NO20001360D0 - Vertikale elektriske forbindelser i stabel - Google Patents

Vertikale elektriske forbindelser i stabel

Info

Publication number
NO20001360D0
NO20001360D0 NO20001360A NO20001360A NO20001360D0 NO 20001360 D0 NO20001360 D0 NO 20001360D0 NO 20001360 A NO20001360 A NO 20001360A NO 20001360 A NO20001360 A NO 20001360A NO 20001360 D0 NO20001360 D0 NO 20001360D0
Authority
NO
Norway
Prior art keywords
layers
edge
stack
electrical
substrate
Prior art date
Application number
NO20001360A
Other languages
English (en)
Norwegian (no)
Original Assignee
Thin Film Electronics Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thin Film Electronics Asa filed Critical Thin Film Electronics Asa
Priority to NO20001360A priority Critical patent/NO20001360D0/no
Publication of NO20001360D0 publication Critical patent/NO20001360D0/no
Priority to PCT/NO2001/000113 priority patent/WO2001069679A1/en
Priority to US09/926,531 priority patent/US20030024731A1/en
Priority to KR10-2002-7012015A priority patent/KR100488256B1/ko
Priority to EP01918005A priority patent/EP1287560A1/en
Priority to RU2002125873A priority patent/RU2237948C2/ru
Priority to JP2001567041A priority patent/JP2003526945A/ja
Priority to NO20011330A priority patent/NO313679B1/no
Priority to AU44877/01A priority patent/AU775011B2/en
Priority to CNB018065473A priority patent/CN1214462C/zh
Priority to CA002403231A priority patent/CA2403231C/en
Priority to US10/390,178 priority patent/US7211885B2/en
Priority to HK03106866A priority patent/HK1054616A1/xx
Priority to JP2008030771A priority patent/JP2008177589A/ja
Priority to JP2008030748A priority patent/JP2008182252A/ja

Links

Classifications

    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
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    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
NO20001360A 2000-03-15 2000-03-15 Vertikale elektriske forbindelser i stabel NO20001360D0 (no)

Priority Applications (15)

Application Number Priority Date Filing Date Title
NO20001360A NO20001360D0 (no) 2000-03-15 2000-03-15 Vertikale elektriske forbindelser i stabel
CA002403231A CA2403231C (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack
JP2001567041A JP2003526945A (ja) 2000-03-15 2001-03-15 スタックにおける電気的相互垂直接続
AU44877/01A AU775011B2 (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack
KR10-2002-7012015A KR100488256B1 (ko) 2000-03-15 2001-03-15 적층부내의 수직 전기적 상호접속부
EP01918005A EP1287560A1 (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack
RU2002125873A RU2237948C2 (ru) 2000-03-15 2001-03-15 Устройство памяти и/или обработки данных и способ его изготовления
PCT/NO2001/000113 WO2001069679A1 (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack
NO20011330A NO313679B1 (no) 2000-03-15 2001-03-15 Vertikale elektriske forbindelser i en stabel
US09/926,531 US20030024731A1 (en) 2000-03-15 2001-03-15 Vertical electrical interconnections in a stack
CNB018065473A CN1214462C (zh) 2000-03-15 2001-03-15 叠层中的垂直电互连
US10/390,178 US7211885B2 (en) 2000-03-15 2003-03-14 Vertical electrical interconnections in a stack
HK03106866A HK1054616A1 (en) 2000-03-15 2003-09-24 Vertical electrical interconnections in a stack
JP2008030771A JP2008177589A (ja) 2000-03-15 2008-02-12 スタックにおける電気的相互垂直接続
JP2008030748A JP2008182252A (ja) 2000-03-15 2008-02-12 スタックにおける電気的相互垂直接続

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