WO2008082565A1 - Dispositifs microélectroniques et procédés de fabrication de ceux-ci - Google Patents

Dispositifs microélectroniques et procédés de fabrication de ceux-ci Download PDF

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Publication number
WO2008082565A1
WO2008082565A1 PCT/US2007/026048 US2007026048W WO2008082565A1 WO 2008082565 A1 WO2008082565 A1 WO 2008082565A1 US 2007026048 W US2007026048 W US 2007026048W WO 2008082565 A1 WO2008082565 A1 WO 2008082565A1
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WO
WIPO (PCT)
Prior art keywords
lid
package
substantially impermeable
active region
microelectronic assembly
Prior art date
Application number
PCT/US2007/026048
Other languages
English (en)
Inventor
Victor Liew
Michael J. Nystrom
Michael R. Feldman
James Morris
Belgacem Haba
Original Assignee
Tessera, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera, Inc. filed Critical Tessera, Inc.
Publication of WO2008082565A1 publication Critical patent/WO2008082565A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Definitions

  • This application relates to microelectronic devices and methods of manufacturing microelectronic devices .
  • microelectronic devices have active regions with optical sensors. Each active region typically is located inside a chamber and surrounded by a molded package. A transparent lid is provided above the active region and enables the passage of optical data to the optical sensors. [0004] The rapid evolution of microelectronic elements has created continued demand to improve the performance of such microelectronic devices and to improve the methods of manufacturing such microelectronic devices.
  • a method of forming a microelectronic assembly includes providing a device having an active region.
  • a support structure is applied adjacent to the active region but not extending onto the active region.
  • a lid is positioned in contact with the support structure and extending over the active region. The lid is pressed against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, a package is molded contiguous with the lid.
  • the support structure is an adhesive material.
  • the device, the support structure and the lid define a substantially empty- cavity around the active region. During molding, the device, the support structure and the lid substantially prevent mold compound from migrating into the cavity.
  • pressing the lid against the mold surface includes pressing a surface of the lid facing away from the device against the mold surface. Pressing the lid against the mold surface substantially prevents mold compound from migrating across an upper surface of the lid during package formation.
  • the method typically includes connecting an electrical conductor between the device and an external conductive element. Molding the package typically includes covering the electrical conductor with mold compound. [0009]
  • the active region typically is populated with one or more microelectronic devices, such as optical devices.
  • the lid is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices.
  • the lid includes a glass portion.
  • the package in some instances, is substantially opaque to electromagnetic radiation at wavelengths relevant to the one or more optical devices.
  • the method also includes substantially sealing the package, for example, by forming a substantially impermeable housing around the package and sealing a first gap between the substantially impermeable housing and the lid.
  • the method prior to molding the package, typically includes placing the substantially impermeable housing inside the mold.
  • the molding process integrates the substantially impermeable housing into the microelectronic assembly.
  • the substantially impermeable housing is typically a material selected from the group consisting of: ceramic, metal and glass .
  • sealing the first gap includes forming a metallic layer on an upper surface of the lid and applying a bead (e.g., a metal-based bead such as solder) between the metallic layer and a metallic part of the substantially impermeable housing.
  • a bead e.g., a metal-based bead such as solder
  • Forming the metallic layer on the upper surface of the lid typically is performed by depositing the metallic layer near a peripheral edge of the lid's upper surface.
  • the method includes positioning the device so that its lower surface is in contact with a substantially impermeable substrate.
  • the method includes sealing a second gap between the substantially impermeable housing and the substantially impermeable substrate. Sealing the second gap typically includes applying a bead across the second gap.
  • the substantially impermeable housing typically has an aperture. The impermeable housing typically is coupled to the package so that the aperture is aligned with the lid.
  • molding the package includes forming one or more alignment features in an upper surface of the package, where the one or more alignment features are adapted to engage corresponding alignment features on an optics assembly or other assembly to be mated to the package.
  • Such methods include positioning an optics (or other) assembly above the package so that the one or more alignment features in the upper surface of the package engage the corresponding alignment features on the optics assembly.
  • forming the alignment features includes positioning one or more pins inside the mold prior to molding the package. In those instances, the one or more pins are captured in mold compound during package formation so that the one or more pins extend upward from the upper surface of the package . [0015] In certain implementations, forming the one or more alignment features includes forming a structure from mold compound. Typically, the structure extends upward from the upper surface of the package and defines an aperture that is adapted to receive the optics assembly. In certain embodiments, the aperture is substantially cylindrical with internal screw threads. In those implementations, at least a portion of optics assembly has a substantially cylindrical body with external screw threads adapted to engage the internal screw threads of the substantially cylindrical aperture.
  • an alternative method of forming a microelectronic assembly includes providing a device having an upper surface with an active region, positioning a support structure adjacent to the active region but not extending onto the active region, positioning a lid in contact with the support structure and extending over the active region, wherein the lid and the support structure define a substantially empty cavity, pressing the lid against a mold surface that is contoured to complement the lid and, while pressing the lid against the mold surface, molding a package contiguous to the lid.
  • a method of sealing a microelectronic assembly includes providing a microelectronic assembly.
  • the microelectronic assembly includes a device, a support structure on an upper surface of the device, a lid in contact with the support structure and extending over the active region and a package contiguous with the lid.
  • the method further includes forming a substantially impermeable housing around at least part of the package and sealing a first gap between the substantially impermeable housing and the lid.
  • a microelectronic assembly includes a device having an active region.
  • a support structure is adjacent to the active region but does not extend onto or over the active region.
  • a lid is in contact with the support structure and extends over the active region.
  • the device, the lid and the support structure define a substantially empty cavity around the active region.
  • a package is contiguous with the lid.
  • an alternative microelectronic assembly includes a device with an active region.
  • a support structure is on an upper surface of the device.
  • a lid is in contact with the support structure and extends over the active region.
  • a package is contiguous with the lid.
  • a substantially impermeable housing is around the package.
  • a metallic layer is on an upper surface of the lid, and a bead is between the metallic layer and a metallic part of the substantially impermeable housing.
  • a microelectronic assembly can be produced having elements that are in precise alignment with each other.
  • the microelectronic assembly can include an optics assembly that is in precise relative alignment with the imaging plane of such device. Precise relative alignment can improve the functionality of optical microelectronic devices.
  • a seal can be formed around a microelectronic assembly package. The seal can be manufactured in a simple, cost-effective manner and can substantially reduce the entrance of contaminants into the assembly's active region. By reducing the entrance of such contaminants into the active region, the operation of such a microelectronic assembly, particularly over time, can be improved. BRIEF DESCRIPTION OF THE DRAWINGS
  • FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
  • FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to another embodiment of the invention.
  • FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention.
  • FIG. 4 is a cross-sectional elevational view of a microelectronic assembly according to an embodiment of the invention.
  • FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention.
  • FIG. 6 is a cross-sectional elevational view of a microelectronic assembly having a sealed package according to yet another embodiment of the invention.
  • FIGS. 1A-1E are cross-sectional elevational views showing a method of forming a microelectronic assembly according to one embodiment of the invention.
  • the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106.
  • the active region 106 is populated with microelectronic devices, such as optical devices.
  • a support structure 108 is coupled to the upper surface 104.
  • the support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106.
  • the support structure 108 is an adhesive material.
  • the support structure 108 is typically a continuous structure that surrounds the active region 106.
  • a lid 110 is in contact with the support structure 108 and is suspended above the active region 106.
  • the lid 110 is a material that is substantially transparent to electromagnetic radiation at wavelengths relevant to the one or more optical devices. Such materials include, for example, glass or plastic.
  • Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area on the upper surface 104 bounded by the support structure 108.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from containing the microelectronic devices, the cavity 114 is otherwise substantially empty.
  • the term "substantially empty” should be construed broadly to include cavities that are filled with air, gas or that are under vacuum.
  • the cavity 114 is bounded on all sides by the support structure 108.
  • the upper surface 104 of the device 102 defines the bottom of the cavity 114.
  • the lid 110 extends over the area that is bounded by the support structure 108 and defines a top of the cavity 114.
  • the device 102 is electrically coupled to external conductive elements 114. More particularly, in the illustrated embodiment, wire bonds 115 are provided to electrically couple the bond pads 112 exposed at the upper surface 104 of the device 102 to respective external conductive elements 116.
  • the method includes pressing the lid 110 against a first mold surface 118 that is contoured to complement the lid 110.
  • the surface 120 of the lid 110 facing away from the device 102 is substantially flat. That surface 120 is pressed against a portion of the first mold surface 118 by virtue of a second mold surface 122 applying an upward force against the device 102.
  • the portion of the mold surface 118 that contacts the surface 120 of the lid 110 also is substantially flat. In that way, the substantially flat first mold surface 118 is contoured to complement the similarly substantially flat portion of the lid 110 that is in contact therewith.
  • the first mold surface 118 and the second mold surface 122 can be moved together so as to grip the assembly therebetween for molding.
  • the method includes molding a package 126 while pressing the lid 110 against the first mold surface 118.
  • the package 126 is molded so that it is contiguous with the lid 110. Pressing the lid 110 against the first mold surface 118 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110.
  • mold compound forms a package 126 that surrounds a perimeter of the lid 110.
  • the mold compound also covers the bond pads 112, the wire bonds 115 and part of the external conductive elements 116.
  • the package 126 is substantially opaque to electromagnetic radiation at wavelengths that are relevant to the optical devices in the active region 106.
  • the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process .
  • FIG. IE shows a microelectronic assembly 128 that is produced using the above method.
  • the illustrated microelectronic assembly 128 includes a device 102 with an active region 106.
  • a support structure 108 is adjacent to the active region 106 but does not extend onto the active region 106.
  • a lid 110 is in contact with the support structure 108 and extends over the active region 106.
  • a package 126 is contiguous with the lid 110 but does not extend over an upper surface 120 of the lid 110. In the illustrated implementation, an upper surface 130 of the package 126 is approximately flush with the upper surface 120 of the lid 110.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 around the active region 106. Aside from the components in the active region 106, the cavity 114 is substantially empty.
  • the lid 110 is substantially transparent to electromagnetic radiation at wavelengths relevant to the optical devices.
  • the package 126 is substantially opaque to those wavelengths.
  • FIGS. 2A-2F are cross-sectional elevational views showing a method of forming a microelectronic assembly- according to another embodiment of the invention.
  • the illustrated method is similar to the method discussed above with reference to FIGS. IA-IE, except that the method of FIGS. 2A-2F includes forming alignment features 202 in the upper surface 130 of the package 226 and using those alignment features 202 to align and position an optics assembly 204 relative to the package 226.
  • the first mold surface 218 includes holes 208.
  • one or more pins 206 Prior to molding, one or more pins 206 are positioned inside the mold so as to extend at least partially out of the holes 208.
  • the pins 206 can be held in place within the holes 208 either by using a light adhesive material, by gravity (if, for example, the first mold surface 218 is the lower of the two mold surfaces 218, 122), by friction or by using any other suitable technique.
  • the method includes pressing the lid 110 against a portion of the first mold surface 218 that is contoured to complement the lid 110. Then, in FIG. 2E, with the pins 206 held in place at the holes 208 and while pressing the lid 110 against the first mold surface 218, a package 226 is molded contiguous with the lid 110. During molding, the pins 206 are captured by the mold compound so that the pins 206 become an integral part of the resulting package 226. In that resulting package 226 (see FIG. 2F), the pins 206 extend from the upper surface 130 of the package 226. [0045] As shown in FIG. 2F, the method also includes positioning an optics assembly 204 above the package 226.
  • the illustrated optics assembly 204 includes a housing 210 with alignment features ⁇ e.g., holes 212) formed in a surface 214 of the housing 210 that faces the upper surface 130 of the package 226. More particularly, the alignment features 202 (e.g., pins 206) extending from the upper surface 230 of the package 226 engage the corresponding alignment features (i.e., holes 212) on the surface 214 of the optics assembly housing 210 that faces the upper surface 230 of the package 226. The engagement of the pins 202 to the holes 212 facilitates proper alignment of the optics assembly 204 relative to the imaging plane of the device 102.
  • alignment features 202 e.g., pins 206
  • the optics assembly 204 also butts up against an upper edge of the lid 110 or an upper edge of the molding.
  • the pins 206 might be used to provide alignment along a plane that is parallel to the upper surface of the lid 110 and/or the package 226.
  • the resulting assembly includes a lid 110 that is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102.
  • the first mold surface 218 directly engages the lid 110. Therefore, the resulting molded package 226 has features that are in precise alignment relative to the imaging plane. Accordingly, the pins 206 too are in precise relative alignment to the imaging plane. Because the pins 206 are in precise relative alignment to the imaging plane, the optics assembly 204, which is aligned relative to the pins 206, also is precisely aligned relative to the imaging plane.
  • the illustrated housing 204 includes an aperture 224 that lines up with the lid 110 when the optics assembly 204 is coupled to the microelectronic assembly.
  • a pair of lenses 218, 220 and an infrared filter 222 are positioned inside the aperture 224 of the housing 204.
  • the pair of lenses 218, 220 and the infrared filter 222 can be molded into the housing 210 or can be held in place by an adhesive material.
  • the lenses 218, 220 help to focus light onto the active region 106 and the infrared filter 222 filters infrared light.
  • different optical elements or combinations of optical elements can be provided in the optics assembly 204 as well .
  • FIG. 2F illustrates pins 206 that extend from the molded package 226 to engage holes 212 in the optics assembly housing 210
  • an alternate implementation includes pins that extend from the optics assembly housing to engage corresponding holes in the molded package.
  • Other techniques may be utilized to facilitate alignment between the molded package and the optics assembly.
  • FIGS. 3A-3F are cross-sectional elevational views showing a method of forming a microelectronic assembly according to yet another embodiment of the invention. The illustrated method is similar to the method discussed above with reference to FIGS. 2A-2F, except that the method of FIGS. 3A-3F includes forming the alignment features from mold compound.
  • the first mold surface 318 includes a channel 302 formed therein.
  • the channel 302 is substantially cylindrical and has an inner surface 304 with threads and an outer surface 306 that is substantially smooth.
  • the lid 110 is placed in contact with a portion of the first mold surface 318 so as to not cover the channel 302 in the first mold surface 318.
  • the portion of the first mold surface 318 that contacts the lid 110 is contoured to complement the lid 110.
  • the upper surface 120 of the lid is substantially flat and the portion of the first mold surface 318 that contacts the lid 110 also is substantially flat.
  • the channel 302 is left uncovered so that, during molding, it fills with mold compound.
  • the package 326 is formed contiguous with the lid 110. Since, during molding, the lid 110 is pressed tightly against the first mold surface 318, mold compound is prevented from migrating over the upper surface 120 of the lid 110. [0054] Since the channel 302 is in fluid communication with the mold cavity during the molding process, mold compound fills the channel 302. (See FIG. 3E.) Once the mold compound substantially cures, the resulting package 326 can be unscrewed from the channel 302.
  • the resulting package 326 is shown in FIG. 3F and includes a structure 308 that extends upward from the upper surface 330 of the package 326 and defines an aperture 310 that is adapted to receive the optics assembly 350.
  • the aperture 310 is substantially cylindrical.
  • the illustrated optics assembly 350 also is substantially cylindrical and is sized to fit into the aperture 310.
  • the substantially cylindrical aperture 310 has an inner wall with internal screw threads 312.
  • the optics assembly housing 352 has corresponding external screw threads 314.
  • the external screw threads 314 of the optics assembly housing 352 are adapted to engage the internal screw threads 312 of the substantially cylindrical aperture 310.
  • the resulting microelectronic assembly includes a molded package 326 with one or more alignment features in its upper surface 130 and an optics assembly 204 with corresponding alignment features (e.g., screw threads 314), where the one or more alignment features in the upper surface are engaged to the corresponding alignment features (e.g., screw threads 314) on the optics assembly 304.
  • the lid 110 is precisely parallel to the plane (e.g., the imaging plane) of the active region 106 on the device 102.
  • the first mold surface 318 directly engages the lid 110. Therefore, the resulting molded package 326 has features that are in precise alignment relative to the imaging plane.
  • FIG. 4 is a cross-sectional elevational view of a microelectronic assembly 400 according to an embodiment of the invention.
  • the illustrated microelectronic assembly 400 is similar to the microelectronic assembly discussed above with reference to FIGS. IA- IE, except that the microelectronic assembly 400 of FIG. 4 includes an optics stack 402 that is molded in place atop the lid 110.
  • the optics stack 402 typically includes one or more optical elements, such as refractive surfaces, diftractive surfaces, antireflective coatings, infrared filter coatings and/or light blocking apertures.
  • the mold compound is formed so as to at least partially enclose the optics stack 402 and hold the optics stack 402 in place.
  • FIGS. 5A-5F are cross-sectional elevational views showing a method of forming and sealing a microelectronic assembly according to another embodiment of the invention.
  • the illustrated method includes providing a device 102 having an upper surface 104 with an active region 106.
  • a support structure 108 is coupled to the upper surface 104 adjacent to the active region 106 but does not extend onto the active region 106.
  • a lid 110 is in contact with the support structure 108 and is suspended above the active region 106. Bond pads 112 are exposed at the upper surface 104 of the device 102 outside the area of the upper surface 104 bounded by the support structure 108.
  • the illustrated lid 110 has a thin metallic layer 502 on its upper surface 120.
  • the thin metallic layer 502 typically is formed by evaporation, sputtering or other processes.
  • the thin metallic layer 502 is formed along a peripheral edge of the upper surface 120 and extends inward from the peripheral edge a small distance.
  • the center portion of the illustrated lid 110 is not covered by the thin metallic layer 502 and so, readily passes light into the active region 106.
  • the device 102, the lid 110 and the support structure 108 define a cavity 114 that contains the active region 106.
  • the cavity is otherwise substantially empty.
  • the cavity 114 is bounded on all sides by the support structure 108.
  • the upper surface 104 of the device 102 defines the bottom of the cavity 114.
  • the lid 110 extends over the area that is bounded by the support structure 108 and defines the top of the cavity 114.
  • the device 102 is coupled to a substrate 124.
  • the substrate 124 typically includes a substantially impermeable material, such as a ceramic, metal or glass. In some implementations, the entire substrate 124 is formed with one or more substantially impermeable materials.
  • the device 102 is electrically coupled to external conductive elements 116 via wire bonds 114.
  • the method includes, prior to molding, placing a housing 504 inside a mold cavity 506.
  • the housing 504 typically is formed from one or more substantially impermeable materials (e.g., glass, metal or ceramic) . Accordingly, the housing 504 itself is adapted to act as a substantially impermeable barrier.
  • the housing 504 includes indentations, pins, extensions, or other features that can facilitate alignment between the housing 504 and another assembly (e.g., an optics assembly) .
  • the first mold surface 518 includes a projection 510 extending toward the second mold surface 122.
  • the housing 504 includes an opening 508, through which the projection 510 extends.
  • the housing can be held in place inside the mold cavity 506 prior to and during molding.
  • gravity can hold the housing 504 in place.
  • a light adhesive material can hold the housing 504 in place.
  • friction between the opening 508 and the projection 510 can hold the housing 504 in place.
  • the microelectronic assembly is positioned inside the mold cavity 506 so that the lid 110 and/or the thin metallic layer 502 are in contact with the lower surface of the projection 510.
  • the lower surface of the projection 510 is contoured so as to complement the upper surface 120 of the lid 110 and/or the thin metallic layer 502.
  • the projection 510 is contoured so that it can seal against the lid 110 and/or the thin metallic layer 502 to prevent migration of mold compound onto the lid 110 during package formation.
  • a package 526 is formed while pressing the lid 110 and/or the thin metallic layer 502 against the first mold surface 518. Forming the package integrates the housing 504 into the resulting package. The resulting package 526 is contiguous with the lid 110. However, pressing the lid 110 against the first mold surface 518 during molding substantially prevents mold compound from migrating across the upper surface 120 of the lid 110.
  • the package 526 surrounds a perimeter of the lid 110.
  • the mold compound also covers the bond pads 112, the wire bonds 114 and part of the external conductive elements 116.
  • the package 526 is substantially opaque.
  • the device 102, the support structure 108 and the lid 110 substantially prevent mold compound from migrating into the cavity 114 during molding. Accordingly, the cavity 114 remains substantially empty throughout the molding process.
  • the method includes applying a bead 512 (e.g., a metal-based bead such as a solder bead) between the metallic layer 502 on the lid 110 and the substantially impermeable housing 504. That bead 512 seals the gap between the lid 110 and the substantially impermeable housing 504. It is further noted that there are many inks that, when sintered under heat, could form beads suitable for application according to the present techniques.
  • the method also includes applying a bead 514 between the substantially impermeable housing 504 and the substrate 124. That bead 514 seals any gap that might have existed between the substantially impermeable housing 504 and the substrate 124.
  • FIG. 5F shows an example of a structure produced by the above method.
  • the substrate 124, the housing 504, the lid 110 and the soldered joints therebetween, together seal the relatively porous molded package from external contaminants.
  • the opening 508 in the housing is aligned with the lid 110 so as to allow the passage of light to the lid 110.
  • FIG. 6 is a cross-sectional elevational view of microelectronic assembly 602 having a sealed package 626 according to yet another embodiment of the invention.
  • the illustrated microelectronic assembly 602 includes a device 102 coupled to a substantially impermeable substrate 124.
  • a support structure 108 is on an upper surface of the device 102.
  • a transparent lid 110 is in contact with the support structure 108 and extends over an active region 106 on the device 102.
  • An optics stack 402 is positioned above the lid 110.
  • a package 626 is contiguous with the lid 110 and the optics stack 402. During molding of the package 626, the upper surface of the lid 110 is pressed securely against the correspondingly contoured lower surface of the optics assembly 402.
  • Mold compound is thereby prevented from migrating onto the upper surface of the lid 110. Also, in some implementations, during molding, the upper surface of the optics assembly is pressed securely against a mold surface that is contoured in a manner to complement the upper surface of the optics assembly.
  • a substantially impermeable housing is formed around the package 626 and includes an opening above the optics assembly 402 to allow the passage of light to the lid 110 and ultimately to the active region 106 on the device 102.
  • a metallic layer 502 is formed on an upper surface of the optics assembly 402.
  • a bead 512 is between the metallic layer 502 and a metallic part of the substantially impermeable housing 504.
  • a second bead 514 is provided between the housing 504 and a metallic part of the substantially impermeable substrate 124.
  • the support structure 108 is an adhesive material.
  • an adhesive material as the support structure can advantageously simplify the manufacturing processes disclosed herein by helping to ensure that the lid 110 stays in place. Keeping the lid 110 in place can be particularly advantageous prior to molding the package 626.
  • the support structure could be other items, such as stud bumps or the like.
  • the first mold surface (e.g., 218 in FIG. 2C) has one or more features adapted to engage one or more side edges of the lid 110 when the lid is brought into contact with the first mold surface. That engagement helps to ensure proper horizontal alignment between the first mold surface and the optical device while the package is molded.
  • the engagement features extend from the first mold surface toward the second mold surface thereby forming a lip.
  • the lip is dimensioned so as to surround an upper edge of the lid 110. Ensuring proper alignment between the first mold surface and the optical device while the package is being molded is particularly important in those instances (e.g., FIGS. 2A-2F and FIGS. BASF) where the first mold surface is used to form one or more alignment features in the package.
  • the upper surface 120 of the lid 110 is shown in the figures as being a substantially flat surface, in some implementations, the upper surface 120 could be contoured in a variety of ways. In those implementations, the portion of the first mold surface (e.g., 118) that contacts the upper surface 120 of the lid 110 during molding would be contoured in a manner to complement the contours of the upper surface 120. More particularly, that portion of the first mold surface 118 would be contoured so that a tight seal could be achieved between it and the upper surface 120 of the lid 110. [0080] In some embodiments, the upper surface of the package is approximately flush with an upper surface of the lid. In other embodiments, the lid extends upward from the upper surface of the package.
  • the upper surface of the lid is recessed relative to the upper surface of the package.
  • the implementations disclosed herein include an upper surface of the package that is substantially parallel to the upper surface of the lid, in some implementations, the upper surface of the package can be angled or otherwise contoured relative to the upper surface of the lid in a non-parallel manner.
  • the order of steps in the various methods disclosed herein can be varied considerably and some embodiments include additional steps not specifically shown in the figures. For example, in some instances, particularly if the seal between the lid 110 and the first mold surface ⁇ e.g., 118) is not sufficiently tight, then some mold compound could migrate over the upper surface 120 of the lid 110. If that happens, an additional step of cleaning the upper surface 120 after molding might be desirable. Cleaning the upper surface 120 after molding can be accomplished, for example, by water jet cleaning.
  • the mold compound can be cured in a number of ways. For example, the simple passage of time may cure the mold compound. Alternatively, the curing may be facilitated by the application of heat or other facilitator to the mold compound. [0083] Typically, the upper surface of the lid and/or the thin metallic layer is kept in contact with the first mold surface until the mold compound is substantially cured. Maintaining such contact throughout the molding process helps ensure that little to no mold compound migrates onto the upper surface of the lid during molding.
  • the alignment features 202 formed in the upper surface of the package and the corresponding alignment features formed in the optics assembly can be implemented in a number of ways and can take on a variety of different shapes and sizes. Similarly, the alignment features can be formed from a variety of materials .
  • the housing 504 can be any size or shape. However, typically, the housing 504 is sized and shaped to fit over a package of a microelectronic assembly. Sealing the gap between the housing and the substrate and sealing the gap between the housing and the lid can be accomplished in a variety of ways. [0086] The techniques of sealing the package 526 of the microelectronic assembly disclosed in FIGS. 5A-5F can be implemented together with various combinations of the techniques shown in the other figures. Additionally, the manufacturing techniques and method and the structural features disclosed herein can be applied to a number of different types of microelectronic devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

Procédé consistant à former un ensemble microélectronique qui comporte l'étape consistant à fournir un dispositif (102) ayant une région active (106), à appliquer une structure adhésive (108) de support adjacente à la région active mais ne s'étendant pas sur la région active, à positionner un couvercle (110) en contact avec la structure adhésive de support et s'étendant sur la région active, à presser le couvercle (110) contre une surface moulée (118) qui est formée pour compléter le couvercle (110) et, tout en pressant le couvercle contre la surface moulée (118), à mouler un boîtier (126) contigu au couvercle (110).
PCT/US2007/026048 2006-12-29 2007-12-20 Dispositifs microélectroniques et procédés de fabrication de ceux-ci WO2008082565A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US64871806A 2006-12-29 2006-12-29
US11/648,718 2006-12-29
US72636607A 2007-03-21 2007-03-21
US11/726,366 2007-03-21
US98596207A 2007-11-19 2007-11-19
US11/985,962 2007-11-19

Publications (1)

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WO2008082565A1 true WO2008082565A1 (fr) 2008-07-10

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937996A1 (de) * 1988-11-25 1990-05-31 Mitsubishi Electric Corp Verfahren zur herstellung von halbleiteranordnungen
DE4319786A1 (de) * 1992-06-16 1993-12-23 Gold Star Electronics In Kunststoff gegossene CCD-Einheit und Verfahren zu deren Herstellung
EP0682374A1 (fr) * 1994-05-09 1995-11-15 Euratec B.V. Méthode d'encapsulation d'un circuit intégré
US5773323A (en) * 1995-04-27 1998-06-30 Lg Semicon Co., Ltd. Package for solid state image sensing device and method for manufacturing thereof
US6667543B1 (en) * 2002-10-29 2003-12-23 Motorola, Inc. Optical sensor package
US20060006511A1 (en) * 2004-07-06 2006-01-12 Samsung Electronics Co., Ltd. Ultrathin module for semiconductor device and method of fabricating the same
WO2006026372A1 (fr) * 2004-08-27 2006-03-09 Tessera, Inc. Emballage doté d’une lentille intégrale et à échelle d’une tranche

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3937996A1 (de) * 1988-11-25 1990-05-31 Mitsubishi Electric Corp Verfahren zur herstellung von halbleiteranordnungen
DE4319786A1 (de) * 1992-06-16 1993-12-23 Gold Star Electronics In Kunststoff gegossene CCD-Einheit und Verfahren zu deren Herstellung
EP0682374A1 (fr) * 1994-05-09 1995-11-15 Euratec B.V. Méthode d'encapsulation d'un circuit intégré
US5773323A (en) * 1995-04-27 1998-06-30 Lg Semicon Co., Ltd. Package for solid state image sensing device and method for manufacturing thereof
US6667543B1 (en) * 2002-10-29 2003-12-23 Motorola, Inc. Optical sensor package
US20060006511A1 (en) * 2004-07-06 2006-01-12 Samsung Electronics Co., Ltd. Ultrathin module for semiconductor device and method of fabricating the same
WO2006026372A1 (fr) * 2004-08-27 2006-03-09 Tessera, Inc. Emballage doté d’une lentille intégrale et à échelle d’une tranche

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