NL184184C - Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen. - Google Patents

Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Info

Publication number
NL184184C
NL184184C NL8101371A NL8101371A NL184184C NL 184184 C NL184184 C NL 184184C NL 8101371 A NL8101371 A NL 8101371A NL 8101371 A NL8101371 A NL 8101371A NL 184184 C NL184184 C NL 184184C
Authority
NL
Netherlands
Prior art keywords
contact
microcketes
electronic
places
applying
Prior art date
Application number
NL8101371A
Other languages
English (en)
Dutch (nl)
Other versions
NL184184B (nl
NL8101371A (nl
Inventor
Hermanus Antonius Van De Pas
Huibert Arnoldus Knobbout
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8101371A priority Critical patent/NL184184C/xx
Priority to US06/353,724 priority patent/US4442967A/en
Priority to DE3209242A priority patent/DE3209242C2/de
Priority to FR8204519A priority patent/FR2502397B1/fr
Priority to GB8207808A priority patent/GB2095473B/en
Priority to CH1667/82A priority patent/CH658540A5/de
Priority to IT2023782A priority patent/IT1150472B/it
Priority to AU81603/82A priority patent/AU548433B2/en
Priority to CA000398699A priority patent/CA1181534A/en
Priority to KR8201156A priority patent/KR900007043B1/ko
Priority to JP4180782A priority patent/JPS57163919A/ja
Priority to IE631/82A priority patent/IE53371B1/en
Publication of NL8101371A publication Critical patent/NL8101371A/nl
Publication of NL184184B publication Critical patent/NL184184B/xx
Application granted granted Critical
Publication of NL184184C publication Critical patent/NL184184C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/11Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/11Manufacturing methods
    • H01L2224/113Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134Stud bumping, i.e. using a wire-bonding apparatus
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    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
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    • H01L2924/1203Rectifying Diode
    • H01L2924/12033Gunn diode

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture Of Switches (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
NL8101371A 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen. NL184184C (nl)

Priority Applications (12)

Application Number Priority Date Filing Date Title
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
US06/353,724 US4442967A (en) 1981-03-20 1982-03-01 Method of providing raised electrical contacts on electronic microcircuits
DE3209242A DE3209242C2 (de) 1981-03-20 1982-03-13 Verfahren zum Anbringen von Kontakterhöhungen an Kontaktstellen einer elektronischen Mikroschaltung
GB8207808A GB2095473B (en) 1981-03-20 1982-03-17 Providing raised contact portions on contact areas of a microelectronic device
CH1667/82A CH658540A5 (de) 1981-03-20 1982-03-17 Verfahren zum anbringen von kontakterhoehungen an kontaktstellen einer elektronischen mikroschaltung.
IT2023782A IT1150472B (it) 1981-03-20 1982-03-17 Metodo per la creazione di porzioni sollevate di contatto su arre di contatto di un microcircuiro eletronico
FR8204519A FR2502397B1 (fr) 1981-03-20 1982-03-17 Procede permettant d'appliquer des surepaisseurs aux plages de contact d'un microcircuit electronique
AU81603/82A AU548433B2 (en) 1981-03-20 1982-03-17 Raised contact portions of electronic microcircuit
CA000398699A CA1181534A (en) 1981-03-20 1982-03-18 Method of providing raised contact portions on contact areas of an electronic microcircuit
KR8201156A KR900007043B1 (ko) 1981-03-20 1982-03-18 전자 마이크로 회로의 접촉 영역상에 상승 접촉부를 제공하는 방법
JP4180782A JPS57163919A (en) 1981-03-20 1982-03-18 Method of forming protruded contact
IE631/82A IE53371B1 (en) 1981-03-20 1982-03-18 Method of providing raised contact portions on contact areas of an electronic microcircuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
NL8101371 1981-03-20

Publications (3)

Publication Number Publication Date
NL8101371A NL8101371A (nl) 1982-10-18
NL184184B NL184184B (nl) 1988-12-01
NL184184C true NL184184C (nl) 1989-05-01

Family

ID=19837199

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8101371A NL184184C (nl) 1981-03-20 1981-03-20 Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.

Country Status (12)

Country Link
US (1) US4442967A (de)
JP (1) JPS57163919A (de)
KR (1) KR900007043B1 (de)
AU (1) AU548433B2 (de)
CA (1) CA1181534A (de)
CH (1) CH658540A5 (de)
DE (1) DE3209242C2 (de)
FR (1) FR2502397B1 (de)
GB (1) GB2095473B (de)
IE (1) IE53371B1 (de)
IT (1) IT1150472B (de)
NL (1) NL184184C (de)

Families Citing this family (95)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845543A (en) * 1983-09-28 1989-07-04 Hitachi, Ltd. Semiconductor device and method of manufacturing the same
FR2555813B1 (fr) * 1983-09-28 1986-06-20 Hitachi Ltd Dispositif a semi-conducteurs et procede de fabrication d'un tel dispositif
IT1183375B (it) * 1984-02-24 1987-10-22 Hitachi Ltd Dispositivo a semiconduttori comprendente una pallina, fili conduttori e porzioni conduttrici esterneche sono collegate alla pallina mediante tali fili conduttori
JPS60223149A (ja) * 1984-04-19 1985-11-07 Hitachi Ltd 半導体装置
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GB2095473B (en) 1984-09-19
JPS57163919A (en) 1982-10-08
JPH0441519B2 (de) 1992-07-08
IE820631L (en) 1982-09-20
NL184184B (nl) 1988-12-01
CA1181534A (en) 1985-01-22
GB2095473A (en) 1982-09-29
US4442967A (en) 1984-04-17
IE53371B1 (en) 1988-10-26
DE3209242A1 (de) 1982-11-11
KR830009648A (ko) 1983-12-22
AU8160382A (en) 1982-09-23
DE3209242C2 (de) 1985-04-11
KR900007043B1 (ko) 1990-09-27
FR2502397A1 (fr) 1982-09-24
NL8101371A (nl) 1982-10-18
FR2502397B1 (fr) 1986-07-25
CH658540A5 (de) 1986-11-14
AU548433B2 (en) 1985-12-12
IT8220237A0 (it) 1982-03-17
IT1150472B (it) 1986-12-10

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