JP2001152032A - Thermosetting resin composition, prepreg, laminated board and printed circuit board - Google Patents
Thermosetting resin composition, prepreg, laminated board and printed circuit boardInfo
- Publication number
- JP2001152032A JP2001152032A JP33221799A JP33221799A JP2001152032A JP 2001152032 A JP2001152032 A JP 2001152032A JP 33221799 A JP33221799 A JP 33221799A JP 33221799 A JP33221799 A JP 33221799A JP 2001152032 A JP2001152032 A JP 2001152032A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- thermosetting resin
- resin composition
- black
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、熱硬化性樹脂組成
物、プリプレグ、積層板及びプリント配線板に関する。The present invention relates to a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は、繊維基材に熱硬化性
樹脂組成物のワニスを含浸乾燥してなるプリプレグを１
枚または所要枚数重ねた構成体を加熱加圧成形して積層
板を得、この積層板を基板として、その表面に回路を形
成して製造される。通常、積層板を製造するときに銅は
くなど金属はくなどを同時に重ねて金属はく張り積層板
とし、この金属はくをエッチングして回路を形成してい
る。2. Description of the Related Art A printed wiring board is prepared by impregnating and drying a varnish of a thermosetting resin composition on a fiber base material.
The laminated body is formed by heating and press forming the laminated body or a required number of laminated bodies to obtain a laminated board, and using the laminated board as a substrate to form a circuit on the surface thereof. Usually, when manufacturing a laminate, metal foil such as copper foil is simultaneously laminated to form a metal-clad laminate, and the metal foil is etched to form a circuit.
【０００３】近年、半導体搭載用パッケージ.などの用
途に用いられるプリント配線板の基板は黒色を基調とす
るものが主流となっている。それは、ワイヤボンディン
グの良否判定が容易になること、外観的に高級感が得ら
れること、及び露光工程において紫外線が反対面に透過
して反対面にあるレジストが感光していわゆる裏ぼけを
おこすのを防ぐためである。基板を黒色とする手法とし
ては、積層板を製造するためのプリプレグに黒色の繊維
基材を用いる手法や、熱硬化性樹脂組成物にカーボンブ
ラック、スピリットブラックなどのカーボン系顔料を配
合する手法が知られている。In recent years, printed wiring boards used for applications such as semiconductor mounting packages are mainly based on black. That is, it is easy to judge the quality of wire bonding, a high-grade appearance can be obtained, and in the exposure process, ultraviolet rays are transmitted to the opposite surface and the resist on the opposite surface is exposed, causing so-called back blurring. It is to prevent. As a method for making the substrate black, there is a method of using a black fiber base material for a prepreg for manufacturing a laminate, or a method of blending a carbon-based pigment such as carbon black or spirit black with a thermosetting resin composition. Are known.
【０００４】ところが、黒色の繊維基材を用いて基板を
黒色とする手法では、繊維基材に隙間があるため必ずし
も十分な紫外線遮蔽性が得られず、また繊維基材が十分
な黒さを有していない場合があり外観上の問題もあっ
た。また、熱硬化性樹脂組成物にカーボンブラック、ス
ピリットブラック等のカーボン系顔料を配合する手法で
は、カーボン自体が導電性を有するために基板の絶縁性
低下、及び電食による回路間の絶縁低下を生じやすかっ
た。このためプリント配線板としての信頼性(以下単に
信頼性とする)が低下するという問題があった。[0004] However, in the method of using a black fiber base material to make the substrate black, it is not always possible to obtain a sufficient ultraviolet shielding property because the fiber base material has gaps, and the fiber base material has a sufficient blackness. In some cases, it did not have, and there was also a problem in appearance. In addition, in the method of blending a carbon-based pigment such as carbon black or spirit black into the thermosetting resin composition, the carbon itself has conductivity, so that the insulation of the substrate is reduced, and the insulation between circuits due to electrolytic corrosion is reduced. It was easy to happen. For this reason, there has been a problem that the reliability as a printed wiring board (hereinafter simply referred to as reliability) is reduced.
【０００５】本発明は、かかる実状に鑑みなされたもの
で、請求項１に記載の発明は、紫外線を十分に遮蔽する
ことができ、絶縁性及び信頼性の低下がない積層板を製
造するために好適な熱硬化性樹脂組成物を提供すること
を目的とする。請求項２に記載の発明は、プリント配線
板として絶縁性及び信頼性の低下がない積層板を製造す
るために好適なプリプレグを提供することを目的とす
る。請求項３に記載の発明は、プリント配線板として絶
縁性及び信頼性の低下がない積層板を提供することを目
的とする。請求項４に記載の発明は、絶縁性及び信頼性
の低下がないプリント配線板を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and the invention according to claim 1 is intended to manufacture a laminated board which can sufficiently shield ultraviolet rays and has no reduction in insulation and reliability. It is an object of the present invention to provide a thermosetting resin composition that is suitable for: It is an object of the present invention to provide a prepreg suitable for manufacturing a laminate having no deterioration in insulation and reliability as a printed wiring board. A third object of the present invention is to provide a laminate as a printed wiring board which does not have a decrease in insulation and reliability. A fourth object of the present invention is to provide a printed wiring board having no deterioration in insulation and reliability.
【０００６】[0006]
【課題を解決するための手段】すなわち、本発明は、下
記構造式で示される黒色染料を含有してなる熱硬化性樹
脂組成物、プリプレグ、積層板及びプリント配線板に関
する。That is, the present invention relates to a thermosetting resin composition, a prepreg, a laminate, and a printed wiring board containing a black dye represented by the following structural formula.
【化２】 Embedded image
【０００７】[0007]
【発明の実施の形態】構造式が化２で示される化合物
は、ソルベントブラック３として知られている黒色染料
であり、この染料は市販品を使用することができる。市
販品としては、中央合成化学株式会社からChuo Sudan B
lack１４１という商品名で市販されているものなどを挙
げることができる。BEST MODE FOR CARRYING OUT THE INVENTION The compound represented by the chemical formula 2 is a black dye known as Solvent Black 3, and a commercially available dye can be used. As a commercial product, Chuo Sudan B
A product marketed under the trade name lack141 can be used.
【０００８】熱硬化性樹脂組成物のべースとなる熱硬化
性樹脂としては、積層板製造において汎用されている熱
硬化性樹脂を用いることができ特に制限はない。例え
ば、エポキシ樹脂、ビスマレイミド樹脂、ポリイミド樹
脂、フェノール樹脂、不飽和ポリエステル樹脂などを挙
げられる。なかでも、エポキシ樹脂が好ましく用いられ
る。エポキシ樹脂としては、分子内に２個以上のエポキ
シ基を持つ化合物であればよく、例えばフェノールノボ
ラック型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂、レゾール型エポキシ樹脂、ビスフェノール型エ
ポキシ樹脂などのフェノール類のグリシジルエーテルで
あるエポキシ樹脂(フェノール型エポキシ樹脂)や、脂環
式エポキシ樹脂、エポキシ化ポリブタジエン、グリシジ
ルエステル型エポキシ樹脂、グリシジルアミン型エポキ
シ樹脂、イソシアヌレート型エポキシ樹脂、可とう性エ
ポキシ樹脂などが挙げられる。これらの多官能エポキシ
樹脂は、単独で用いてもよく、２種類以上を併用しても
よい。The thermosetting resin used as the base of the thermosetting resin composition is not particularly limited, and thermosetting resins commonly used in the production of laminates can be used. For example, an epoxy resin, a bismaleimide resin, a polyimide resin, a phenol resin, an unsaturated polyester resin, and the like can be given. Among them, an epoxy resin is preferably used. The epoxy resin may be any compound having two or more epoxy groups in the molecule. For example, phenol glycidyl such as phenol novolak type epoxy resin, cresol novolak type epoxy resin, resol type epoxy resin and bisphenol type epoxy resin Epoxy resins that are ethers (phenol-type epoxy resins), alicyclic epoxy resins, epoxidized polybutadienes, glycidyl ester-type epoxy resins, glycidylamine-type epoxy resins, isocyanurate-type epoxy resins, flexible epoxy resins, and the like. . These polyfunctional epoxy resins may be used alone or in combination of two or more.
【０００９】熱硬化性エポキシ樹脂としてエポキシ樹脂
を用いたときには、エポキシ樹脂を硬化させるため、硬
化剤及び硬化促進剤が配合される。硬化剤としては、ノ
ボラック型フェノール樹脂、ジシアンジアミド、酸無水
物、アミン類などが挙げられ、硬化促進剤としては、イ
ミダゾール類などが挙げられる。これらは単独で用いて
もよく、２種類以上併用してもよい。また、硬化剤及び
硬化促進剤は用いられる多官能エポキシ樹脂の量に応じ
て必要とされる範囲で配合される。硬化剤は、エポキシ
樹脂のエポキシ基１当量に対して、硬化剤の官能基が
０．８〜１．２当量の範囲となるように配合されるのが
好ましく、０．８０〜１．１当量の範囲となるように配
合されるのがより好ましい。硬化剤の官能基が０．８当
量未満の場合、及び１．２当量を超えるいずれの場合
も、ガラス転移点が低くなり、吸湿しやすくなるため、
はんだ耐熱性が低下する傾向にある。また、硬化促進剤
としては従来公知の種々のものを使用することができ、
特に制限はない。例えば熱硬化性樹脂としてエポキシ樹
脂を用いる場合には、イミダゾール系化合物、有機リン
系作合物、第３級アミン、第４級アンモニウム塩などが
挙げられる。これら硬化促進剤は、単独で使用してもよ
く、２種類以上を併用してもよい。熱硬化性樹脂、必要
により配合される硬化剤のほか、機械特性改善、増量に
よる原価低減などの観点から無機充填剤を配合すること
もできる。このような無機充填剤としては、アルミナ・
微粉末シリカ、水酸化アルミニウム、ケイ酸ジルコニウ
ム、タルクなどが挙げられる。When an epoxy resin is used as the thermosetting epoxy resin, a curing agent and a curing accelerator are blended to cure the epoxy resin. Examples of the curing agent include novolak-type phenol resins, dicyandiamide, acid anhydrides, and amines, and examples of the curing accelerator include imidazoles. These may be used alone or in combination of two or more. Further, the curing agent and the curing accelerator are blended in a necessary range according to the amount of the polyfunctional epoxy resin used. The curing agent is preferably blended such that the functional group of the curing agent is in the range of 0.8 to 1.2 equivalents with respect to 1 equivalent of the epoxy group of the epoxy resin, and 0.80 to 1.1 equivalents. More preferably, it is blended so as to fall within the range. When the functional group of the curing agent is less than 0.8 equivalent, and in any case exceeding 1.2 equivalents, the glass transition point is low, and it is easy to absorb moisture.
Solder heat resistance tends to decrease. Further, as the curing accelerator, conventionally known various ones can be used,
There is no particular limitation. For example, when an epoxy resin is used as the thermosetting resin, an imidazole compound, an organic phosphorus compound, a tertiary amine, a quaternary ammonium salt, or the like can be used. These curing accelerators may be used alone or in combination of two or more. In addition to the thermosetting resin and the curing agent to be blended if necessary, an inorganic filler can be blended from the viewpoint of improving mechanical properties and reducing costs by increasing the amount. Such inorganic fillers include alumina
Examples include fine powder silica, aluminum hydroxide, zirconium silicate, and talc.
【００１０】化２で示される黒色染料の配合量は、熱硬
化性樹脂組成物中に０.０１〜２重量％、好ましくは
０．１〜１重量％の範囲とするのが好ましい。２重量％
を超えて多量に配合しても効果は変わらない。The amount of the black dye represented by the formula (2) is preferably in the range of 0.01 to 2% by weight, more preferably 0.1 to 1% by weight in the thermosetting resin composition. 2% by weight
Even if it is blended in a large amount exceeding the above, the effect does not change.
【００１１】本発明になる熱硬化性樹脂組成物は、ワニ
スとして繊維基材に含浸乾燥してプリプレグとされる。
ワニスとするときに用いられる溶剤は、用いられる熱硬
化性樹脂を溶解可能な従来公知の溶剤を用いることがで
き特に制限はない。液状の熱硬化性樹脂を用いる場合に
は無溶剤とすることもできる。溶剤としては、例えば、
水、メタノール、エタノール、プロピルアルコール、ブ
チルアルコール、アセトン、メチルエチルケトン、トル
エン、キシレン、ジオキサン、Ｎ、Ｎジメチルホルムア
ミド、エチレングリコールモノメチルエーテル、エチレ
ングリコールモノメチルエーテルなどが挙げられ、これ
らの溶剤は単独で使用してもよく、また必要に応じて組
み合わせて使用することもできる。The thermosetting resin composition according to the present invention is impregnated and dried as a varnish on a fiber base material to form a prepreg.
As the solvent used when forming the varnish, a conventionally known solvent that can dissolve the thermosetting resin to be used can be used, and there is no particular limitation. When a liquid thermosetting resin is used, it may be solvent-free. As the solvent, for example,
Water, methanol, ethanol, propyl alcohol, butyl alcohol, acetone, methyl ethyl ketone, toluene, xylene, dioxane, N, N dimethylformamide, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether, etc., and these solvents are used alone. And may be used in combination as needed.
【００１２】本発明に用いられる繊維基材は、積層板製
造において汎用されている繊維基材を用いることができ
特に制限はないが、耐熱性など特性面から、ガラス織布
またはガラス不織布が好ましく用いられる。The fiber base material used in the present invention may be a fiber base material generally used in the production of laminates, and is not particularly limited. However, glass woven fabric or glass non-woven fabric is preferable from the viewpoint of properties such as heat resistance. Used.
【００１３】繊維基材に熱硬化性樹脂組成物ワニスを含
浸乾燥してプリプレグとするときの方法及び製造条件に
ついては、べ一スとなる熱硬化性樹脂について従来公知
の方法及び条件によることができ特に制限はない。ま
た、得られたプリプレグは、一枚で又は複数枚を重ね、
その片面又は両面に金属箔を重ね、温度１５０℃〜２０
０℃、圧力１.０〜８.０ＭＰａ程度の範囲で加熱加圧し
て金属はく張り積層板とされる。金属はく張積層板に回
路加工を施してプリント配線板を製造するときの方法に
ついては特に制約はなく公知の方法を用いることができ
る。The method and production conditions for impregnating and drying the fiber base material with the thermosetting resin composition varnish to produce a prepreg are based on conventionally known methods and conditions for the base thermosetting resin. There is no particular limitation. In addition, the obtained prepreg is a single sheet or a plurality of sheets,
Lay the metal foil on one or both sides, temperature 150 ℃ ~ 20
By heating and pressing at 0 ° C. and a pressure in the range of about 1.0 to 8.0 MPa, a metal-clad laminate is obtained. There is no particular limitation on the method of manufacturing the printed wiring board by performing circuit processing on the metal-clad laminate, and a known method can be used.
【００１４】積層板を製造するときの材料構成におい
て、プリプレグを複数枚使用するときは、紫外線遮断の
観点からは本発明のプリプレグを少なくとも１枚使用す
ればよい。また、本発明のプリプレグを配置する位置に
ついては特に制限はない。しかしながら、ワイヤボンデ
ィングの良否識別の容易さや外観上から、本発明になる
プリプレグが最外層となるように構成するのが好まし
い。When a plurality of prepregs are used in the material composition for manufacturing a laminate, at least one prepreg of the present invention may be used from the viewpoint of blocking ultraviolet rays. There is no particular limitation on the position where the prepreg of the present invention is arranged. However, it is preferable that the prepreg according to the present invention be configured as the outermost layer from the viewpoint of easy identification of wire bonding quality and appearance.
【００１５】[0015]
【実施例】実施例１ エポキシ当量４８０のブロム化エポキシ樹脂(東都化成
（株）製、ＹＤＢ−４００(商品名))１００部(重量部、
以下同じ)、ジシアンジアミド３部、２−エチル−４−
メチルイミダゾール０.１７部及び構造式が化２で示さ
れる化合物(中央合成化学（株）製、商品名:Chuo Sudan
Black１４１）０.５部を、エチレングリコールモノメ
チルエーテル２５部、Ｎ、Ｎジメチルホルムアミド２５
部からなる溶剤に溶解することによりエポキシ樹脂組成
物ワニスを調製した。調製したエポキシ樹脂組成物ワニ
スを厚さ０.１ｍｍ、坪量１０４ｇ／ｍ2のガラス織布
(日東紡績（株）製、ＧＡ−７０１０Ｓ１３６(商品名))
に含浸乾燥後の付着量が５０重量％になるように含浸、
乾燥してプリプレグを作成した。作製したプリプレグを
２枚重ね、その両面に厚さ１８μｍの銅はくを置き、温
度１７５℃圧力３ＭＰａで減圧下に６０分間加熱加圧し
て両面銅張積層板を作製し、作製した両面銅張積層板に
エッチングを施して回路を形成することにより両面プリ
ント配線板を得た。得られた両面プリント配線板は、基
板の外観が黒色を基調としており、ワイヤボンディング
の良否識別が容易であった。Example 1 100 parts (parts by weight) of a brominated epoxy resin having an epoxy equivalent of 480 (YDB-400 (trade name) manufactured by Toto Kasei Co., Ltd.)
The same applies hereinafter), 3 parts of dicyandiamide, 2-ethyl-4-
0.17 parts of methyl imidazole and a compound represented by the chemical formula (Chuo Sudan, manufactured by Chuo Gosei Kagaku Co., Ltd.)
Black 141) 0.5 part, ethylene glycol monomethyl ether 25 parts, N, N dimethylformamide 25
The epoxy resin composition varnish was prepared by dissolving in a solvent consisting of parts. A glass woven fabric having a thickness of 0.1 mm and a basis weight of 104 g / m 2 was prepared using the prepared epoxy resin composition varnish.
(GA-7010S136 (trade name) manufactured by Nitto Boseki Co., Ltd.)
Impregnation so that the adhesion amount after the impregnation drying becomes 50% by weight,
It dried and prepared the prepreg. The two prepared prepregs were stacked, copper foil having a thickness of 18 μm was placed on both surfaces thereof, and heated and pressed under reduced pressure at a temperature of 175 ° C. and a pressure of 3 MPa for 60 minutes to prepare a double-sided copper-clad laminate. The double-sided printed wiring board was obtained by forming a circuit by etching the laminate. In the obtained double-sided printed wiring board, the appearance of the substrate was based on black, and the quality of wire bonding was easily identified.
【００１６】比較例１ 着色剤としてカーボンブラックを使用したほかは、実施
例１と同様にして、エポキシ樹脂組成物ワニスを調製
し、プリプレグを作製し両面プリント配線板を作製し
た。作製した両面プリント配線板は、外観が黒色を基調
としておりワイヤボンディングの良否識別が容易であっ
たが、耐電食性に劣っていた。Comparative Example 1 An epoxy resin composition varnish was prepared, a prepreg was prepared, and a double-sided printed wiring board was prepared in the same manner as in Example 1 except that carbon black was used as a coloring agent. The produced double-sided printed wiring board was based on black in appearance and easy to determine whether wire bonding was good or bad, but was inferior in corrosion resistance.
【００１７】比較例２ 構造式が化２で示される化合物を配合しないほかは、実
施例１と同様にして、エポキシ樹脂組成物ワニスを調製
した。このワニスを厚さ０.１ｍｍ、坪量１０４ｇ／ｍ2
の黒色系ガラス織布(日東紡績（株）製、ＧＡ−７０１
０ＸＢ０７(商品名))に含浸、乾燥したほかは実施例１
と同様にして、プリプレグを作製し両面プリント配線板
を作製した。作製した両面プリント配線板は、外観が黒
色を基調としており、ワイヤボンディングの良否識別が
容易であったが、基板の紫外線透過率が大であった。Comparative Example 2 An epoxy resin composition varnish was prepared in the same manner as in Example 1 except that the compound represented by the chemical formula 2 was not added. This varnish is 0.1 mm thick and has a basis weight of 104 g / m 2.
Black glass woven fabric (manufactured by Nitto Boseki Co., Ltd., GA-701)
0XB07 (trade name)) and dried.
A prepreg was prepared in the same manner as described above to prepare a double-sided printed wiring board. The produced double-sided printed wiring board was based on black in appearance, and it was easy to determine the quality of wire bonding, but the substrate had a large ultraviolet transmittance.
【００１８】なお、紫外線透過率は、両面銅張積層板の
銅箔をエッチングにより全面除去し、これに紫外線を照
射して透過率を調べた。また、耐電食性は、両面銅張積
層板に穴間距離３００μmまたは２００μm、穴径Φ０.
５の電気めっき１００穴で表裏の回路を電気的に接続し
た回路パターン２回路を形成し、温度８５℃、相対湿度
８５％の恒温恒湿槽中にてこの２回路間に直流１００V
の電圧を１０００時間印加した。その後の２回路間の絶
縁抵抗を測定することにより耐電食性を調べた。これら
の結果を表１に示した。The ultraviolet transmittance was measured by removing the entire surface of the copper foil of the double-sided copper-clad laminate by etching, irradiating the copper foil with ultraviolet rays, and examining the transmittance. In addition, the corrosion resistance is 300 μm or 200 μm between holes in the double-sided copper-clad laminate, and the hole diameter is Φ0.
A circuit pattern 2 circuit was formed by electrically connecting the front and back circuits with 100 holes of electroplating 5 and 100 V DC between the two circuits in a thermo-hygrostat at a temperature of 85 ° C. and a relative humidity of 85%.
Was applied for 1000 hours. Thereafter, the electrical resistance to corrosion was examined by measuring the insulation resistance between the two circuits. The results are shown in Table 1.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表１から、構造式が化２で示される化合物
を配合した実施例１では積層板の紫外線透過率が小さ
く、また、プリント配線板の電食による絶縁低下が無い
ことから信頼性が良好であることが示される。これに対
してカーボン系顔料を配合した比較例１においては紫外
線透過率は小さいものの、電食による絶縁低下が大きい
ことから信頼性がよくないことが示される。また、黒色
系ガラス織布を用いた比較例２においては、耐電食性が
良好であるものの紫外線透過率が大きいことが示され
る。From Table 1, it can be seen that, in Example 1 in which the compound represented by the chemical formula 2 is blended, the laminate has a low ultraviolet transmittance and the printed wiring board has no insulation deterioration due to electrolytic corrosion, so that the reliability is low. It is shown to be good. On the other hand, in Comparative Example 1 in which the carbon-based pigment was blended, although the ultraviolet transmittance was low, the reliability was poor because the insulation loss due to electrolytic corrosion was large. In Comparative Example 2 using a black glass woven fabric, it is shown that although the electrolytic corrosion resistance is good, the ultraviolet transmittance is large.
【００２１】[0021]
【発明の効果】本発明によれば、紫外線を十分に遮蔽す
ることができ、かつ、黒色を基調とする積層板をを得る
ことができる。そしてこの積層板は紫外線遮蔽性が良好
であることから、両面同時露光によりプリント配線板と
することができ、また、ワイヤボンディングの良否識別
も容易で、電食による絶縁低下がないことから信頼性に
優れたプリント配線板を提供することができる。According to the present invention, it is possible to obtain a laminate which can sufficiently shield ultraviolet rays and has a black color tone. And since this laminated board has good ultraviolet shielding properties, it can be used as a printed wiring board by simultaneous exposure on both sides, and it is easy to identify the quality of wire bonding, and there is no insulation deterioration due to electrolytic corrosion. It is possible to provide a printed wiring board excellent in quality.
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F072 AA07 AB09 AB28 AD29 AE09 AF27 AG03 AG16 AG17 AH21 AK05 AL12 AL13 4J002 CC031 CD021 CD051 CD061 CD081 CD131 CD181 CF211 CM041 EU136 FD010 FD096 FD140 FD150 GF00 GQ01 HA04 HA05 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F072 AA07 AB09 AB28 AD29 AE09 AF27 AG03 AG16 AG17 AH21 AK05 AL12 AL13 4J002 CC031 CD021 CD051 CD061 CD081 CD131 CD181 CF211 CM041 EU136 FD010 FD096 FD140 FD150 GF00 GQ01 HA
Claims (4)
してなる熱硬化性樹脂組成物。 【化１】 A thermosetting resin composition comprising a black dye represented by the following formula: Embedded image
脂組成物のワニスを含浸乾燥してなるプリプレグ。2. A prepreg obtained by impregnating and drying a varnish of the black thermosetting resin composition according to claim 1 on a fiber base material.
枚含むプリプレグ構成体を加熱加圧してなる積層板。3. The prepreg according to claim 2, wherein
A laminated plate obtained by heating and pressurizing a prepreg construct including a plurality of prepregs.
てなるプリント配線板。4. A printed wiring board comprising a circuit formed on the surface of the laminate according to claim 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33221799A JP4171952B2 (en) | 1999-11-24 | 1999-11-24 | Thermosetting resin composition, prepreg, laminate and printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33221799A JP4171952B2 (en) | 1999-11-24 | 1999-11-24 | Thermosetting resin composition, prepreg, laminate and printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001152032A true JP2001152032A (en) | 2001-06-05 |
| JP4171952B2 JP4171952B2 (en) | 2008-10-29 |
Family
ID=18252491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33221799A Expired - Lifetime JP4171952B2 (en) | 1999-11-24 | 1999-11-24 | Thermosetting resin composition, prepreg, laminate and printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4171952B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006143768A (en) * | 2004-11-16 | 2006-06-08 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg, laminate and printed wiring board |
| JP2009114377A (en) * | 2007-11-08 | 2009-05-28 | Sumitomo Bakelite Co Ltd | Method of preparing resin composition |
| CN102223758A (en) * | 2010-04-14 | 2011-10-19 | 江阴市明康绝缘玻纤有限公司 | Light-shield double-faced copper-clad laminate with phenolic paper base |
| CN102223759A (en) * | 2010-04-14 | 2011-10-19 | 江阴市明康绝缘玻纤有限公司 | Phenolic paper-based light shielding single-sided copper-cladding laminated board |
-
1999
- 1999-11-24 JP JP33221799A patent/JP4171952B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006143768A (en) * | 2004-11-16 | 2006-06-08 | Hitachi Chem Co Ltd | Thermosetting resin composition, prepreg, laminate and printed wiring board |
| JP2009114377A (en) * | 2007-11-08 | 2009-05-28 | Sumitomo Bakelite Co Ltd | Method of preparing resin composition |
| CN102223758A (en) * | 2010-04-14 | 2011-10-19 | 江阴市明康绝缘玻纤有限公司 | Light-shield double-faced copper-clad laminate with phenolic paper base |
| CN102223759A (en) * | 2010-04-14 | 2011-10-19 | 江阴市明康绝缘玻纤有限公司 | Phenolic paper-based light shielding single-sided copper-cladding laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4171952B2 (en) | 2008-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5554500B2 (en) | Prepreg, printed wiring board, multilayer circuit board, and method for manufacturing printed wiring board | |
| JP4277123B2 (en) | Resin composition for printed wiring board, prepreg, laminated board, and printed wiring board using the same | |
| JP2007308640A (en) | Resin composition for laminate, organic substrate prepreg, metal foil-clad laminate and printed circuit board | |
| JP4171952B2 (en) | Thermosetting resin composition, prepreg, laminate and printed wiring board | |
| JPH0722718A (en) | Epoxy resin composition for printed wiring board, manufacture of prepreg for printed wiring board, and manufacture of composite laminated sheet | |
| JP2000072969A (en) | Thermosetting resin composition, prepreg, laminated board, and printed circuit board | |
| JPH0959346A (en) | Epoxy resin composition for laminate | |
| JPH06100707A (en) | Production of laminated sheet | |
| JP2001123069A (en) | Thermosetting resin composition, prepreg, laminate and printed wiring board | |
| JP2008133412A (en) | Thermosetting resin composition, prepreg, metal-clad laminate and printed wiring board | |
| JP3720337B2 (en) | Organic base prepreg, laminate and printed wiring board | |
| JP2002212319A (en) | Prepreg, laminated plate and printed circuit board | |
| JP3529088B2 (en) | Epoxy resin composition, prepreg and laminate using the same | |
| JP2001123064A (en) | Thermosetting resin composition, prepreg, laminated sheet and printed-wiring board | |
| JPS62115038A (en) | Production of reinforced epoxy resin | |
| JP5265844B2 (en) | Thermosetting resin composition, prepreg, laminate and printed wiring board | |
| JP2004165268A (en) | Laminate and printed circuit board | |
| JP4245197B2 (en) | Manufacturing method of prepreg for printed wiring board and metal-clad laminate using the same | |
| JP2002194226A (en) | Thermosetting resin composition, prepreg, laminated sheet, and printed circuit board | |
| JP2005002226A (en) | Flame-retardant epoxy resin composition and laminated plate-related product using the same | |
| JP3735911B2 (en) | Epoxy resin composition and laminate using the same | |
| JP3326862B2 (en) | Manufacturing method of prepreg | |
| JP2001139775A (en) | Epoxy resin composition and flexible printed wiring board material using the same | |
| JPS62169828A (en) | Production of substrate for printed circuit | |
| JP2012153898A (en) | Thermosetting resin composition, prepreg, metal-clad laminate and printed wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20050729 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20071012 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071018 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071217 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080311 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080428 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20080613 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080717 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080730 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 4171952 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110822 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110822 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120822 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120822 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130822 Year of fee payment: 5 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130822 Year of fee payment: 5 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |