductor pattern is formed by forming a conductor pattern by using a combination of copper metal deposition, electrolytic plating, etching, or both, and then removing an unnecessary seed layer by etching to obtain a conductor pattern.

In the method of manufacturing a build-up substrate using a metal foil with a carrier, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, a metal foil of a laminate, a plate- A step of forming a hole in the plate-like carrier of the attached metal foil, the metal foil of the laminate, the plate-like carrier of the laminate, the metal foil or the resin, and conducting the conduction plating on the side and bottom surface of the hole. The metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the single-sided or double-sided metal clad laminate, the metal foil constituting the laminate, the metal foil constituting the metal foil with the carrier, the metal foil constituting the laminate, And the step of forming the wiring in at least one of the wiring layers may be performed at least once.

Alternatively, in the above-described method for producing a build-up substrate using a laminate, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, a metal foil of a laminate, a laminate, a metal foil of a laminate, A step of forming a hole in the metal foil or the resin of the metal foil on which the carrier is adhered, and conducting the conduction plating on the side and bottom face of the hole. The metal foil constituting the single-sided or double-sided wiring board, the metal foil constituting the one-sided metal clad laminate, the metal foil constituting the laminate, the metal foil constituting the laminate, the metal foil constituting the metal foil with the carrier, The step of forming the wiring on at least one of the first and second wiring layers may be carried out one or more times.

In the method for producing a build-up substrate using a metal foil with a carrier, it is preferable that the metal foil is brought into close contact with the carrier side or one side of the laminate related to the present invention, The step of laminating the carrier side of the metal foil having the carrier or the carrier side of the laminate related to the present invention in which the metal foil is adhered to one side is laminated. The metal foil having the carrier according to the present invention in which a metal foil is closely attached to the carrier side or both sides of the laminate related to the present invention in which the resin is laminated on the wired surface and the metal foil is adhered to both surfaces of the resin, May further include a step of laminating the laminate related to the present invention in which the metal foil is in close contact with the metal foil.

Alternatively, in the above-described method for producing a build-up substrate using a laminate, a metal foil may be adhered to the carrier side or one side of the laminate related to the present invention, A step of laminating the carrier side of the metal foil having the carrier according to the present invention in contact with the metal foil on the carrier side or one side of the sieve. It is also possible to use a laminate according to the present invention in which a metal foil is adhered to the carrier side or both sides of the laminate related to the present invention in which the resin is laminated on the wired surface and the metal foil is adhered to both sides of the resin, The step of laminating the metal foil with the carrier according to the present invention adhered thereto may be further included.

The term " wired surface " refers to a portion formed on the surface that appears every time during the build-up process. The build-up substrate includes the final product or the intermediate product.

In the method of manufacturing a build-up substrate, at least one of the laminate or the laminate may be a laminate of the laminate or a metal foil with a carrier, if necessary, A step of cutting at a predetermined position on the metal foil and a step of separating and separating the metal foil from the laminate after the cutting or the plate-like carrier of the metal foil on which the carrier is adhered, for example.

Further, the method may further include a step of removing a part or the whole of the metal foil by etching after peeling and separating the plate-like carrier from the metal foil.

Further, in the above-described method of manufacturing a multilayer metal clad laminate and the method of manufacturing a build-up substrate, the layers may be laminated by thermocompression bonding. The thermocompression bonding may be performed each time one layer of one layer is laminated, or may be integrally laminated to some extent, or may be integrally formed at the end.

Particularly, the present invention relates to a method of manufacturing a build-up board, characterized in that it comprises the steps of: preparing a single-sided or double-sided wiring board, a single-sided or double-sided copper clad laminate, a metal foil of a laminate, Holes are made in the plate-like carrier of the metal foil, the metal foil of the laminate, the plate-like carrier of the laminate, the metal foil or the resin, and the side and bottom surfaces of the hole are plated, A step of forming a circuit on a metal foil constituting the copper clad laminate, the metal foil constituting the laminate, the metal foil constituting the metal foil carrying the carrier, the metal foil constituting the laminate, or the metal foil, A method of manufacturing a build-up substrate is provided.

Hereinafter, as a specific example of the above-mentioned use, a method of producing a four-layer CCL using a metal foil with a carrier according to the present invention will be described. The metal foil with the carrier used here is a metal foil 11 having a carrier adhered to one surface of the plate-like carrier 11c in close contact with the metal foil 11a. A desired number of prepregs 12, a two-layer printed circuit board or two-layer metal-clad laminate, hereinafter referred to as an inner layer core 13, and a prepreg 12, The metal foil 11 with the carrier is stacked in order to complete a set of four-layer CCL assembly unit. Next, this unit 14 (collectively referred to as " page ") is repeated 10 times to constitute a press assembly 15 (collectively referred to as "drum") (FIG. Thereafter, the drum 15 is placed between the stacked metal molds 10, set in a hot press machine, and press-molded at a predetermined temperature and pressure, whereby a large number of four-layer CCLs can be manufactured at the same time. As the laminated metal mold 10, for example, a stainless steel plate can be used. The plate may be, but not limited to, a thick plate having a thickness of about 1 to 10 mm, for example. With respect to the CCL having four or more layers, it is generally possible to produce by the same process by raising the number of inner core layers.

As a concrete example of the use described above, a method of producing a core-less build-up substrate using a metal foil 11 with a carrier adhered to both surfaces of a resin-made plate-like carrier 11c according to the present invention, . In this method, a necessary number of buildup layers 16 are stacked on both sides of the metal foil 11 on which the carrier is attached, and then the metal foil on both sides is peeled off from the metal foil 11 with the carrier (see Fig. 21).

For example, the resin as the insulating layer, the two-layer circuit board, and the resin as the insulating layer are laminated in this order on the metal foil side of the metal foil with the carrier of the present invention and the metal foil side is brought into contact with the resin, Up board can be manufactured by sequentially laminating the metal foil of the metal foil with the carrier of the metal foil.

For example, a resin as an insulating layer, a two-layer circuit board and a resin as an insulating layer are sequentially laminated on the metal foil side of the laminate of the present invention, and the metal foil side is brought into contact with the resin, Up board can be manufactured by overlapping the metal foil of the metal foil with the carrier in order and cutting the predetermined position of the metal foil of the laminate at a predetermined position included in the cut face.

As another method, when a metal foil with a carrier is used, at least one metal foil side of a metal foil having a carrier adhered to a metal foil on both sides or one side of the resin-made plate-like carrier 11c, , And metal foil as a conductor layer are laminated in this order. Next, the step of half-etching the entire surface of the metal foil to adjust the thickness may be included if necessary. Next, a predetermined position of the laminated metal foil is subjected to laser processing to form a via hole passing through the metal foil and the resin, followed by desmear treatment for removing the smear in the via hole, and then the entire surface of the via hole bottom, Is subjected to electroless plating to form an interlayer connection, and further electrolytic plating is performed as necessary. A plating resist may be formed in advance in a portion where the electroless plating on the metal foil or the electrolytic plating is unnecessary before each plating is carried out. If the adhesion between the electroless plating, the electrolytic plating, and the plating resist and the metal foil is insufficient, the surface of the metal foil may be chemically roughened in advance. When a plating resist is used, the plating resist is removed after plating. Next, unnecessary portions of the metal foil, the electroless plating portion, and the electrolytic plating portion are removed by etching to form a circuit. Thus, a build-up substrate is obtained. A multilayer buildup substrate may be formed by repeatedly performing the steps from the lamination of the resin and the metal foil to the formation of the circuit repeated a plurality of times.

Further, the resin-made side of the metal foil of the metal foil having the carrier adhered to the metal foil closely contacting the one side of the present invention may be laminated on the outermost surface of the build-up substrate. Alternatively, Or one of the metal foils of the metal foil having the carrier adhered thereto may be contacted and laminated.

In this method, in the case of using the laminate of the present invention, in the same manner as in the case of using the metal foil with the carrier, after the circuit formation, the metal foil of the laminate portion to be the object of separation of the plate- A build-up substrate is obtained by cutting at a predetermined point included. A multilayer buildup substrate may be formed by repeating the steps from the lamination of the resin and the copper foil to the circuit formation a plurality of times.

The surface of the build-up substrate may also be laminated on the resin side of the laminate having the metal foil bonded to one side of the present invention or the resin side of the metal foil with the carrier adhered to one side in contact with one side, One of the metal foils of the laminate in which the metal foil is adhered to both surfaces of the present invention or one of the metal foils of the metal foil on which the metal foil is adhered on both surfaces in contact with the both surfaces of the laminate may be laminated in contact with each other. When the laminate is closely adhered to the last, it is possible to cut a predetermined point at which the metal foil of the laminate is included in the cut surface up to the front end, but without cutting until the final laminate is adhered, The metal surface of all the stacked bodies may be cut so as to be included in the cut surface.

Here, as the resin used for the build-up substrate production, a prepreg containing a thermosetting resin can be preferably used.

As another method, when a metal foil with a carrier is used, a metal foil of a metal foil with a carrier, which is obtained by bonding a metal foil, for example, a copper foil, on one or both sides of a resin sheet- A resin, for example, a prepreg or a photosensitive resin is laminated. Thereafter, a via hole is formed at a predetermined position of the resin. When a prepreg is used as the resin, for example, the via hole can be formed by laser processing. After the laser processing, the desmear treatment for removing the smear in the via holes may be performed. When a photosensitive resin is used as the resin, the resin in the portion where the via hole is to be formed can be removed by photolithography. Next, electroless plating is performed on the bottom or side of the via hole, the entire surface or part of the resin, to form an interlayer connection, and electrolytic plating is further performed if necessary. A plating resist may be formed in advance in a portion where the resin-based electroless plating or electrolytic plating is unnecessary before each plating is carried out. When the electroless plating, the electroplating, and the adhesion between the plating resist and the resin are insufficient, the surface of the resin may be chemically matched in advance. When a plating resist is used, the plating resist is removed after plating. Next, unnecessary portions of the electroless plating portion or the electroplated portion are removed by etching to form a circuit. Thus, a build-up substrate is obtained. The steps from the lamination of the resin to the circuit formation may be repeated a plurality of times to form a multilayer buildup substrate.

The surface of the build-up substrate may also be laminated on the resin side of the laminate having the metal foil bonded to one side of the present invention or the resin side of the metal foil with the carrier adhered to one side in contact with one side, One of the metal foils of the laminate in which the metal foil is adhered to both surfaces of the present invention or one of the metal foils of the metal foil on which the metal foil is adhered on both surfaces in contact with the both surfaces of the laminate may be laminated in contact with each other.

In this method, in the case of using the laminate of the present invention, in the same manner as in the case of using the metal foil with the carrier, after the circuit formation, the metal foil of the laminate portion to be the object of separation of the plate- It is possible to manufacture a build-up substrate by cutting at a predetermined point included. The steps from the lamination of the resin to the circuit formation may be repeated a plurality of times to form a multilayer buildup substrate.

The surface of the build-up substrate may also be laminated on the resin side of the laminate having the metal foil bonded to one side of the present invention or the resin side of the metal foil with the carrier adhered to one side in contact with one side, One of the metal foils of the laminate in which the metal foil is adhered to both surfaces of the present invention or one of the metal foils of the metal foil on which the metal foil is adhered on both surfaces in contact with the both surfaces of the laminate may be laminated in contact with each other. When the laminate is closely adhered to the last, it is possible to cut a predetermined point at which the metal foil of the laminate is included in the cut surface up to the front end, but without cutting until the last laminate is closely contacted, The metal surface of the laminate may be cut so as to be included in the cut surface.

The core-less build-up substrate thus produced is subjected to a plating step and / or an etching step to form a wiring on the surface thereof, and further to peel off the carrier resin from the metal foil to complete a build-up wiring board. Wiring may be formed with respect to the separation surface of the metal foil after peeling and separation, or the entire surface of the metal foil may be removed by etching to form a multilayer buildup wiring board. In addition, by mounting electronic parts on a build-up wiring board, a printed circuit board is completed. In addition, a printed circuit board can be obtained even if electronic parts are mounted directly on the coreless build-up substrate before the resin is peeled off.

Example

EXAMPLES Hereinafter, examples and comparative examples of the present invention will be described. However, these examples are provided to better understand the present invention and its advantages, and are not intended to limit the invention.

(First aspect)

<Experimental Example 1-1>

A nickel-zinc (Ni-Zn) alloy plating treatment and a chromate (Cr-Zn chromate) treatment were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions, (Measured in accordance with JIS B 0601: 2001) of the cohesive surface (S-plane in this case) to 1.5 탆, and then the resin was left as a resin and the prepreg (FR- 4 resin) was applied to the S face of the electrolytic copper foil and hot pressed at 170 DEG C for 100 minutes to prepare a copper foil with a carrier.

(Nickel-zinc alloy plating)

Ni concentration of 17 g / l (added as NiSO ₄ )

Zn concentration 4 g / l (added as ZnSO ₄ )

pH  3.1

Solution temperature 40 ℃

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

(Chromate treatment)

Cr concentration 1.4 g / l (added as CrO ₃ or K ₂ CrO ₇ )

Zn concentration 0.01 to 1.0 g / l (added as ZnSO ₄ )

Na ₂ SO ₄ concentration 10 g / l

pH  4.8

Solution temperature 55 ° C

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

With respect to the treatment of the releasing agent with respect to the S-plane or the plate-like carrier, the aqueous solution of the releasing agent was applied by using a spray coater, and then the surface of the copper foil was dried in air at 100 캜 and then subjected to a bonding with the prepreg. Table 1-1 shows the types of the release agent, the agitation time after dissolving the release agent in water, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution.

The releasing agent resin coating film for the S-plane or the plate-like carrier was formed by applying the resin coating composition having the composition shown in Table 1-1 by the gravure coating method, 4 mu m. The applied resin coating film was baked at 150 캜 for 30 seconds. As the epoxy resin shown in Table 1-1, bisphenol A type epoxy resin was used. As the melamine resin, methyl etherified melamine resin was used. As the fluororesin, polytetrafluoroethylene was used. As the dimethyl silicone resin, Dimethylpolysiloxane was used.

It is also assumed that a thermal history is applied to a copper foil with a carrier attached thereto and a metal foil on which the carrier is adhered during a heating process such as circuit formation, Hour).

The peel strength of the copper foil with the carrier obtained by the hot press and the copper foil with the carrier after the heat treatment was further measured was measured between the copper foil and the plate carrier (resin after heating). The results are shown in Table 1-1.

Further, in order to evaluate the peeling workability, the working hours (hours / pieces) by labor per unit number were evaluated. The results are shown in Table 1-2.

<Experimental Examples 1-2 to 1-12>

Using the copper foil, resin (prepreg) and releasing agent shown in Table 1-1, a copper foil with a carrier adhered was produced in the same manner as in Experimental Example 1-1. In Experimental Examples 1-3, Experimental Examples 1-7, and Experimental Examples 1-10, a release agent was applied onto a plate-like carrier. Further, heat treatment was performed under the conditions shown in Table 1-1. The evaluation was carried out in the same manner as in Experimental Example 1-1. The results are shown in Tables 1-1 and 1-2.

In Experimental Example 1-12, a copper foil and a resin (prepreg) were laminated without using a release agent and a release material, and a copper foil with a carrier adhered thereon was produced and evaluated in the same manner as in Experimental Example 1-1.

Table 1 shows the types of the coplanar surface of the copper foil, the conditions of the surface treatment and the surface roughness Rz jis, the use conditions of the release agent, the type of the prepreg, and the lamination conditions of the copper foil and the prepreg.

Specific conditions of the epoxy silane (treatment) and the roughening treatment are as follows in the surface treatment condition of the copper foil mat (M) surface on the opposite side to the adhesion surface with the plate-like carrier. The surface of the copper foil mat (M) surface on the opposite side was subjected to a roughening treatment and then subjected to an epoxy silane treatment.

(Epoxy silane treatment)

Treatment solution: 0.9 volume% aqueous solution of 3-glycidoxypropyltrimethoxysilane

pH 5.0 to 9.0

Stirred for 12 hours at room temperature

Treatment method: Apply the treatment liquid using a spray coater, and dry the treated surface for 5 minutes in air at 100 ° C.

(Harmonization processing)

Cu concentration 20 g / l (added as CuSO ₄ )

H ₂ SO ₄ concentration 50 to 100 g / ℓ

As concentration 0.01 to 2.0 g / l (added as arvic acid)

Solution temperature 40 ℃

Current density 40 to 100 A / dm 2

Plating time 0.1 to 30 seconds

According to the table, it can be seen that, even when the release agent is treated on the surface of the copper foil or on the surface of the plate-like carrier (prepreg), the releasing agent exhibits an equivalent result in terms of the peel strength of the laminate thereafter, .

[Table 1-1]

[Table 1-2]

Further, in Experimental Example 1-1, a prepreg having a thickness of 200 占 퐉 was used as a plate-like carrier in the lamination of a plate-shaped carrier (prepreg) and a copper foil. The prepreg had a square shape of 550 mm square, and the copper foil had a rectangular shape of 550 mm x 500 mm square. The positional relationship between the prepreg and the copper foil was such that the center of the copper foil and the center position of the prepreg were aligned with each other so that the sides of the copper foil and the sides of the prepreg were parallel to each other (FIG. At this time, the total length A of the edge of the prepreg is 2200 mm, the length B of the edge of the prepreg covered by the copper foil is 1000 mm, and the ratio of B to A (B / A) is 0.45. The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan is 0.91. The copper foil was laminated on both sides of the prepreg.

The copper foil and the prepreg were laminated under the same conditions as in Experimental Example 1-1 except that the copper foil was formed into a square shape of 500 mm x 500 mm in Experimental Examples 1-2 to 1-4 8). At this time, since the length B of the edge of the prepreg covered by the copper foil is 0 (zero), the ratio B / A of the edge of the prepreg to the entire length A is 0 (zero). The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan view is 0.83. The copper foil was laminated on both sides of the prepreg.

In Experimental Examples 1-5 to 1-10, the four corners of the copper foil having the dimensions shown in Experimental Example 1-1 were formed into a shape having a curved line with a radius of curvature of 25 mm. Under the same conditions, the copper foil and the prepreg were laminated (the embodiment of Fig. 7). At this time, the ratio (B / A) of the edge of the prepreg to the entire length A is 0.41. The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan is 0.91. The copper foil was laminated on both sides of the prepreg.

In Experimental Example 1-11, the prepreg shown in Experimental Example 1-2 was formed into an octagonal shape obtained by cutting a straight line connecting two points on the edge of the prepreg at a distance of 25 mm from each apex, -2 was formed into an octagonal shape obtained by cutting a straight line connecting two points on the edge of the copper foil at a distance of 25 mm from the respective vertexes in the same manner as in Experimental Example 1-1, (Not shown). At this time, the ratio B / A of the edge of the prepreg to the entire length A is 0 (zero). The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan view is 0.83. The copper foil was laminated on both sides of the prepreg.

A hole with a diameter of 1 mm was drilled at four points of the exposed portion of the copper foil with the carrier thus produced, and the resulting hole was used as a guide hole for positioning in the subsequent build-up step.

An FR-4 prepreg (manufactured by South Plastics Company) and a copper foil (JTC Nikkus Nisseki Metal Co., Ltd., JTC 12 탆 (product name)) were sequentially stacked on both sides of the copper foil with the carrier thus manufactured , And hot press at 170 占 폚 for 100 minutes under a pressure of 3 MPa to prepare a four-layer copper clad laminate.

Next, holes having a diameter of 100 mu m penetrating through the copper foil on the surface of the above-mentioned four-layer copper-clad laminate and the insulating layer (cured prepreg) beneath it were drilled using a laser processor. Subsequently, copper plating is carried out by electroless copper plating and electroplating on the surface of the copper foil on the copper foil on which the carrier exposed at the bottom of the hole and the copper foil on the side of the hole and on the surface of the copper foil laminate And an electrical connection was formed between the copper foil on the copper foil on which the carrier was adhered and the copper foil on the surface of the four-layer copper-clad laminate. Next, a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer build-up substrate can be manufactured.

Subsequently, the four-layer build-up substrate is cut at the position of the copper foil of the copper foil on which the carrier is adhered, and then the plate-like carrier of the copper foil on which the carrier is adhered is separated from the copper foil mechanically, A build-up wiring board was obtained.

<Experimental Example 1-13>

Using the same copper foil, releasing agent and prepreg as in Experimental Example 1-1, except that the copper foil and the prepreg were formed into a square shape having a width of 550 mm on both sides in Experimental Example 1-1, And a two-layer build-up wiring board was obtained in the same manner as in Experimental Example 1-1.

In each of the examples, a plurality of four-layer build-up substrates were manufactured, and the degree of adhesion between the copper foil and the prepreg constituting the carrier-adhered copper foil in the build- It was found that the sample of Example 1-13 was peeled from the interface between the prepreg and the copper foil more than those obtained from Experimental Examples 1-1 to 1-11.

In addition, when Experimental Example 1-13 and Experimental Example 1-1 were compared, it was found that the number of cases of Experimental Example 1-1 in the peeled state at the interface between the prepreg and the copper foil was small.

Comparing Experimental Example 1-1 with Experimental Examples 1-2 to 1-11, the number of cases of Experimental Examples 1-2 to 1-11 in the state of being peeled from the interface between the prepreg and the copper foil was small.

(Second aspect)

<Experimental Example 2-1>

A nickel-zinc (Ni-Zn) alloy plating treatment and a chromate (Cr-Zn chromate) treatment were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions, (Measured in conformity with Rz jis: JIS B 0031 (2003)) of the coplanar surface (S-plane in this case) to 1.5 占 퐉, -4 resin) was laminated with the S side of the electrolytic copper foil and hot pressed at 170 DEG C for 100 minutes to prepare a copper foil with a carrier.

(Nickel-zinc alloy plating)

Ni concentration of 17 g / l (added as NiSO ₄ )

Zn concentration 4 g / l (added as ZnSO ₄ )

pH 3.1

Solution temperature 40 ℃

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

(Chromate treatment)

Cr concentration 1.4 g / l (added as CrO ₃ or K ₂ CrO ₇ )

Zn concentration 0.01 to 1.0 g / l (added as ZnSO ₄ )

Na ₂ SO ₄ concentration 10 g / l

pH 4.8

Solution temperature 55 ° C

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

With respect to the treatment of the releasing agent with respect to the S-plane or the plate-like carrier, the aqueous solution of the releasing agent was applied by using a spray coater, and then the surface of the copper foil was dried in air at 100 캜 and then subjected to a bonding with the prepreg. Table 2-1 shows the types of the release agent, the agitation time after dissolving the release agent in water, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution.

The releasable resin coating film for the S-plane or the sheet-like carrier was formed by applying the resin coating composition having the composition shown in Table 2-1 by the gravure coating method, 4 mu m. The applied resin coating film was baked at 150 캜 for 30 seconds. As the epoxy resin shown in Table 2-1, bisphenol A type epoxy resin is used, melamine resin is methyl etherified melamine resin, fluorine resin is polytetrafluoroethylene, and dimethyl silicone resin is used Dimethylpolysiloxane was used.

It is also assumed that the laminate is subjected to a heat treatment at a time of heating treatment in a uniform manner such as a circuit formation with respect to the metal foil on which the carrier is adhered and the conditions described in Table 2-1 (here, at 220 캜 for 3 hours) Heat treatment was carried out.

The peel strength between the copper foil and the plate-like carrier (resin after heating) in the laminate obtained by the hot press and the laminate after the further heat treatment was measured. The results are shown in Table 2-1.

Further, in order to evaluate the peeling workability, the working hours (hours / pieces) by labor per unit number were evaluated. The results are shown in Table 2-2.

<Experimental Examples 2-2 to 2-12>

Using the copper foil, the resin (prepreg) and the release agent shown in Table 2-1, a laminate was produced in the same manner as in Experimental Example 2-1. In Experimental Example 2-3, Experimental Example 2-7, and Experimental Example 2-10, a release agent was applied on a plate-like carrier. Heat treatment was performed under the conditions shown in Table 2-1. The same evaluations as in Experimental Example 2-1 were carried out for each. The results are shown in Tables 2-1 and 2-2.

In Experimental Example 2-12, a copper foil and a resin (prepreg) were laminated without using a release agent and a release material, and a copper foil with a carrier adhered thereon was produced and evaluated in the same manner as in Experimental Example 2-1.

Further, the type of the coplanar surface of the copper foil, the condition of the surface treatment and the surface roughness Rz jis, the use conditions of the release agent, the type of the prepreg, and the lamination conditions of the copper foil and the prepreg are as shown in Table 2-1.

Specific conditions of the epoxy silane (treatment) and the roughening treatment are as follows in the surface treatment condition of the copper foil mat (M) surface on the opposite side to the adhesion surface with the plate-like carrier. The surface of the copper foil mat (M) surface on the opposite side was subjected to a roughening treatment and then subjected to an epoxy silane treatment.

(Epoxy silane treatment)

Treatment solution: 0.9 volume% aqueous solution of 3-glycidoxypropyltrimethoxysilane

pH 5.0 to 9.0

Stirred for 12 hours at room temperature

Treatment method: Apply the treatment liquid using a spray coater, and dry the treated surface for 5 minutes in air at 100 ° C.

(Harmonization processing)

Cu concentration 20 g / l (added as CuSO ₄ )

H ₂ SO ₄ concentration 50 to 100 g / ℓ

As concentration 0.01 to 2.0 g / l (added as arvic acid)

Solution temperature 40 ℃

Current density 40 to 100 A / dm 2

Plating time 0.1 to 30 seconds

According to the table, it can be seen that, even when the release agent is treated on the surface of the copper foil or on the surface of the plate-like carrier (prepreg), the releasing agent exhibits an equivalent result in terms of the peel strength of the laminate thereafter, .

[Table 2-1]

[Table 2-2]

In Experimental Example 2-1, a prepreg having a thickness of 200 占 퐉 was used as a plate-like carrier in the lamination of the plate-like carrier (prepreg) and the copper foil. The prepreg had a square shape of 550 mm square, and the copper foil had a rectangular shape of 550 mm x 500 mm square. The positional relationship between the prepreg and the copper foil was such that the center of the copper foil was aligned with the center position of the prepreg, and the side of the copper foil and the sides of the prepreg were arranged in parallel to each other (FIGS. 14 and 15). At this time, an aluminum plate having a width of 550 mm x 500 mm and a thickness of 0.1 mm was placed at the same position on the copper foil and laminated. By doing so, it is possible to produce a laminate having a structure in which the resin of the prepreg flows during the thermocompression press to cover the side surface of the copper foil. At this time, the total length A of the edge of the prepreg is 2200 mm, the length B of the edge of the prepreg covered by the copper foil is 1000 mm, and the ratio of B to A (B / A) is 0.45. The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan is 0.91. The copper foil was laminated on both sides of the prepreg.

In Examples 2-2 to 2-4, the copper foil and the prepreg were laminated under the same conditions as in Experimental Example 2-1, except that the copper foil was formed into a square shape of 500 mm x 500 mm. At this time, an aluminum plate having a thickness of 0.10 mm and a length of 490 mm x 490 mm was stacked so that its central position coincided with the center position of the copper foil so that the sides of the copper foil and the sides of the aluminum plate were parallel. By doing so, it is possible to manufacture a laminate having a structure in which the resin of the prepreg flows during the thermocompression press to cover the upper surface of the copper foil end portion. At this time, since the length B of the edge of the prepreg covered by the copper foil is 0 (zero), the ratio B / A of the edge of the prepreg to the entire length A is 0 (zero). The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan view is 0.83. The copper foil was laminated on both sides of the prepreg.

In Experimental Examples 2-5 to 2-10, except that the four corners of the copper foil of the dimensions shown in Experimental Example 2-1 were formed into a shape having a curved line with a curvature radius of 25 mm, 1, a copper foil and a prepreg were laminated (not shown). At this time, the ratio (B / A) of the edge of the prepreg to the entire length A is 0.41. The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan is 0.91. The copper foil was laminated on both sides of the prepreg.

In Experimental Example 2-11, the prepreg shown in Experimental Example 2-2 was formed into an octagonal shape cut into a straight line connecting two points on the edge of the prepreg at a distance of 25 mm from each apex, -2 in the same manner as in Experimental Example 2-1 except that the copper foil shown in Table 2 was formed into an octagonal shape cut by a straight line connecting two points on the edge of the copper foil at a distance of 25 mm from each vertex, (Not shown). At this time, the ratio B / A of the edge of the prepreg to the entire length A is 0 (zero). The ratio Sa / Sb of the area Sa of the copper foil to the area Sb of the prepreg when viewed in plan view is 0.83. The copper foil was laminated on both sides of the prepreg.

A hole with a diameter of 1 mm was drilled at four points of the exposed portion of the copper foil with the carrier thus produced, and the resulting hole was used as a guide hole for positioning in the subsequent build-up step.

An FR-4 prepreg (manufactured by South Plastics Company) and a copper foil (JTC Nikkus Nisseki Metal Co., Ltd., JTC 12 탆 (product name)) were sequentially stacked on both sides of the copper foil with the carrier thus manufactured , And hot press at 170 占 폚 for 100 minutes under a pressure of 3 MPa to prepare a four-layer copper clad laminate.

Next, holes having a diameter of 100 mu m penetrating through the copper foil on the surface of the above-mentioned four-layer copper-clad laminate and the insulating layer (cured prepreg) beneath it were drilled using a laser processor. Subsequently, copper plating is carried out by electroless copper plating and electroplating on the surface of the copper foil on the copper foil on which the carrier exposed at the bottom of the hole and the copper foil on the side of the hole and on the surface of the copper foil laminate , And an electrical connection was formed between the copper foil on the copper foil on which the carrier was adhered and the copper foil on the surface of the four-layer copper-clad laminate. Next, a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer build-up substrate can be manufactured.

Subsequently, the four-layer build-up substrate is cut at the position of the copper foil of the copper foil on which the carrier is adhered, and then the plate-like carrier of the copper foil on which the carrier is adhered and the copper foil are peeled off to separate two sets of two- To obtain a wiring board.

Subsequently, the copper foil on the two sets of two-layer build-up wiring boards, which were in close contact with the plate-like carrier, was etched to form wiring, and two sets of two-layer build-up wiring boards were obtained.

<Experimental Example 2-13>

Using the same copper foil, releasing agent and prepreg as in Experimental Example 2-1, except that the copper foil and the prepreg were formed into a square shape having a length of 550 mm in both sides in Experimental Example 2-1, And a two-layer build-up wiring board was obtained in the same manner as in Experimental Example 2-1.

In each of the examples, a plurality of four-layer build-up substrates were manufactured, and the degree of adhesion between the copper foil and the prepreg constituting the carrier-adhered copper foil in the build- 2-13 were peeled off at the interface between the prepreg and the copper foil than those obtained in Experimental Examples 2-1 to 2-11.

Comparing Experimental Example 2-13 with Experimental Example 2-1, Experimental Example 2-1 showed fewer peeled states at the interface between the prepreg and the copper foil.

Comparing Experimental Example 2-1 with Experimental Examples 2-2 to 2-11, Experimental Examples 2-2 to 2-11 showed fewer peeled states at the interface between the prepreg and the copper foil.

(Third aspect)

<Experimental Example 3-1>

A nickel-zinc (Ni-Zn) alloy plating treatment and a chromate (Cr-Zn chromate) treatment were performed on the shiny (S) surface of each electrolytic copper foil under the following conditions, (Measured in conformity with Rz jis: JIS B 0031 (2003)) of the coplanar surface (S-plane in this case) to 1.5 占 퐉, -4 resin) was laminated with the S side of the electrolytic copper foil and hot pressed at 170 DEG C for 100 minutes to prepare a copper foil with a carrier.

(Nickel-zinc alloy plating)

Ni concentration of 17 g / l (added as NiSO ₄ )

Zn concentration 4 g / l (added as ZnSO ₄ )

pH 3.1

Solution temperature 40 ℃

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

(Chromate treatment)

Cr concentration 1.4 g / l (added as CrO ₃ or K ₂ CrO ₇ )

Zn concentration 0.01 to 1.0 g / l (added as ZnSO ₄ )

Na ₂ SO ₄ concentration 10 g / l

pH 4.8

Solution temperature 55 ° C

Current density 0.1 to 10 A / dm 2

Plating time 0.1 to 10 seconds

With respect to the treatment of the releasing agent with respect to the S-plane or the plate-like carrier, the aqueous solution of the releasing agent was applied by using a spray coater, and then the surface of the copper foil was dried in air at 100 캜 and then subjected to a bonding with the prepreg. Table 3-1 shows the types of the release agent, the agitation time after dissolving the release agent in water, the concentration of the release agent in the aqueous solution, the alcohol concentration in the aqueous solution, and the pH of the aqueous solution.

The releasable resin coating film for the S-plane or the sheet-like carrier was formed by applying the resin coating composition having the composition shown in Table 3-1 by the gravure coating method, 4 mu m. The applied resin coating film was baked at 150 캜 for 30 seconds. As the epoxy resin shown in Table 3-1, bisphenol A type epoxy resin was used. As the melamine resin, methyl etherified melamine resin was used. As the fluororesin, polytetrafluoroethylene was used. As the dimethyl silicone resin, Dimethylpolysiloxane was used.

The laminate is subjected to a heat treatment under the conditions described in Table 3-1 (here, at 220 占 폚 for 3 hours) on the assumption that the laminate is subjected to a heat history during a heating process of a single layer such as a circuit formation did.

The peel strength between the copper foil and the plate-like carrier (resin after heating) in the laminate obtained by the hot press and the laminate after the further heat treatment was measured. The results are shown in Table 3-1.

Further, in order to evaluate the peeling workability, the working hours (hours / pieces) by labor per unit number were evaluated. The results are shown in Table 3-2.

<Experimental Examples 3-2 to 3-12>

Using the copper foil, resin (prepreg) and release agent shown in Table 3-1, a copper foil with a carrier adhered was produced in the same manner as in Experimental Example 3-1. In Examples 3-3, 3-7 and 3-10, a release agent was applied on a plate-like carrier. Heat treatment was performed under the conditions shown in Table 3-1. The same evaluation as in Experimental Example 3-1 was carried out for each. The results are shown in Tables 3-1 and 3-2.

In Experimental Examples 3-12, a copper foil and a resin (prepreg) were laminated without using a release agent and a release material, and a copper foil with a carrier adhered thereon was produced, and evaluation similar to Experimental Example 3-1 was carried out.

Table 3-1 shows the type of the coplanar surface of the copper foil, the conditions of the surface treatment and the surface roughness Rz jis, the conditions of use of the releasing agent, the type of the prepreg, and the lamination conditions of the copper foil and the prepreg.

Specific conditions of the epoxy silane (treatment) and the roughening treatment are as follows in the surface treatment condition of the copper foil mat (M) surface on the opposite side to the adhesion surface with the plate-like carrier. The surface of the copper foil mat (M) surface on the opposite side was subjected to a roughening treatment and then subjected to an epoxy silane treatment.

(Epoxy silane treatment)

Treatment solution: 0.9 volume% aqueous solution of 3-glycidoxypropyltrimethoxysilane

pH 5.0 to 9.0

Stirred for 12 hours at room temperature

Treatment method: Apply the treatment liquid using a spray coater, and dry the treated surface for 5 minutes in air at 100 ° C.

(Harmonization processing)

Cu concentration 20 g / l (added as CuSO ₄ )

H ₂ SO ₄ concentration 50 to 100 g / ℓ

As concentration 0.01 to 2.0 g / l (added as arvic acid)

Solution temperature 40 ℃

Current density 40 to 100 A / dm 2

Plating time 0.1 to 30 seconds

According to the table, it can be seen that, even when the release agent is treated on the surface of the copper foil or on the surface of the plate-like carrier (prepreg), the releasing agent exhibits an equivalent result in terms of the peel strength of the laminate thereafter, .

[Table 3-1]

[Table 3-2]

In Experimental Example 3-1, a prepreg having a thickness of 200 mu m was used as a plate-like carrier in the lamination of the plate-like carrier (prepreg) and the copper foil. The prepreg had a square shape of 550 mm square and the copper foil had a square shape of 600 mm square and 600 mm square. The positional relationship between the prepreg and the copper foil was such that the center of the copper foil was aligned with the center position of the prepreg so that the sides of the copper foil and the sides of the prepreg were parallel to each other (FIG. 17). At this time, the ratio (Sb / Sa) of the area (Sa) of the copper foil to the area (Sb) of the prepreg when viewed from the plane is 0.84. The copper foil was laminated on both sides of the prepreg, and both sides thereof had the same shape and the same area. Next, an area of 10 mm in width and width including four corners of the two copper foils laminated was welded by using an ultrasonic welder. At this time, the ratio Sp / Sq of the area Sp where the copper foil is welded to the area Sq of the copper foil including the welded face is 0.001.

In Experimental Examples 3-2 to 3-10, the same conditions as those of Experimental Example 3-1 were used except that the parts from the end of the two copper foil layers laminated to a width of 10 mm were welded by using an ultrasonic welder , A copper foil and a prepreg were laminated (mode of Fig. 17). At this time, the ratio (Sb / Sa) of the area (Sa) of the copper foil to the area (Sb) of the prepreg when viewed from the plane is 0.84. The ratio Sp / Sq of the area Sp where the copper foil is welded to the area Sq of the copper foil including the welded face is 0.07.

Further, in Experimental Example 3-11, a copper foil was formed into a shape having a rectangular shape of 500 mm x 600 mm in width and the copper foil was adhered to the entire surface of the portion protruding from the prepreg by applying an epoxy resin- Under the same conditions as in Example 3-1, a copper foil and a prepreg were laminated (not shown). At this time, the ratio (Sp / Sq) of the area Sp where the copper foil is welded in the plane and the area Sq of the copper foil including the bonded surface is 0.08.

A hole having a diameter of 1 mm was drilled at four points of the plate-like carrier-exposed portion of the thus-produced laminate body, and this was used as a guide hole for positioning in the subsequent build-up process.

FR-4 prepreg (manufactured by South Plastics Co.) and copper foil (JTC Nikkosheki Metal Co., Ltd., JTC 12 탆 (product name)) were laminated in order on both sides of the laminate thus produced, Under the pressure of 170 占 폚 for 100 minutes to prepare a four-layer copper clad laminate.

Next, holes having a diameter of 100 mu m penetrating through the copper foil on the surface of the above-mentioned four-layer copper-clad laminate and the insulating layer (cured prepreg) beneath it were drilled using a laser processor. Subsequently, copper plating was performed on the surface of the copper foil on the laminate exposed on the bottom of the hole, the side of the hole, and the copper foil on the surface of the four-layer copper clad laminate by electroless copper plating and electroplating, An electrical connection was formed between the copper foil on the sieve and the copper foil on the surface of the four-layer copper-clad laminate. Next, a part of the copper foil on the surface of the four-layer copper-clad laminate was etched using a ferric chloride-based etchant to form a circuit. In this way, a four-layer build-up substrate can be manufactured.

Subsequently, the four-layer build-up substrate is cut from the inner side of the portion where the metal foil is welded or adhered when viewed from the plane, and then the plate-like carrier of the laminate and the copper foil are mechanically peeled off, Two sets of two-layer build-up wiring boards were obtained.

Subsequently, the copper foil on the two sets of two-layer build-up wiring boards, which were in close contact with the plate-like carrier, was etched to form wiring, and two sets of two-layer build-up wiring boards were obtained.

<Experimental Example 3-13>

The same copper foil, releasing agent and prepreg as in Experimental Example 3-1 were used in Example 3-1 except that the copper foil and the prepreg were formed into a square shape having a width of 550 mm and a width of 550 mm, And a two-layer build-up wiring board was obtained in the same manner as in Experimental Example 3-1.

In each of the examples, a plurality of four-layer build-up substrates were manufactured, and the degree of adhesion between the copper foil and the prepreg constituting the carrier-adhered copper foil in the build- 3-13 were peeled off at the interface between the prepreg and the copper foil than those obtained in Experimental Examples 3-1 to 3-11.

Comparing Experimental Example 3-13 with Experimental Example 3-1, Experimental Example 3-1 showed fewer peeled states at the interface between the prepreg and the copper foil.

In comparison between Experimental Example 3-1 and Experimental Examples 3-2 to 3-11, Experimental Examples 3-2 to 3-11 showed fewer peeled states at the interface between the prepreg and the copper foil.

10: Laminated mold
11: Carrier-adhered metal foil
11a: Metal foil
11b: layer or release material composed of release agent
11c: Plate carrier
12: prepreg
13: Inner layer core
14: Page
15: North
16: buildup layer
220:
221: plate carrier
222: Metal foil
224: resin-metal foil interface
230:
231: Plate carrier
232: Metal foil
320:
321: Plate carrier
322: Metal foil
323:
330:
331: Plate carrier
332: Metal foil
333:
340:
341: Plate carrier
342: Metal foil
343:
350:
351: Plate carrier
352: Metal foil
353:

Claims (124)

A metal foil comprising a resin plate-like carrier and a carrier formed of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-shaped carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the carrier satisfying the following items (A) and (B) Attached metal foil:
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate-like carrier and the metal foil are bonded using a releasing agent,
Wherein the mold release agent has the following formula:
[Chemical Formula 1]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.
, A hydrolysis product thereof, and a condensate of a hydrolysis product thereof, either singly or in combination. A metal foil comprising a resin plate-like carrier and a carrier formed of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-shaped carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the carrier satisfying the following items (A) and (B) Attached metal foil:
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate-like carrier and the metal foil are bonded using a releasing agent,
Wherein the release agent comprises a compound having two or less mercapto groups in the molecule. A metal foil comprising a resin plate-like carrier and a carrier formed of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-shaped carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the carrier satisfying the following items (A) and (B) Attached metal foil:
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate-like carrier and the metal foil are bonded using a releasing agent,
Wherein the mold release agent has the following formula:
(2)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)
, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. A metal foil comprising a resin plate-like carrier and a carrier formed of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-shaped carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the carrier satisfying the following items (A) and (B) Attached metal foil:
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate-like carrier and the metal foil are laminated using a resin coating film composed of one or a plurality of resins selected from silicon, an epoxy resin, a melamine resin and a fluororesin. The method according to claim 1,
Wherein at least a part of at least an end of the plate-like carrier is not covered with the metal foil when viewed from the plane. 6. The method of claim 5,
A carrier as claimed in any one of claims 1 to 3, wherein all of the end portions of the plate-like carrier are not covered with the metal foil when viewed from a plane. The method according to claim 1,
Wherein the metal foil has an area smaller than an area of the plate-like carrier when viewed in plan. 6. The method of claim 5,
A metal foil with a carrier having a polygonal shape when viewed in a plan view. 9. The method of claim 8,
Wherein at least one vertex of the polygonal plate-like carrier is not covered with the metal foil. 9. The method of claim 8,
Wherein at least two vertexes of the polygonal plate-like carrier are not covered with the metal foil. 9. The method of claim 8,
Wherein all the apexes of the polygonal plate-like carrier are not covered with the metal foil. 6. The method of claim 5,
Wherein the metal foil is polygonal. 6. The method of claim 5,
When the total length of the edge (edge) of the plate-like carrier is A (mm) and the length of the edge (edge) covered with the metal foil of the plate-like carrier is B (mm) = B / A) of 0 to 0.8. 6. The method of claim 5,
A metal foil comprising a resin plate-like carrier and a carrier formed of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the metal foil is smaller than the plate-like carrier and at least one pair of opposing sides of the metal foil is attached with a carrier of 0.1 mm or less in each of both ends compared with the side of the plate-like carrier corresponding to the side. 6. The method of claim 5,
Wherein the ratio Sa / Sb of the area Sa of the metal foil to the area Sb of the plate-like carrier when viewed in plan is 0.7 or more. 6. The method of claim 5,
Wherein the carrier is formed with 1 to 10 holes having a diameter of 0.01 mm to 10 mm in a region not covered with the metal foil of the plate carrier. 6. The method of claim 5,
A metal foil on which a resin-made plate-like carrier is attached with a carrier containing a thermosetting resin. 6. The method of claim 5,
A metal foil to which a carrier having a resinous plate-like carrier is a prepreg. 18. The method of claim 17,
Wherein the plate-like carrier has a carrier having a glass transition temperature Tg of 120 to 320 캜. 6. The method of claim 5,
And a 10-point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is 3.5 占 퐉 or less. 6. The method of claim 5,
Wherein the metal foil has a thickness of 1 占 퐉 or more and 400 占 퐉 or less. 6. The method of claim 5,
Wherein the plate-like carrier has a thickness of 5 mu m or more and 1000 mu m or less. 6. The method of claim 5,
And a peel strength between the metal foil and the plate-like carrier after heating at 220 ° C for at least 3 hours, 6 hours, or 9 hours is 10 gf / cm or more and 200 gf / cm or less. 6. The method of claim 5,
Wherein the metal foil is a copper foil and a carrier is adhered thereto. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- (A) and (B), wherein a part or the whole of the side surface of the metal foil is covered with a resin and the following items (A) and (B)
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the mold release agent has the following formula:
(3)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.
, A hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- (A) and (B), wherein a part or the whole of the side surface of the metal foil is covered with a resin and the following items (A) and (B)
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the releasing agent is a compound obtained by using a compound having two or less mercapto groups in a molecule. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- (A) and (B), wherein a part or the whole of the side surface of the metal foil is covered with a resin and the following items (A) and (B)
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the mold release agent has the following formula:
[Chemical Formula 4]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)
, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- (A) and (B), wherein a part or the whole of the side surface of the metal foil is covered with a resin and the following items (A) and (B)
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
A laminate obtained by laminating a plate-like carrier and a metal foil using a resin coating film composed of one or a plurality of resins selected from silicon, an epoxy resin, a melamine resin and a fluorine resin. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- A laminate satisfying the following items (A) and (B), wherein a part or all of an end surface of the metal foil on the side not in contact with the plate-like carrier is covered with a resin,
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the mold release agent has the following formula:
(3)

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.
, A hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- A laminate satisfying the following items (A) and (B), wherein a part or all of an end surface of the metal foil on the side not in contact with the plate-like carrier is covered with a resin,
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the releasing agent is a compound obtained by using a compound having two or less mercapto groups in a molecule. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- A laminate satisfying the following items (A) and (B), wherein a part or all of an end surface of the metal foil on the side not in contact with the plate-like carrier is covered with a resin,
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
Wherein the plate carrier and the metal foil are stacked using a release agent,
Wherein the mold release agent has the following formula:
[Chemical Formula 4]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)
, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 1. A laminate comprising a resin plate-like carrier and a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the area of the laminated surface of the plate-like carrier and the metal foil is smaller than at least one area selected from the group of the plate-like carrier and the metal foil, and the area of the metal foil is larger than the area of the plate- A laminate satisfying the following items (A) and (B), wherein a part or all of an end surface of the metal foil on the side not in contact with the plate-like carrier is covered with a resin,
(A) a ten-point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 탆 or more and 10.0 탆 or less;
(B) the peel strength between the sheet-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm,
A laminate obtained by laminating a plate-like carrier and a metal foil using a resin coating film composed of one or a plurality of resins selected from silicon, an epoxy resin, a melamine resin and a fluorine resin. 33. The method according to any one of claims 25 to 32,
Wherein the plate-like carrier has a polygonal shape when viewed in plan. 34. The method of claim 33,
And at least one apex of the polygonal plate-like carrier is not covered with the metal foil. 34. The method of claim 33,
Wherein at least two vertexes of the polygonal plate-like carrier are not covered with the metal foil. 34. The method of claim 33,
Wherein all vertexes of the polygonal plate-like carrier are not covered with the metal foil. 33. The method according to any one of claims 25 to 32,
Wherein the metal foil is polygonal. 33. The method according to any one of claims 25 to 32,
When the total length of the edge (edge) of the plate-like carrier is A (mm) and the length of the edge (edge) covered with the metal foil of the plate-like carrier is B (mm) = B / A) is 0 to 0.8. 33. The method according to any one of claims 25 to 32,
A laminate for obtaining a metal foil having a resin-made plate-like carrier and a carrier made of a metal foil adhered to at least one surface of the carrier in a peelable manner,
Wherein the metal foil is smaller than the plate-like carrier and at least one pair of opposing sides of the metal foil is 0.1 mm or more in each of both ends compared with the side of the plate-like carrier corresponding to the side. 33. The method according to any one of claims 25 to 32,
Wherein the ratio Sa / Sb of the area Sa of the metal foil to the area Sb of the plate-like carrier when viewed in plan view is 0.7 or more and less than 1.0. 33. The method according to any one of claims 25 to 32,
A laminate having holes of 0.01 mm to 10 mm in diameter at 1 to 10 points in an area not covered with the metal foil of the plate-like carrier. 33. The method according to any one of claims 25 to 32,
Wherein the resinous sheet-like carrier comprises a thermosetting resin. 33. The method according to any one of claims 25 to 32,
Wherein the resinous plate-like carrier is a prepreg. 43. The method of claim 42,
The lamellar body has a glass transition temperature Tg of 120 to 320 캜. 33. The method according to any one of claims 25 to 32,
Point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is not more than 3.5 mu m. 33. The method according to any one of claims 25 to 32,
Wherein a thickness of the metal foil is not less than 1 占 퐉 and not more than 400 占 퐉. 33. The method according to any one of claims 25 to 32,
And the thickness of the plate-like carrier is not less than 5 占 퐉 and not more than 1000 占 퐉. 33. The method according to any one of claims 25 to 32,
Wherein the peeling strength between the metal foil and the plate-like carrier after heating at 220 占 폚 for at least 3 hours, 6 hours or 9 hours is not less than 10 gf / cm and not more than 200 gf / cm. 33. The method according to any one of claims 25 to 32,
Wherein the metal foil is a copper foil. 32. A metal foil with a carrier obtained by cutting the laminate according to any one of claims 25 to 32 on a metal foil of the laminate. And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
At least a part of the portion of the metal foil which is exposed outward than the end portion of the plate-like carrier and which is in contact with the metal foil without being interposed by the plate-shaped carrier is welded or adhered / RTI &gt; And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
Wherein a laminated surface of the plate-like carriers is covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and a part of a portion where the metal foils contact each other without interposing the plate-shaped carrier is welded or bonded. And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
Wherein the laminated surfaces of the plate-like carriers are covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and outer circumferential portions of the metal foils are welded or bonded to each other over the entire circumference. And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
Wherein the laminated surface of the plate-shaped carriers is covered with the metal foil whose outer shape is larger than that of the plate-like carrier, and the portions where the metal foils contact each other without interposing the plate-shaped carrier are welded or bonded over the entire surface. 55. The method of any one of claims 51-54,
Wherein the peel strength between the plate-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm. And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
The metal foil is laminated on the plate-like carrier so that there is a portion where the metal foils contact with each other without interposing the plate-like carrier on the outside of the plate-like carrier when viewed from the plane, Is welded or bonded. And a metal foil which is in the form of a metal plate adhered in a peelable manner to at least one surface of the carrier, wherein the area of the laminated surface of the plate-like carrier and the metal foil is selected from the group of the plate-like carrier and the metal foil Wherein the laminate is made of a resin plate-like carrier and a metal foil which is peelably adhered to two faces of the carrier,
The metal foil is laminated on the plate-like carrier so that there is a portion where the metal foils contact with each other without interposing the plate-like carrier when viewed from the plane, and the portion where the metal foils contact with each other without interposing the plate- And the laminated body is welded or bonded over the face. 57. The method of claim 56 or 57,
Wherein the peel strength between the plate-like carrier and the metal foil is not less than 10 gf / cm and not more than 200 gf / cm. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein the ratio (Sa / Sa) of the area (Sa) of the metal foil to the area (Sb) of the plate-like carrier when viewed in plan view is 0.6 or more and less than 1.0. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein a ratio (Sp / Sq) of an area (Sp) where the two metal foils are welded or bonded to an area (Sq) of the metal foil including the welded or bonded surfaces is not less than 0.001 and not more than 0.2. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein the resinous sheet-like carrier comprises a thermosetting resin. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein the resinous plate-like carrier is a prepreg. 62. The method of claim 61,
The lamellar body has a glass transition temperature Tg of 120 to 320 캜. 57. A method according to any one of claims 51 to 54, 56 or 57,
Point average roughness (Rz jis) of the side surface of the metal foil in contact with the carrier is not more than 3.5 mu m. 57. A method according to any one of claims 51 to 54, 56 or 57,
Point average roughness (Rz jis) of the surface of the metal foil on the side not in contact with the carrier is 0.4 占 퐉 or more and 10.0 占 퐉 or less. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein a thickness of the metal foil is not less than 1 占 퐉 and not more than 400 占 퐉. 57. A method according to any one of claims 51 to 54, 56 or 57,
And the thickness of the plate-like carrier is not less than 5 占 퐉 and not more than 1000 占 퐉. 57. The method according to any one of claims 51 to 54, 56, and 57, wherein in the portion where the metal foil is contacted without interposing the plate-like carrier, or the portion of the plate- , And a hole having a diameter of 0.01 mm to 10 mm at 1 to 10 points. 57. A method according to any one of claims 51 to 54, 56 or 57,
A laminate obtained by laminating a sheet-like carrier and a metal foil using a releasing agent. 70. The method of claim 69,
Wherein the mold release agent has the following formula:
[Chemical Formula 5]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and R ³ And R ⁴ are each independently a halogen atom or an alkoxy group or a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group of any of these in which at least one hydrogen atom is substituted with a halogen atom.
, A hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 70. The method of claim 69,
Wherein the releasing agent is a compound obtained by using a compound having two or less mercapto groups in a molecule. 70. The method of claim 69,
Wherein the mold release agent has the following formula:
[Chemical Formula 6]

(Wherein R ¹ is an alkoxy group or a halogen atom, R ² is a hydrocarbon group selected from the group consisting of an alkyl group, a cycloalkyl group and an aryl group, or a hydrocarbon group in which at least one hydrogen atom is substituted with a halogen atom, and M is Al, Ti and Zr, n is 0 or 1 or 2, m is an integer of 1 or more and equal to or smaller than M, and at least one of R ¹ is an alkoxy group. 3 for Ti, and 4 for Zr)
, A titanate compound, a zirconate compound, a hydrolysis product thereof, and a condensate of the hydrolysis product thereof, either singly or in combination. 57. A method according to any one of claims 51 to 54, 56 or 57,
A laminate obtained by laminating a plate-like carrier and a metal foil using a resin coating film composed of one or a plurality of resins selected from silicon, an epoxy resin, a melamine resin and a fluorine resin. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein the peeling strength between the metal foil and the plate-like carrier after heating at 220 占 폚 for at least 3 hours, 6 hours or 9 hours is not less than 10 gf / cm and not more than 200 gf / cm. 57. A method according to any one of claims 51 to 54, 56 or 57,
Wherein the metal foil is a copper foil. The laminate according to any one of claims 51 to 54, 56, and 57, which is obtained by cutting the metal foil from the inside of the portion where the metal foil is welded or adhered, . A method for producing a multilayer metal clad laminate comprising the steps of: laminating a resin on at least one metal foil side of a carrier-adhered metal foil according to claim 1, and then laminating the resin or metal foil repeatedly at least once. A resin, a one-sided or double-sided metal clad laminate, or a metal foil with a carrier according to any of claims 1 to 5, or a metal foil with a carrier according to any one of claims 5 to 9, wherein the resin is laminated on at least one metal foil side of the carrier- A laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a laminate according to any one of claims 25 to 32, A method for manufacturing a multilayer metal clad laminate comprising: repeating a metal foil repeated one or more times. A multilayer metal sheath comprising a resin laminated on at least one metal foil side of a metal foil having a carrier according to any one of claims 5 to 7 and subsequently laminated with resin or metal foil one or more times (2). A resin, a single-sided or double-sided metal clad laminate, or a metal foil with a carrier according to any of claims 1 to 7, or a metal foil with a carrier according to any one of claims 5 to 7 Or a laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a metal foil having a metal foil of 1 Layered metal clad laminate. &Lt; RTI ID = 0.0 &gt; 11. &lt; / RTI &gt; 78. The method of claim 77,
Wherein at least one of the resins is a prepreg. 77. The method of manufacturing a multilayer metal clad laminate according to claim 77, comprising a step of cutting the laminate on the laminate of the plate-like carrier and the metal foil of the metal foil on which the carrier is adhered. 79. The method of claim 78,
Further comprising the step of separating and separating the metal foil from the plate-like carrier of the metal foil on which the carrier is adhered. 83. The method of claim 82,
Further comprising the step of separating and separating the metal foil from the plate-like carrier of the metal foil after the cut laminate or the carrier. 85. The method of claim 83,
And removing a part or the whole of the separated metal foil by etching. A multilayer metal clad laminate obtained by the manufacturing method according to claim 77. A method for manufacturing a build-up board comprising the step of forming at least one build-up wiring layer on the metal foil side of the metal foil having the carrier according to claim 1. A resin, a one-sided or double-sided wiring board, a one-sided or double-sided metal clad laminate, a metal foil with a carrier described in claim 1, a metal foil with a carrier attached thereto, A laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a laminate according to any one of claims 25 to 28, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once. A method for manufacturing a build-up board comprising the step of forming at least one build-up wiring layer on a metal foil side of a metal foil having a carrier according to any one of claims 5 to 7. 88. The method of claim 87,
Wherein the build-up wiring layer is formed using at least one of a subtractive method, a full additive method, or a semi-additive method. A resin, a one-sided or double-sided wiring board, a one-sided or double-sided metal clad laminate, a metal foil with a carrier described in claim 1, a metal foil with a carrier attached thereto, A laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a laminate according to any one of claims 25 to 28, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once. 90. The method of claim 88,
A metal foil of a metal foil with a carrier, a plate-like carrier of a metal foil with a carrier, a metal foil of a laminate, a plate-like carrier of a laminate, a metal foil, or a resin, Further comprising a step of performing conduction plating on side surfaces and bottom surfaces of the hole. 92. The method of claim 91,
A step of forming a wiring in at least one of a metal foil constituting the one-side or both-side wiring board, a metal foil constituting the one-side or both-side metal clad laminate, a metal foil constituting the metal foil with the carrier, a metal foil constituting the laminate, Wherein the method further comprises performing at least one time. A resin, a one-sided or double-sided wiring board, a one-sided or double-sided metal clad laminate, a metal foil with a carrier as defined in claim 1, a metal foil with a carrier attached thereto, A laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a laminate according to any one of claims 25 to 28, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once,
A step of forming a wiring in at least one of a metal foil constituting the one-side or both-side wiring board, a metal foil constituting the one-side or both-side metal clad laminate, a metal foil constituting the metal foil with the carrier, a metal foil constituting the laminate, The method of manufacturing a build-up substrate according to claim 1,
A carrier-coated metal foil according to any one of claims 5 to 7, wherein a metal foil is adhered to the carrier side and one side of the carrier-adhered metal foil according to claim 1, Contacting the carrier side of the laminate according to any one of claims 25 to 32, 51-54, 56, and 57 in which the metal foil is in close contact with the carrier side or one side of the laminate, Wherein the step of forming the build-up substrate further comprises: A resin, a one-sided or double-sided wiring board, a one-sided or double-sided metal clad laminate, a metal foil with a carrier as defined in claim 1, a metal foil with a carrier attached thereto, A laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a laminate according to any one of claims 25 to 28, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once,
A step of forming a wiring in at least one of a metal foil constituting the one-side or both-side wiring board, a metal foil constituting the one-side or both-side metal clad laminate, a metal foil constituting the metal foil with the carrier, a metal foil constituting the laminate, The method of manufacturing a build-up substrate according to claim 1,
A carrier-adhered metal foil as set forth in claim 1, wherein a resin is laminated on the wired surface and a metal foil is adhered to both surfaces of the resin, and a metal foil as claimed in any one of claims 5 to 7, A metal foil with a carrier or a metal foil of one of the laminate according to any one of claims 25 to 32, 51 to 54, 56 or 57, Wherein the step of forming the contact layer comprises the steps of: 90. The method of claim 88,
Wherein at least one of the resins is a prepreg. 88. The method of claim 87,
And cutting the metal foil on the laminated surface of the plate-like carrier and the metal foil of the metal foil on which the carrier is adhered. 88. The method of claim 87,
Further comprising the step of separating and separating the metal foil from the plate-like carrier in at least one of the laminated metal foils with the carrier. 98. The method of claim 97,
Further comprising a step of separating and separating the metal foil from the plate-like carrier of the metal foil after the cut laminate or the carrier. 98. The method of claim 98,
Further comprising the step of removing part or all of the metal foil adhered to the plate-shaped carrier by etching. A build-up wiring board obtained by the method according to any one of claims 97 to 100. 100. A manufacturing method of a printed circuit board comprising the step of manufacturing a build-up wiring board by the method according to any one of claims 97 to 100. A resin laminated on at least one metal foil side of the laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, And repeating the lamination step one or more times to laminate the multilayer metal clad laminate. A resin, a one-sided or double-sided metal clad laminate, or a metal foil with a carrier according to claim 1, or a metal foil according to any one of claims 5 to 7, Or a laminate according to any one of claims 25 to 32, 51 to 54, 56, and 57, or a metal foil is repeated one or more times And then laminating the multilayered metal clad laminate. 104. The method of claim 103,
Wherein at least one of the resins is a prepreg. 104. The method of claim 103,
And cutting the laminate on the lamination surface of the plate-like carrier and the metal foil in the laminate. 104. The method of claim 103,
Further comprising the step of separating and separating the plate-like carrier of the metal foil having the carrier deposited thereon from the metal foil. 107. The method of claim 106,
Further comprising the step of separating and separating the metal foil from the plate-like carrier of the metal foil after the cut laminate or the carrier. 107. The method of claim 107,
And removing a part or the whole of the separated metal foil by etching. A multilayer metal clad laminate obtained by the manufacturing method according to claim 103. A step of forming at least one build-up wiring layer on the metal foil side of the laminate according to any one of claims 25 to 32, 51 to 54, 56 and 57, A method for manufacturing a build-up substrate. 111. The method of claim 111,
Wherein the build-up wiring layer is formed using at least one of a subtractive method, a pull additive method, and a semi-additive method. A resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, or a metal foil with a carrier according to any one of claims 1 to 25, A laminate according to any one of claims 32 to 51, to 54, 56 or 57, or a metal foil with a carrier according to any one of claims 5 to 7, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once. 112. The method of claim 113,
A metal foil of a laminate, a metal foil, a metal foil of a metal foil with a carrier, a plate-like carrier of a metal foil with a carrier, or a resin, Further comprising a step of performing conduction plating on side surfaces and bottom surfaces of the hole. 112. The method of claim 113,
A step of forming a wiring on at least one of a metal foil constituting the single-sided wiring board, a metal foil constituting the single-sided or double-sided metal clad laminate, a metal foil constituting the laminate, a metal foil constituting the metal foil with the carrier, Wherein the step of forming the substrate comprises the step of: A resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, or a metal foil with a carrier according to any one of claims 1 to 25, A laminate according to any one of claims 32 to 51, to 54, 56 or 57, or a metal foil with a carrier according to any one of claims 5 to 7, A method for manufacturing a build-up substrate, which comprises laminating a metal foil repeatedly at least once,
A step of forming a wiring on at least one of a metal foil constituting the single-sided wiring board, a metal foil constituting the single-sided or double-sided metal clad laminate, a metal foil constituting the laminate, a metal foil constituting the metal foil with the carrier, Wherein the step of forming the substrate comprises:
A method for manufacturing a semiconductor device, comprising the steps of: forming a metal foil on a carrier side or one side of a metal foil according to any one of claims 25 to 32, 51 to 54, and 54 Wherein the carrier side of the laminated body according to any one of claims 5 to 7 and the carrier side of the metal foil having the carrier according to any one of claims 5 to 7, &Lt; / RTI &gt; further comprising the steps of: A resin, a single-sided or double-sided wiring board, a single-sided or double-sided metal clad laminate, or a metal foil with a carrier according to any of claims 1 to 4, The laminate according to any one of claims 25 to 32, 51 to 54, 56 or 57, or the carrier according to any one of claims 5 to 7, A metal foil, or a metal foil is repeatedly laminated one or more times,
A step of forming a wiring on at least one of a metal foil constituting the single-sided wiring board, a metal foil constituting the single-sided or double-sided metal clad laminate, a metal foil constituting the laminate, a metal foil constituting the metal foil with the carrier, Wherein the step of forming the substrate comprises:
The metal foil according to any one of claims 1 to 24, wherein the resin is laminated on the wired surface and the metal foil is adhered to both sides of the resin, or a metal foil having the carrier according to any one of claims 25 to 32, 51 to 51, The laminate according to any one of claims 54, 56, and 57, or a process for laminating a metal foil with a carrier according to any one of claims 5 to 7 in which a metal foil is adhered to both surfaces, Further comprising the step of: 112. The method of claim 113,
Wherein at least one of the resins is a prepreg. 111. The method of claim 111,
And cutting the laminate on the lamination surface of the plate-like carrier and the metal foil in the laminate. 111. The method of claim 111,
Further comprising the step of separating and separating the metal foil from the laminated carrier of the metal foil on which the carrier is adhered. 120. The method of claim 119,
Further comprising a step of separating and separating the metal foil from the plate-like carrier of the metal foil after the cut laminate or the carrier. 119. The method of claim 120,
Further comprising the step of removing part or all of the metal foil adhered to the plate-shaped carrier by etching. A build-up wiring board obtained by the manufacturing method according to claim 119. A manufacturing method of a printed circuit board including a step of manufacturing a build-up wiring board by the manufacturing method according to claim 119.

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