JP2014201829A5 - Copper foil with carrier, method for producing copper foil with carrier, method for producing copper-clad laminate, and method for producing printed wiring board - Google Patents

Claims (12)

A carrier-attached copper foil comprising a carrier, a release layer laminated on the carrier, an ultrathin copper layer laminated on the release layer, and an adhesive layer between the insulating substrate laminated on the ultrathin copper layer There,
The ultrathin copper layer is a 10 cm square sheet, and the thickness accuracy when the average thickness measurement value calculated by the weight thickness method is W ₁₀ and the standard deviation is σ ₁₀ : P ₁₀ = 3σ ₁₀ × 100 / W when I was _10, not more than P ₁₀ is 3.0%,
A copper foil with a carrier satisfying a roughness Rz of 1.5 μm or less measured with a contact-type roughness meter in accordance with JIS B0601-1994 in an adhesive layer with an insulating substrate of an ultrathin copper layer. The copper foil with a carrier satisfy | filling any one or more of the following (A) or (B).
(A) Thickness accuracy when the ultrathin copper layer is a 5 cm square sheet and the average value of weight thickness measurement values calculated by the weight thickness method is W ₅ and the standard deviation is σ ₃ : P ₅ = 3σ ₅ × When 100 / W ₅ is set, P ₅ is 3.0% or less .
(B) The thickness of the ultrathin copper layer measured by the four-probe method is T, and when the standard deviation is σ _T , the thickness accuracy is P _T = 3σ _T × 100 / T, P _T is 10.0% or less. For the adhesive layer of the ultra-thin copper layer with the insulating substrate, Ni, Mo, Ti, Zn, Co, V, Sn, Mn, W, P, Fe and Cr alone, or Ni, Mo, Ti, Zn, The copper foil with a carrier according to claim 1 or 2 , wherein an alloy containing at least one of Co, V, Sn, Mn, W, P, Fe, and Cr, or an oxide or a hydrated oxide is present. The adhesion layer of the ultrathin copper layer to the insulating substrate is an intermediate layer made of a single metal or an alloy, and a single metal of Cr, an oxide, or a hydrated oxide, which are laminated in order from the surface of the ultrathin copper layer. The surface layer is composed of 10 to 200 μg / dm ² of Cr.
The copper with a carrier according to any one of claims 1 to 3 , wherein the intermediate layer includes at least one of Ni, Mo, Ti, Zn, Co, V, Sn, Mn, W, P, Fe, and Cr. Foil. The intermediate layer is composed of any one of Ni, Mo, Ti, Zn, and Co. The intermediate layer includes any one of Ni, Mo, Ti, Zn, and Co at 10 to 2000 μg / The copper foil with a carrier according to claim 4 , wherein the copper foil is present in an amount of dm ² . The intermediate layer is composed of an alloy of at least any two of Ni, Mo, Zn, Co, V, Sn, Mn, W, P, and Fe, and the intermediate layer includes Ni, Mo, Zn, Co, The copper foil with a carrier according to claim 4 , wherein any ^two of V, Sn, Mn, W, P, Fe and Cr are present in an adhesion amount of 10 to 2000 μg / dm ² . The intermediate layer, Ni and, Mo, Zn, Co, V , Sn, Mn, W, P, Fe, according to claim 4 or 6 composed of Ni alloy consisting of any one of Mn and Cr Copper foil with carrier. The copper foil with a carrier according to any one of claims 1 to 7, which satisfies any one of the following (C) to (E).
(C) The surface of the adhesive layer has one or more layers selected from the group consisting of a heat-resistant layer, a rust-proof layer, a chromate treatment layer, and a silane coupling treatment layer .
(D) A resin layer is provided on the adhesive layer.
(E) The surface of the adhesive layer has one or more layers selected from the group consisting of a heat-resistant layer, a rust-proof layer, a chromate-treated layer, and a silane coupling-treated layer, and the heat-resistant layer and the rust-proof layer A resin layer is provided on one or more layers selected from the group consisting of a layer, a chromate treatment layer, and a silane coupling treatment layer. By treating the surface of a long carrier conveyed in the length direction by the roll-to-roll conveyance method, the carrier, the release layer laminated on the carrier, and the ultrathin layer laminated on the release layer It is a method of manufacturing a copper foil with a carrier provided with a copper layer,
Forming a release layer on the surface of the carrier conveyed by the conveyance roll;
Forming an ultrathin copper layer on the surface of the release layer by electrolytic plating while supporting the carrier on which the release layer is transported by a transport roll with a drum;
The manufacturing method of the copper foil with a carrier in any one of Claims 1-8 containing these. Method of making a print wiring board using the copper foil with carrier according to any one of claims 1-8. Method of producing a copper-clad laminate using a copper foil with carrier according to any one of claims 1-8. Preparing the carrier-attached copper foil according to any one of claims 1 to 8 and an insulating substrate;
Laminating the copper foil with carrier and an insulating substrate;
After laminating the carrier-attached copper foil and the insulating substrate, forming a copper-clad laminate through a step of peeling the carrier of the carrier-attached copper foil,
Then, the manufacturing method of a printed wiring board including the process of forming a circuit by any method of a semi-additive method, a subtractive method, a partly additive method, or a modified semi-additive method.