JPS50160773A - - Google Patents
Info
- Publication number
- JPS50160773A JPS50160773A JP49068765A JP6876574A JPS50160773A JP S50160773 A JPS50160773 A JP S50160773A JP 49068765 A JP49068765 A JP 49068765A JP 6876574 A JP6876574 A JP 6876574A JP S50160773 A JPS50160773 A JP S50160773A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49068765A JPS50160773A (de) | 1974-06-18 | 1974-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49068765A JPS50160773A (de) | 1974-06-18 | 1974-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS50160773A true JPS50160773A (de) | 1975-12-26 |
Family
ID=13383147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49068765A Pending JPS50160773A (de) | 1974-06-18 | 1974-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS50160773A (de) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPS5940537A (ja) * | 1982-08-28 | 1984-03-06 | Rohm Co Ltd | 半導体装置の製造方法 |
| JPS6254500A (ja) * | 1985-09-02 | 1987-03-10 | 松下電器産業株式会社 | ワイヤ接続方法 |
| JPS6266641A (ja) * | 1985-09-19 | 1987-03-26 | Rohm Co Ltd | 半導体ペレツトのダイボンデイング方法 |
-
1974
- 1974-06-18 JP JP49068765A patent/JPS50160773A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57163919A (en) * | 1981-03-20 | 1982-10-08 | Philips Nv | Method of forming protruded contact |
| JPH0441519B2 (de) * | 1981-03-20 | 1992-07-08 | Fuiritsupusu Furuuiranpenfuaburiken Nv | |
| JPS5940537A (ja) * | 1982-08-28 | 1984-03-06 | Rohm Co Ltd | 半導体装置の製造方法 |
| JPS6254500A (ja) * | 1985-09-02 | 1987-03-10 | 松下電器産業株式会社 | ワイヤ接続方法 |
| JPS6266641A (ja) * | 1985-09-19 | 1987-03-26 | Rohm Co Ltd | 半導体ペレツトのダイボンデイング方法 |