JPH0647755A - Production of copper clad laminated sheet - Google Patents
Production of copper clad laminated sheetInfo
- Publication number
- JPH0647755A JPH0647755A JP20092692A JP20092692A JPH0647755A JP H0647755 A JPH0647755 A JP H0647755A JP 20092692 A JP20092692 A JP 20092692A JP 20092692 A JP20092692 A JP 20092692A JP H0647755 A JPH0647755 A JP H0647755A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- copper
- film
- hydroxide
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板などに
使用される銅張り積層板の製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a copper-clad laminate used for printed wiring boards and the like.
【０００２】[0002]
【従来の技術】プリント配線板は、プリプレグに銅箔を
重ねて積層成形することによって銅張り積層板を作成
し、銅張り積層板の銅箔をエッチング加工等して回路形
成することによって製造されている。そしてプリント配
線板においては回路とプリプレグによる樹脂基材との密
着性を高めて耐熱性を向上させる必要があり、このため
に、銅張り積層板において銅箔と樹脂基材との密着性を
高める必要がある。そこで従来から、電解法や圧延法で
作成される銅箔の粗面側に硫酸銅酸性電鍍浴を用いて、
樹枝状もしくは小球の銅を多数電解せしめて付着させる
ことによって、表面積を拡大したり物理的投錨効果を付
与したりして、銅箔と樹脂基材との密着性を高めること
がおこなわれている。2. Description of the Related Art A printed wiring board is manufactured by forming a copper-clad laminate by laminating and forming a copper foil on a prepreg and forming a circuit by etching the copper foil of the copper-clad laminate. ing. In the printed wiring board, it is necessary to improve the heat resistance by increasing the adhesion between the circuit and the resin base material by the prepreg. For this reason, in the copper-clad laminate, increase the adhesion between the copper foil and the resin base material. There is a need. Therefore, conventionally, using a copper sulfate acidic electroplating bath on the rough surface side of the copper foil created by the electrolytic method or rolling method,
By electrolyzing a large number of dendritic or small spheres of copper and adhering them, the surface area can be increased or a physical anchoring effect can be added to enhance the adhesion between the copper foil and the resin base material. There is.
【０００３】[0003]
【発明が解決しようとする課題】しかし、実装密度の高
度化などに対応するためにプリント回路が緻密化してお
り、これに伴って回路幅の狭小化が進行している近年、
上記のように樹枝状もしくは小球の銅を付着させて銅箔
を粗面化させる方法では、微細な銅がエッチング除去さ
れずに残留したりするおそれがあり、絶縁劣化を起こし
たりするおそれがある。However, in recent years, the printed circuit is becoming denser in order to cope with the higher packaging density, and the circuit width is being narrowed accordingly.
In the method of roughening the copper foil by attaching dendritic or small spherical copper as described above, fine copper may remain without being removed by etching, which may cause insulation deterioration. is there.
【０００４】本発明は上記の点に鑑みてなされたもので
あり、樹枝状や小球の銅を付着させたりする必要なく銅
箔と樹脂基材との密着性を高めて耐熱性を向上させるこ
とができる銅張り積層板の製造方法を提供することを目
的とするものである。The present invention has been made in view of the above points, and improves the heat resistance by increasing the adhesion between the copper foil and the resin base material without the need to attach dendritic or small spherical copper. It is an object of the present invention to provide a method for producing a copper-clad laminate that can be manufactured.
【０００５】[0005]
【課題を解決するための手段】本発明に係る銅張り積層
板の製造方法は、銅箔の表面にＳｉ又はＺｒ又はＴｉの
酸化物あるいは水酸化物を主体とする皮膜を形成する処
理をおこない、銅箔のこの皮膜形成面にプリプレグを重
ねて積層成形することを特徴とするものである。In the method for producing a copper clad laminate according to the present invention, a treatment for forming a film mainly composed of an oxide or hydroxide of Si, Zr or Ti on the surface of a copper foil is carried out. It is characterized in that a prepreg is laminated on the film-forming surface of the copper foil to form a laminate.
【０００６】本発明にあって、金属アルコキシドを配合
した処理液で銅箔の表面を処理することによって、銅箔
の表面に金属酸化物あるいは金属水酸化物の皮膜を形成
することができる。また本発明において、金属酸化物あ
るいは金属水酸化物の皮膜は厚みが１ｎｍ〜１μｍであ
ることが好ましい。According to the present invention, a metal oxide or metal hydroxide film can be formed on the surface of the copper foil by treating the surface of the copper foil with a treatment liquid containing a metal alkoxide. In the present invention, the metal oxide or metal hydroxide film preferably has a thickness of 1 nm to 1 μm.
【０００７】以下、本発明を詳細に説明する。本発明に
おいて表面処理の対象とする銅箔としては、電解銅箔や
圧延銅箔など特に限定されることなく使用することがで
きるものであり、この銅箔の表面にＳｉ又はＺｒ又はＴ
ｉの金属酸化物や金属水酸化物を主体とする皮膜を形成
する。このような金属酸化物や金属水酸化物の皮膜の形
成は、Ｓｉ又はＺｒ又はＴｉの金属アルコキシドを有機
溶剤に添加して均一になるように十分に攪拌して溶解又
は分散させることによって処理液を調製し、この処理液
中に銅箔を浸漬したり、あるいは銅箔の表面に処理液を
スプレーしたりした後、乾燥させることによっておこな
うことができる。これらの金属アルコキシドは、一般式
を次のように表すことができる。The present invention will be described in detail below. The copper foil to be subjected to the surface treatment in the present invention can be used without particular limitation such as electrolytic copper foil or rolled copper foil, and Si or Zr or T can be used on the surface of this copper foil.
A film mainly composed of the metal oxide or metal hydroxide of i is formed. Such a metal oxide or metal hydroxide film is formed by adding a metal alkoxide of Si, Zr, or Ti to an organic solvent and sufficiently stirring the solution to uniformly dissolve or disperse the treatment solution. Can be prepared by immersing a copper foil in this treatment solution, or spraying the treatment solution on the surface of the copper foil, and then drying. The general formula of these metal alkoxides can be represented as follows.
【０００８】Ｘ（ＯＲ）n 但し、Ｘ；Ｓｉ，Ｚｒ，Ｔｉ Ｒ；Ｈ，ＣＨ3 ，Ｃ2 Ｈ5 ，Ｃ3 Ｈ7 … ｎ；１，２，３，４… 金属アルコキシドの具体例を挙げると、Ｓｉ（ＯＣ
Ｈ3 ）4 、Ｓｉ（ＯＣ2 Ｈ 5 ）4 、Ｓｉ（ＯＣ3 Ｈ7 ）
4 等や、Ｔｉ（ＯＣＨ3 ）4 、Ｔｉ（ＯＣ2 Ｈ5 ） 4 、
Ｔｉ（ＯＣ3 Ｈ7 ）4 等や、Ｚｒ（ＯＣＨ3 ）4 、Ｚｒ
（ＯＣ2 Ｈ5 ）4 、Ｚｒ（ＯＣ3 Ｈ7 ）4 等がある。X (OR)n However, X; Si, Zr, Ti R; H, CH3, C2HFive, C3H7N: 1, 2, 3, 4 ... Specific examples of the metal alkoxide include Si (OC).
H3)Four, Si (OC2H Five)Four, Si (OC3H7)
FourEtc., Ti (OCH3)Four, Ti (OC2HFive) Four,
Ti (OC3H7)FourEtc., Zr (OCH3)Four, Zr
(OC2HFive)Four, Zr (OC3H7)FourEtc.
【０００９】金属アルコキシドを溶解あるいは分散して
調製した処理液中の金属アルコキシドの濃度は、特に限
定されるものではないが、０．０５重量％〜５０重量％
の範囲が好ましい。また金属アルコキシドの加水分解を
促進するために少量の酢酸や塩酸などの酸を添加するこ
ともできる。さらに、銅箔と樹脂基材との密着性をさら
に向上させるために、微量のシリカ微粒子等の無機充填
剤を十分に攪拌して均一に分散させて添加することもで
きる。The concentration of the metal alkoxide in the treatment liquid prepared by dissolving or dispersing the metal alkoxide is not particularly limited, but is 0.05% by weight to 50% by weight.
Is preferred. Further, a small amount of acid such as acetic acid or hydrochloric acid may be added to accelerate the hydrolysis of the metal alkoxide. Further, in order to further improve the adhesiveness between the copper foil and the resin base material, a small amount of an inorganic filler such as silica fine particles may be sufficiently stirred and uniformly dispersed and added.
【００１０】また、銅箔の表面にＳｉ又はＺｒ又はＴｉ
の金属酸化物や金属水酸化物の皮膜を形成するにあたっ
て、金属アルコキシドを用いる他に、金属の塩化物など
を用いることもできる。金属の塩化物としては、例えば
ＳｉＣｌ4 などを用いることができるものであり、これ
を有機溶剤に溶解乃至分散させて処理液を調製し、同様
にして銅箔の表面の処理に供することができる。Further, Si, Zr or Ti is formed on the surface of the copper foil.
In forming the film of the metal oxide or the metal hydroxide, a metal chloride or the like can be used in addition to the metal alkoxide. As the metal chloride, for example, SiCl 4 or the like can be used, and this can be dissolved or dispersed in an organic solvent to prepare a treatment liquid, which can be similarly subjected to the treatment of the surface of the copper foil. .
【００１１】上記のように処理液で銅箔の表面を処理す
ることによって銅箔の表面に金属酸化物あるいは金属水
酸化物の皮膜が形成される機構を、Ｓｉ（ＯＣ2 Ｈ5 ）
4 あるいはＳｉＣｌ4 を用いた場合を例にとって説明す
る。先ずＳｉ（ＯＣ2 Ｈ5 ） 4 やＳｉＣｌ4 は処理液中
で加水分解によりＳｉ（ＯＨ）4 となる。そして図１
（ａ）に示すようにこのＳｉ（ＯＨ）4 が銅箔の表面に
吸着されているＯＨに作用し、図１（ｂ）のようにＳｉ
の水酸化物が銅箔の表面に結合されたり、あるいはＳｉ
に結合する一部のＯＨ基の脱水縮合によって図１（ｃ）
のようにＳｉの酸化物として銅箔の表面に結合された
り、さらにはＳｉの酸化物と水酸化物との混在物として
銅箔の表面に結合されたりすることになり、Ｓｉの酸化
物や水酸化物の皮膜を銅箔の表面に形成することができ
るものである。ＺｒやＴｉの場合も同様にしてこれらの
金属酸化物や水酸化物の皮膜を銅箔の表面に形成するこ
とができる。金属酸化物や水酸化物の皮膜は１ナノメー
トル〜１ミクロンメートル（１ｎｍ〜１μｍ）の厚みで
形成するのが好ましい。The surface of the copper foil is treated with the treatment liquid as described above.
The surface of the copper foil can be exposed to metal oxides or water.
The mechanism by which the oxide film is formed is2HFive)
FourOr SiClFourAn example of using
It First, Si (OC2HFive) FourAnd SiClFourIs in the processing liquid
By hydrolysis with Si (OH)FourBecomes And Figure 1
As shown in (a), this Si (OH)FourOn the surface of the copper foil
It acts on the adsorbed OH and, as shown in Fig. 1 (b), Si
Hydroxide is bonded to the surface of copper foil, or Si
1 (c) by dehydration condensation of some OH groups bound to
Bonded to the surface of the copper foil as an oxide of Si like
Furthermore, as a mixture of Si oxide and hydroxide
It will be bonded to the surface of the copper foil and oxidation of Si will occur.
Can form a film of metal or hydroxide on the surface of copper foil
It is something. Similarly, in the case of Zr and Ti, these
A film of metal oxide or hydroxide can be formed on the surface of copper foil.
You can Metal oxide or hydroxide film is 1 nm
With a thickness of 1 to 1 micrometer (1 nm to 1 μm)
It is preferably formed.
【００１２】このように銅箔の表面にＳｉ又はＺｒ又は
Ｔｉの金属酸化物や金属水酸化物の皮膜を形成すること
によって、銅箔の表面を粗面化し、樹脂基材との密着性
を高めることができるものである。ここで、既述のよう
に表面処理液にシリカ微粒子等の無機充填剤を添加して
おくと、無機充填剤が核になって金属酸化物や金属水酸
化物による銅箔の表面粗化を補強することができ、銅箔
と樹脂基材との密着性をさらに高めることができるもの
である。また無機充填剤が引き剥がし時にかかる応力を
緩和して密着性を高める作用もなすものである。By thus forming a film of a metal oxide or metal hydroxide of Si, Zr, or Ti on the surface of the copper foil, the surface of the copper foil is roughened and the adhesion to the resin substrate is improved. It can be raised. Here, as described above, when an inorganic filler such as silica fine particles is added to the surface treatment liquid, the inorganic filler serves as a nucleus to roughen the surface of the copper foil with a metal oxide or a metal hydroxide. It can be reinforced and the adhesion between the copper foil and the resin substrate can be further enhanced. Further, the inorganic filler also acts to relieve the stress applied at the time of peeling and to enhance the adhesiveness.
【００１３】そして、上記のように表面処理した銅箔の
皮膜形成面に、ガラス布等の基材にエポキシ樹脂等の熱
硬化性樹脂を含浸乾燥して調製したプリプレグを重ね、
これを加熱加圧して積層成形することによって、プリプ
レグによる樹脂基材に銅箔を積層した銅張り積層板を製
造することができるものである。さらにこの銅張り積層
板の表面の銅箔をエッチング加工等して回路形成をする
ことによって、プリント配線板を製造することができ
る。ここで、銅箔に形成した金属酸化物や金属水酸化物
の皮膜は導電性がなく、従って絶縁劣化を起こしたりす
るようなおそれはない。Then, a prepreg prepared by impregnating a base material such as glass cloth with a thermosetting resin such as an epoxy resin and drying it is laminated on the film forming surface of the copper foil surface-treated as described above,
By heat-pressing this and laminating-molding it, it is possible to manufacture a copper-clad laminate in which a copper foil is laminated on a resin base material by a prepreg. Further, a printed wiring board can be manufactured by forming a circuit by etching the copper foil on the surface of the copper-clad laminate. Here, the metal oxide or metal hydroxide film formed on the copper foil is not conductive, and therefore there is no fear of causing insulation deterioration.
【００１４】[0014]
【実施例】次に、本発明を実施例によって具体的に説明
する。 （実施例１） 酸性硫酸銅メッキ浴を用いてチタン製陰極面に電解さ
せることによって厚み３５μｍの銅箔を作成し、この銅
箔を陰極から剥離した後に水洗した。 次に、 ・日本曹達株式会社製「アトロンＳｉ−５００」（Ｓｉ主成分） …３００ｇ ・酢酸エチル …１５００ｇ の組成の表面処理液を３０℃に調製し、この処理液を銅
箔の粗面側に均一にスプレーして表面に厚さ５０〜１０
０ナノメートルのＳｉの酸化物と水酸化物からなる皮膜
を形成し、さらに１５０℃で５時間乾燥した。 上記のように処理した２枚の銅箔を皮膜形成面を内側
にし、この銅箔の間に厚み０．１５ｍｍのガラス布基材
エポキシ樹脂プリプレグを８枚挟み、１７０℃、４０ｋ
ｇ／ｃｍ2 、１２０分間の条件で加熱加圧して積層成形
することによって、両面銅張り樹脂積層板を得た。EXAMPLES Next, the present invention will be specifically described with reference to examples. Example 1 A copper foil having a thickness of 35 μm was prepared by electrolyzing the titanium cathode surface using an acidic copper sulfate plating bath, and the copper foil was peeled from the cathode and washed with water. Next, a surface treatment solution having a composition of "Atron Si-500" (Si main component) manufactured by Nippon Soda Co., Ltd., 300 g, and ethyl acetate, 1500 g was prepared at 30 ° C. Spray evenly on the surface to a thickness of 50 to 10
A film consisting of 0 nm of Si oxide and hydroxide was formed and further dried at 150 ° C. for 5 hours. The two copper foils treated as described above were made to have the film forming surface inside, and eight glass cloth base material epoxy resin prepregs having a thickness of 0.15 mm were sandwiched between the copper foils, and 170 ° C., 40 k
A double-sided copper-clad resin laminate was obtained by heating and pressurizing under a condition of g / cm 2 for 120 minutes to laminate-form.
【００１５】（実施例２）実施例１におけるの工程で
の表面処理液を、 ・ＳｉＣｌ4 …１２ｇ ・トルエン …２リットル の組成で調製し、処理条件及び処理法は実施例１と同様
にして銅箔の粗面側の表面に厚さ８０〜２００ナノメー
トルの皮膜を形成し、同様に乾燥した後、実施例１の
と同様にして両面銅張り樹脂積層板を得た。(Example 2) The surface treatment liquid used in the step of Example 1 was prepared with the composition of: SiCl 4 ... 12 g Toluene ... 2 liters, and the treating conditions and the treating method were the same as in Example 1. A double-sided copper-clad resin laminate was obtained in the same manner as in Example 1 after forming a film having a thickness of 80 to 200 nm on the rough surface of the copper foil and drying it in the same manner.
【００１６】（実施例３）実施例１におけるの工程で
の表面処理液を、 ・Ｓｉ（ＯＣ2 Ｈ5 ）4 …２０ｇ ・イソプロピルアルコール …２リットル ・０．０１Ｎ−ＨＣｌ …７２ミリリットル の組成で調製し、処理条件及び処理法は実施例１と同様
にして銅箔の粗面側の表面に厚さ５０〜１５０ナノメー
トルの皮膜を形成し、同様に乾燥した後、実施例１の
と同様にして両面銅張り樹脂積層板を得た。(Example 3) The surface treatment liquid used in the step of Example 1 was prepared as follows: Si (OC 2 H 5 ) 4 ... 20 g Isopropyl alcohol 2 liter 0.01 N-HCl 72 ml Preparation, treatment conditions and treatment method are the same as in Example 1 after forming a film having a thickness of 50 to 150 nm on the rough surface of the copper foil and drying in the same manner as in Example 1. Then, a double-sided copper-clad resin laminated plate was obtained.
【００１７】（実施例４）実施例１におけるの工程で
の表面処理液を、 ・Ｓｉ（ＯＣ2 Ｈ5 ）4 …２０ｇ ・イソプロピルアルコール …２リットル ・０．０１Ｎ−ＨＣｌ …７２ミリリットル ・シリカ微粉末 …１０ｇ の組成で調製し、処理条件及び処理法は実施例１と同様
にして銅箔の粗面側の表面に厚さ２００〜４００ナノメ
ートルの皮膜を形成し、同様に乾燥した後、実施例１の
と同様にして両面銅張り樹脂積層板を得た。(Example 4) The surface treatment liquid used in the step of Example 1 was: Si (OC 2 H 5 ) 4 20 g Isopropyl alcohol 2 liter 0.01 N-HCl 72 ml Powder ... 10 g of the composition was prepared, and the treatment conditions and the treatment method were the same as in Example 1 to form a film having a thickness of 200 to 400 nanometers on the rough surface of the copper foil, and similarly dried, A double-sided copper-clad resin laminate was obtained in the same manner as in Example 1.
【００１８】（実施例５）実施例１におけるの工程で
の表面処理液を、 ・Ｚｒ（ＯＣ4 Ｈ9 ）4 …２１ｇ ・トルエン …２リットル の組成で調製し、処理条件及び処理法は実施例１と同様
にして銅箔の粗面側の表面に厚さ１００〜２００ナノメ
ートルの皮膜を形成し、同様に乾燥した後、実施例１の
と同様にして両面銅張り樹脂積層板を得た。(Example 5) The surface treatment liquid in the step of Example 1 was prepared with the composition of: Zr (OC 4 H 9 ) 4 ... 21 g Toluene ... 2 liters, and the treatment conditions and treatment method were carried out. A 100 to 200 nanometer thick film is formed on the rough surface of the copper foil in the same manner as in Example 1, dried in the same manner, and then a double-sided copper-clad resin laminate is obtained in the same manner as in Example 1. It was
【００１９】（実施例６）実施例１におけるの工程で
の表面処理液を、 ・Ｔｉ（ＯＣ3 Ｈ7 ）4 …２１ｇ ・ｎ−ブタノール …１リットル ・エタノール …１リットル の組成で調製し、処理条件及び処理法は実施例１と同様
にして銅箔の粗面側の表面に厚さ１５０〜２５０ナノメ
ートルの皮膜を形成し、同様に乾燥した後、実施例１の
と同様にして両面銅張り樹脂積層板を得た。(Example 6) A surface treatment solution in the step of Example 1 was prepared with the composition of: Ti (OC 3 H 7 ) 4 ... 21 g n-Butanol 1 liter Ethanol 1 liter, The treatment conditions and the treatment method were the same as in Example 1 except that a film having a thickness of 150 to 250 nanometers was formed on the rough surface of the copper foil and dried in the same manner. A copper-clad resin laminate was obtained.
【００２０】（比較例）実施例１において、の工程の
後、の処理はおこなわないで、後はと同様にして両
面銅張り樹脂積層板を得た。上記実施例１乃至６及び比
較例で得た両面銅張り積層板について、銅箔引き剥がし
強度と煮沸半田耐熱性を測定した。尚、銅箔引き剥がし
強度は、ＪＩＳ規格Ｃ６４８１に基づいて、常態及び煮
沸２時間処理後のものについて銅箔の引き剥がし試験を
おこなって測定した。また煮沸半田耐熱性は、２時間煮
沸処理した後２６０℃の半田浴に３０秒間浸漬して測定
をおこない、銅箔と樹脂基材との間の状態を観察し、異
常なしの場合を「○」、デラミネーション有りの場合を
「×」として評価した。これらの結果を次表に示す。Comparative Example A double-sided copper-clad resin laminated plate was obtained in the same manner as in Example 1, except that the process after step 1 was not performed. The copper foil peeling strength and boiling solder heat resistance of the double-sided copper-clad laminates obtained in Examples 1 to 6 and Comparative Example were measured. The copper foil peeling strength was measured based on JIS standard C6481 by conducting a copper foil peeling test on the normal state and the one after boiling for 2 hours. The boiling soldering heat resistance was measured by immersing it in a solder bath at 260 ° C for 30 seconds after boiling it for 2 hours and observing the condition between the copper foil and the resin substrate. , And the case with delamination was evaluated as “x”. The results are shown in the table below.
【００２１】[0021]
【表１】 [Table 1]
【００２２】表にみられるように、各実施例のものは比
較例のものに比べて良好な銅箔引き剥がし強度と高い半
田耐熱性を示しており、良好な密着性が得られたことが
確認される。As can be seen from the table, each of the examples showed better copper foil peeling strength and higher solder heat resistance than the comparative examples, and it was found that good adhesion was obtained. It is confirmed.
【００２３】[0023]
【発明の効果】上記のように本発明は、銅箔の表面にＳ
ｉ又はＺｒ又はＴｉの酸化物あるいは水酸化物を主体と
する皮膜を形成する処理をおこない、銅箔のこの皮膜形
成面にプリプレグを重ねて積層成形することによって銅
張り積層板を製造するようにしたので、ＳｉやＺｒやＴ
ｉの酸化物あるいは水酸化物の皮膜で銅箔の表面を粗面
化し、樹脂基材との密着性を高めて銅張り積層板の耐熱
性を向上させることができるものであり、しかもこれら
の酸化物や水酸化物は導電性を有しないために、絶縁劣
化が発生するようなおそれがないものである。As described above, according to the present invention, S is formed on the surface of the copper foil.
A copper-clad laminate is manufactured by performing a treatment for forming a film mainly composed of an oxide or hydroxide of i, Zr, or Ti, and laminating and forming a prepreg on the film forming surface of the copper foil. Since it was done, Si, Zr and T
The surface of the copper foil can be roughened with the oxide or hydroxide film of i to improve the adhesiveness with the resin base material and improve the heat resistance of the copper-clad laminate. Since oxides and hydroxides do not have conductivity, there is no fear that insulation deterioration will occur.
【図１】金属酸化物や金属水酸化物が銅箔の表面に形成
される機構を示すものであり、（ａ），（ｂ），（ｃ）
はそれぞれ説明図である。FIG. 1 shows the mechanism by which metal oxides or metal hydroxides are formed on the surface of a copper foil, and (a), (b), (c).
Are explanatory views, respectively.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｋ 105:06 Ｂ２９Ｌ 31:34 4Ｆ (72)発明者 吉光 時夫 大阪府門真市大字門真1048番地松下電工株 式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification number Reference number within the agency FI Technical indication location // B29K 105: 06 B29L 31:34 4F (72) Inventor Tokio Yoshimitsu Otomon, Kadoma City, Osaka Prefecture No. 1048 Matsushita Electric Works Co., Ltd.
Claims (3)
化物あるいは水酸化物を主体とする皮膜を形成する処理
をおこない、銅箔のこの皮膜形成面にプリプレグを重ね
て積層成形することを特徴とする銅張り積層板の製造方
法。1. A process of forming a film mainly composed of an oxide or hydroxide of Si, Zr, or Ti on the surface of a copper foil, and laminating and forming a prepreg on the film forming surface of the copper foil. A method for producing a copper-clad laminate characterized by the above.
箔の表面を処理することによって、銅箔の表面に金属酸
化物あるいは金属水酸化物の皮膜を形成することを特徴
とする請求項１に記載の銅張り積層板の製造方法。2. The coating of a metal oxide or a metal hydroxide is formed on the surface of the copper foil by treating the surface of the copper foil with a treatment liquid containing a metal alkoxide. A method for producing the copper-clad laminate described above.
を１ｎｍ〜１μｍの厚みで形成することを特徴とする請
求項１又は２に記載の銅張り積層板の製造方法。3. The method for producing a copper-clad laminate according to claim 1, wherein the metal oxide or metal hydroxide film is formed to a thickness of 1 nm to 1 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20092692A JPH0647755A (en) | 1992-07-28 | 1992-07-28 | Production of copper clad laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20092692A JPH0647755A (en) | 1992-07-28 | 1992-07-28 | Production of copper clad laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0647755A true JPH0647755A (en) | 1994-02-22 |
Family
ID=16432582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20092692A Withdrawn JPH0647755A (en) | 1992-07-28 | 1992-07-28 | Production of copper clad laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0647755A (en) |
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| JP2006035066A (en) * | 2004-07-26 | 2006-02-09 | Seiko Epson Corp | Method for forming chemical adsorption film and chemical adsorption film |
| WO2014046259A1 (en) * | 2012-09-20 | 2014-03-27 | Jx日鉱日石金属株式会社 | Metallic foil having carrier |
| CN104943255A (en) * | 2014-03-25 | 2015-09-30 | Jx日矿日石金属株式会社 | Surface processing copper foil, bonding copper lamination plate, printed distribution board, electronic device, semiconductor package and making method of the printed distribution board |
| JP2015212426A (en) * | 2015-08-11 | 2015-11-26 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, copper-clad laminate sheet, printed wiring board, electronic apparatus, semiconductor package, production method of printed wiring board, production method of resin substrate, method of transferring surface profile of copper foil to resin substrate and resin substrate |
| JP2016135924A (en) * | 2016-02-29 | 2016-07-28 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper-clad laminate, method for producing printed wiring board, method for producing semiconductor package and method for producing electronic apparatus |
| JPWO2014046291A1 (en) * | 2012-09-24 | 2016-08-18 | Ｊｘ金属株式会社 | Metal foil with carrier, laminate made of resinous plate carrier and metal foil, and uses thereof |
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| CN107710890A (en) * | 2015-08-03 | 2018-02-16 | Ｊｘ金属株式会社 | Manufacture method, surface treatment copper foil, laminate, printing distributing board, semiconductor packages and the e-machine of printing distributing board |
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-
1992
- 1992-07-28 JP JP20092692A patent/JPH0647755A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006035066A (en) * | 2004-07-26 | 2006-02-09 | Seiko Epson Corp | Method for forming chemical adsorption film and chemical adsorption film |
| WO2014046259A1 (en) * | 2012-09-20 | 2014-03-27 | Jx日鉱日石金属株式会社 | Metallic foil having carrier |
| JPWO2014046259A1 (en) * | 2012-09-20 | 2016-08-18 | Ｊｘ金属株式会社 | Metal foil with carrier |
| JPWO2014046291A1 (en) * | 2012-09-24 | 2016-08-18 | Ｊｘ金属株式会社 | Metal foil with carrier, laminate made of resinous plate carrier and metal foil, and uses thereof |
| TWI639515B (en) * | 2014-03-21 | 2018-11-01 | Ｊｘ日鑛日石金屬股份有限公司 | A metal foil with a carrier |
| JP2015183240A (en) * | 2014-03-25 | 2015-10-22 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, copper-clad laminate, print circuit board, electronic apparatus, circuit forming base plate for semiconductor package, semiconductor package, and method for manufacturing print circuit board |
| CN104943255A (en) * | 2014-03-25 | 2015-09-30 | Jx日矿日石金属株式会社 | Surface processing copper foil, bonding copper lamination plate, printed distribution board, electronic device, semiconductor package and making method of the printed distribution board |
| WO2017022807A1 (en) * | 2015-08-03 | 2017-02-09 | Ｊｘ金属株式会社 | Printed wiring board production method, surface-treated copper foil, laminate, printed wiring board, semiconductor package, and electronic device |
| CN107710890A (en) * | 2015-08-03 | 2018-02-16 | Ｊｘ金属株式会社 | Manufacture method, surface treatment copper foil, laminate, printing distributing board, semiconductor packages and the e-machine of printing distributing board |
| JP2015212426A (en) * | 2015-08-11 | 2015-11-26 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, copper-clad laminate sheet, printed wiring board, electronic apparatus, semiconductor package, production method of printed wiring board, production method of resin substrate, method of transferring surface profile of copper foil to resin substrate and resin substrate |
| WO2017051897A1 (en) * | 2015-09-24 | 2017-03-30 | Ｊｘ金属株式会社 | Metal foil, metal foil with mold release layer, laminate, printed wiring board, semiconductor package, electronic device and method for producing printed wiring board |
| JPWO2017051897A1 (en) * | 2015-09-24 | 2018-08-30 | Ｊｘ金属株式会社 | Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device and method for manufacturing printed wiring board |
| JP2016135924A (en) * | 2016-02-29 | 2016-07-28 | Ｊｘ金属株式会社 | Surface-treated copper foil, copper-clad laminate, method for producing printed wiring board, method for producing semiconductor package and method for producing electronic apparatus |
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Legal Events
| Date | Code | Title | Description |
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| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991005 |