NL9400766A - Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. - Google Patents

Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. Download PDF

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Publication number
NL9400766A
NL9400766A NL9400766A NL9400766A NL9400766A NL 9400766 A NL9400766 A NL 9400766A NL 9400766 A NL9400766 A NL 9400766A NL 9400766 A NL9400766 A NL 9400766A NL 9400766 A NL9400766 A NL 9400766A
Authority
NL
Netherlands
Prior art keywords
semiconductor circuit
mold
plastic
spacer element
window
Prior art date
Application number
NL9400766A
Other languages
English (en)
Dutch (nl)
Inventor
Peter Jacobus Kaldenberg
Original Assignee
Euratec Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Euratec Bv filed Critical Euratec Bv
Priority to NL9400766A priority Critical patent/NL9400766A/nl
Priority to DK95201126.0T priority patent/DK0682374T3/da
Priority to AT95201126T priority patent/ATE162011T1/de
Priority to ES95201126T priority patent/ES2110811T3/es
Priority to JP7131235A priority patent/JPH07307359A/ja
Priority to SI9530058T priority patent/SI0682374T1/xx
Priority to EP95201126A priority patent/EP0682374B1/fr
Priority to DE69501361T priority patent/DE69501361T2/de
Priority to US08/434,909 priority patent/US5863810A/en
Publication of NL9400766A publication Critical patent/NL9400766A/nl
Priority to GR980400343T priority patent/GR3026168T3/el

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
NL9400766A 1994-05-09 1994-05-09 Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. NL9400766A (nl)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL9400766A NL9400766A (nl) 1994-05-09 1994-05-09 Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling.
DK95201126.0T DK0682374T3 (da) 1994-05-09 1995-05-02 Fremgangsmåde til indkapsling af et integreret kredsløb
AT95201126T ATE162011T1 (de) 1994-05-09 1995-05-02 Verfahren zur einkapselung einer integrierten schaltung
ES95201126T ES2110811T3 (es) 1994-05-09 1995-05-02 Metodo para encapsular un circuito integrado.
JP7131235A JPH07307359A (ja) 1994-05-09 1995-05-02 集積回路のカプセル封止方法
SI9530058T SI0682374T1 (en) 1994-05-09 1995-05-02 Method for encapsulating an integrated circuit
EP95201126A EP0682374B1 (fr) 1994-05-09 1995-05-02 Méthode d'encapsulation d'un circuit intégré
DE69501361T DE69501361T2 (de) 1994-05-09 1995-05-02 Verfahren zur Einkapselung einer integrierten Schaltung
US08/434,909 US5863810A (en) 1994-05-09 1995-05-03 Method for encapsulating an integrated circuit having a window
GR980400343T GR3026168T3 (en) 1994-05-09 1998-02-18 Method for encapsulating an integrated circuit.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL9400766 1994-05-09
NL9400766A NL9400766A (nl) 1994-05-09 1994-05-09 Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling.

Publications (1)

Publication Number Publication Date
NL9400766A true NL9400766A (nl) 1995-12-01

Family

ID=19864175

Family Applications (1)

Application Number Title Priority Date Filing Date
NL9400766A NL9400766A (nl) 1994-05-09 1994-05-09 Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling.

Country Status (10)

Country Link
US (1) US5863810A (fr)
EP (1) EP0682374B1 (fr)
JP (1) JPH07307359A (fr)
AT (1) ATE162011T1 (fr)
DE (1) DE69501361T2 (fr)
DK (1) DK0682374T3 (fr)
ES (1) ES2110811T3 (fr)
GR (1) GR3026168T3 (fr)
NL (1) NL9400766A (fr)
SI (1) SI0682374T1 (fr)

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DE59402033D1 (de) 1993-09-30 1997-04-17 Siemens Ag Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
US5866953A (en) * 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP1441395B9 (fr) * 1996-06-26 2012-08-15 OSRAM Opto Semiconductors GmbH Dispositif semi-conducteur luminescent avec élément de conversion de la luminescence
JP3012816B2 (ja) * 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
JP3189115B2 (ja) * 1996-12-27 2001-07-16 株式会社新川 半導体装置及びワイヤボンディング方法
WO1999000852A1 (fr) * 1997-06-27 1999-01-07 Iwasaki Electric Co., Ltd. Diode electroluminescente de type reflechissante
EP2267797A1 (fr) * 1997-07-29 2010-12-29 OSRAM Opto Semiconductors GmbH Dispositif opto-électronique
JP2000114304A (ja) * 1998-10-08 2000-04-21 Shinkawa Ltd ワイヤボンディング方法
US6140141A (en) * 1998-12-23 2000-10-31 Sun Microsystems, Inc. Method for cooling backside optically probed integrated circuits
FR2798226B1 (fr) * 1999-09-02 2002-04-05 St Microelectronics Sa Procede de mise en boitier d'une puce de semi-conducteur contenant des capteurs et boitier obtenu
SG106050A1 (en) * 2000-03-13 2004-09-30 Megic Corp Method of manufacture and identification of semiconductor chip marked for identification with internal marking indicia and protection thereof by non-black layer and device produced thereby
US6531341B1 (en) 2000-05-16 2003-03-11 Sandia Corporation Method of fabricating a microelectronic device package with an integral window
US6379988B1 (en) 2000-05-16 2002-04-30 Sandia Corporation Pre-release plastic packaging of MEMS and IMEMS devices
US6384473B1 (en) 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
FR2819103B1 (fr) * 2000-12-29 2003-12-12 St Microelectronics Sa Boitier semi-conducteur optique a pastille transparente et son procede de fabrication
US7098545B2 (en) * 2001-11-23 2006-08-29 Koninklijke Phllips Electronics N.V. Semiconductor device and method of enveloping an integrated circuit
FR2835653B1 (fr) 2002-02-06 2005-04-15 St Microelectronics Sa Dispositif semi-conducteur optique
JP2003243577A (ja) * 2002-02-18 2003-08-29 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US6835592B2 (en) * 2002-05-24 2004-12-28 Micron Technology, Inc. Methods for molding a semiconductor die package with enhanced thermal conductivity
JP4190269B2 (ja) 2002-07-09 2008-12-03 新光電気工業株式会社 素子内蔵基板製造方法およびその装置
DE10254648A1 (de) * 2002-11-22 2004-06-09 Infineon Technologies Ag Trägerstruktur für einen Chip und Verfahren zum Herstellen derselben
JP2004319530A (ja) * 2003-02-28 2004-11-11 Sanyo Electric Co Ltd 光半導体装置およびその製造方法
WO2004105117A2 (fr) * 2003-05-19 2004-12-02 X-Fab Semiconductor Foundries Ag Production d'un composant optoelectronique ferme, en matiere plastique, et procedes correspondants
US20050009239A1 (en) * 2003-07-07 2005-01-13 Wolff Larry Lee Optoelectronic packaging with embedded window
US7179688B2 (en) * 2003-10-16 2007-02-20 Kulicke And Soffa Industries, Inc. Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method
US20050146057A1 (en) * 2003-12-31 2005-07-07 Khor Ah L. Micro lead frame package having transparent encapsulant
US7064424B2 (en) * 2004-05-06 2006-06-20 Wilson Robert E Optical surface mount technology package
US20060043612A1 (en) * 2004-09-02 2006-03-02 Stats Chippac Ltd. Wire sweep resistant semiconductor package and manufacturing method thereof
US7015587B1 (en) * 2004-09-07 2006-03-21 National Semiconductor Corporation Stacked die package for semiconductor devices
US7273767B2 (en) * 2004-12-31 2007-09-25 Carsem (M) Sdn. Bhd. Method of manufacturing a cavity package
US7808004B2 (en) * 2006-03-17 2010-10-05 Edison Opto Corporation Light emitting diode package structure and method of manufacturing the same
TWI313501B (en) * 2006-03-22 2009-08-11 Ind Tech Res Inst A process for manufacture plastic package of mems devices and the structure for the same
US20070292982A1 (en) * 2006-06-16 2007-12-20 Jeffery Gail Holloway Method for Manufacturing Transparent Windows in Molded Semiconductor Packages
WO2008082565A1 (fr) * 2006-12-29 2008-07-10 Tessera, Inc. Dispositifs microélectroniques et procédés de fabrication de ceux-ci
JP5388673B2 (ja) * 2008-05-07 2014-01-15 パナソニック株式会社 電子部品
EP2154713B1 (fr) * 2008-08-11 2013-01-02 Sensirion AG Procédé de fabrication d'un dispositif de capteur avec une couche de détente
US9366593B2 (en) * 2013-09-27 2016-06-14 Infineon Technologies Ag Pressure sensor package with integrated sealing
EP3121853B1 (fr) 2015-07-23 2022-01-19 ams AG Procédé de production d'un capteur optique au niveau d'une tranche et capteur optique
JPWO2022085446A1 (fr) * 2020-10-19 2022-04-28

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Publication number Priority date Publication date Assignee Title
JPS60193345A (ja) * 1984-03-15 1985-10-01 Matsushita Electronics Corp 半導体装置の製造方法
JPS6136957A (ja) * 1984-07-30 1986-02-21 Nec Corp 樹脂封止型半導体集積回路
JPS62265771A (ja) * 1986-05-14 1987-11-18 Seiko Instr & Electronics Ltd 光電変換素子の封止法
JPS6378557A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 樹脂封止型半導体装置
EP0400176A1 (fr) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Elément optique fixable sur une surface
US5200367A (en) * 1990-11-13 1993-04-06 Gold Star Electron Co., Ltd. Method for assembling packages of semi-conductor elements

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JPS60193345A (ja) * 1984-03-15 1985-10-01 Matsushita Electronics Corp 半導体装置の製造方法
JPS6136957A (ja) * 1984-07-30 1986-02-21 Nec Corp 樹脂封止型半導体集積回路
JPS62265771A (ja) * 1986-05-14 1987-11-18 Seiko Instr & Electronics Ltd 光電変換素子の封止法
JPS6378557A (ja) * 1986-09-22 1988-04-08 Hitachi Ltd 樹脂封止型半導体装置
EP0400176A1 (fr) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft Elément optique fixable sur une surface
US5200367A (en) * 1990-11-13 1993-04-06 Gold Star Electron Co., Ltd. Method for assembling packages of semi-conductor elements

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Also Published As

Publication number Publication date
DE69501361D1 (de) 1998-02-12
ES2110811T3 (es) 1998-02-16
JPH07307359A (ja) 1995-11-21
GR3026168T3 (en) 1998-05-29
DE69501361T2 (de) 1998-05-07
EP0682374A1 (fr) 1995-11-15
EP0682374B1 (fr) 1998-01-07
US5863810A (en) 1999-01-26
DK0682374T3 (da) 1998-05-04
SI0682374T1 (en) 1998-06-30
ATE162011T1 (de) 1998-01-15

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