NL153720B - Werkwijze voor het vervaardigen van een samengesteld lichaam door het verbinden van een lichaam van isolerend materiaal met een lichaam van niet-isolerend materiaal en samengesteld lichaam verkregen door deze werkwijze. - Google Patents
Werkwijze voor het vervaardigen van een samengesteld lichaam door het verbinden van een lichaam van isolerend materiaal met een lichaam van niet-isolerend materiaal en samengesteld lichaam verkregen door deze werkwijze.Info
- Publication number
- NL153720B NL153720B NL666606217A NL6606217A NL153720B NL 153720 B NL153720 B NL 153720B NL 666606217 A NL666606217 A NL 666606217A NL 6606217 A NL6606217 A NL 6606217A NL 153720 B NL153720 B NL 153720B
- Authority
- NL
- Netherlands
- Prior art keywords
- insulating material
- conductive
- semi
- sufficiently high
- composite
- Prior art date
Links
- 239000011810 insulating material Substances 0.000 title abstract 3
- 239000002131 composite material Substances 0.000 title 2
- 238000000034 method Methods 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052790 beryllium Inorganic materials 0.000 abstract 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052732 germanium Inorganic materials 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000012811 non-conductive material Substances 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000010453 quartz Substances 0.000 abstract 1
- 229910052594 sapphire Inorganic materials 0.000 abstract 1
- 239000010980 sapphire Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
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- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/903—Metal to nonmetal
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Ceramic Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Die Bonding (AREA)
- Pressure Sensors (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US45360065A | 1965-05-06 | 1965-05-06 | |
US51177165A | 1965-12-06 | 1965-12-06 | |
US583907A US3397278A (en) | 1965-05-06 | 1966-10-03 | Anodic bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
NL6606217A NL6606217A (pt) | 1966-11-07 |
NL153720B true NL153720B (nl) | 1977-06-15 |
Family
ID=27412574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL666606217A NL153720B (nl) | 1965-05-06 | 1966-05-06 | Werkwijze voor het vervaardigen van een samengesteld lichaam door het verbinden van een lichaam van isolerend materiaal met een lichaam van niet-isolerend materiaal en samengesteld lichaam verkregen door deze werkwijze. |
Country Status (13)
Country | Link |
---|---|
US (1) | US3397278A (pt) |
JP (1) | JPS5328747B1 (pt) |
BE (1) | BE680529A (pt) |
BR (1) | BR6679299D0 (pt) |
CH (1) | CH451273A (pt) |
DE (1) | DE1665042A1 (pt) |
DK (1) | DK127988B (pt) |
FR (1) | FR1478918A (pt) |
GB (1) | GB1138401A (pt) |
IL (1) | IL25656A (pt) |
NL (1) | NL153720B (pt) |
NO (1) | NO119844B (pt) |
SE (1) | SE351518B (pt) |
Families Citing this family (182)
Publication number | Priority date | Publication date | Assignee | Title |
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US3470348A (en) * | 1966-04-18 | 1969-09-30 | Mallory & Co Inc P R | Anodic bonding of liquid metals to insulators |
US3506545A (en) * | 1967-02-14 | 1970-04-14 | Ibm | Method for plating conductive patterns with high resolution |
US3506424A (en) * | 1967-05-03 | 1970-04-14 | Mallory & Co Inc P R | Bonding an insulator to an insulator |
US3521128A (en) * | 1967-08-02 | 1970-07-21 | Rca Corp | Microminiature electrical component having integral indexing means |
US3577629A (en) * | 1968-10-18 | 1971-05-04 | Mallory & Co Inc P R | Bonding oxidizable metals to insulators |
US3722074A (en) * | 1969-04-21 | 1973-03-27 | Philips Corp | Method of sealing a metal article to a glass article in a vacuum-tight manner |
JPS4831507B1 (pt) * | 1969-07-10 | 1973-09-29 | ||
US3697917A (en) * | 1971-08-02 | 1972-10-10 | Gen Electric | Semiconductor strain gage pressure transducer |
US3783218A (en) * | 1972-01-12 | 1974-01-01 | Gen Electric | Electrostatic bonding process |
US3775839A (en) * | 1972-03-27 | 1973-12-04 | Itt | Method of making a transducer |
US3778896A (en) * | 1972-05-05 | 1973-12-18 | Bell & Howell Co | Bonding an insulator to an inorganic member |
US3781978A (en) * | 1972-05-16 | 1974-01-01 | Gen Electric | Process of making thermoelectrostatic bonded semiconductor devices |
BE792414A (fr) * | 1972-06-21 | 1973-03-30 | Siemens Ag | Procede d'etablissement d'une liaison etanche aux gaz pour des pieces en silicium ou carbure de silicium cristallin |
US4034181A (en) * | 1972-08-18 | 1977-07-05 | Minnesota Mining And Manufacturing Company | Adhesive-free process for bonding a semiconductor crystal to an electrically insulating, thermally conductive stratum |
US3803706A (en) * | 1972-12-27 | 1974-04-16 | Itt | Method of making a transducer |
US3951707A (en) * | 1973-04-02 | 1976-04-20 | Kulite Semiconductor Products, Inc. | Method for fabricating glass-backed transducers and glass-backed structures |
US3805377A (en) * | 1973-04-18 | 1974-04-23 | Itt | Method of making a transducer |
JPS5527120Y2 (pt) * | 1974-03-28 | 1980-06-28 | ||
US3902979A (en) * | 1974-06-24 | 1975-09-02 | Westinghouse Electric Corp | Insulator substrate with a thin mono-crystalline semiconductive layer and method of fabrication |
US3953920A (en) * | 1975-05-14 | 1976-05-04 | International Telephone & Telegraph Corporation | Method of making a transducer |
CA1063254A (en) * | 1975-09-04 | 1979-09-25 | Shu-Yau Wu | Electrostatically bonded semiconductor-on-insulator mos device, and a method of making the same |
CA1078217A (en) * | 1976-03-31 | 1980-05-27 | Robert C. Whitehead (Jr.) | Force transducing cantilever beam and pressure transducer incorporating it |
US4203128A (en) * | 1976-11-08 | 1980-05-13 | Wisconsin Alumni Research Foundation | Electrostatically deformable thin silicon membranes |
US4083710A (en) * | 1977-01-21 | 1978-04-11 | Rca Corporation | Method of forming a metal pattern on an insulating substrate |
US4109063A (en) * | 1977-06-17 | 1978-08-22 | General Electric Company | Composite body |
US4142946A (en) * | 1977-06-17 | 1979-03-06 | General Electric Company | Method of bonding a metallic element to a solid ion-conductive electrolyte material element |
US4197171A (en) * | 1977-06-17 | 1980-04-08 | General Electric Company | Solid electrolyte material composite body, and method of bonding |
US4142945A (en) * | 1977-06-22 | 1979-03-06 | General Electric Company | Method of forming a composite body and method of bonding |
US4179324A (en) * | 1977-11-28 | 1979-12-18 | Spire Corporation | Process for fabricating thin film and glass sheet laminate |
DE2943231A1 (de) * | 1978-03-17 | 1980-12-11 | Hitachi Ltd | Semiconductor pressure sensors having a plurality of pressure-sensitive diaphragms and method of manufacturing the same |
JPS54131892A (en) * | 1978-04-05 | 1979-10-13 | Hitachi Ltd | Semiconductor pressure converter |
US4216477A (en) * | 1978-05-10 | 1980-08-05 | Hitachi, Ltd. | Nozzle head of an ink-jet printing apparatus with built-in fluid diodes |
JPS5516228A (en) * | 1978-07-21 | 1980-02-04 | Hitachi Ltd | Capacity type sensor |
JPS5543819A (en) * | 1978-09-22 | 1980-03-27 | Hitachi Ltd | Pressure detecting equipment |
JPS5544786A (en) * | 1978-09-27 | 1980-03-29 | Hitachi Ltd | Pressure sensor |
US4230256A (en) * | 1978-11-06 | 1980-10-28 | General Electric Company | Method of bonding a composite body to a metallic element |
DE2909985C3 (de) * | 1979-03-14 | 1981-10-22 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zur Herstellung eines Halbleiter-Glas-Verbundwerkstoffs und Verwendung eines solchen Verbundwerkstoffes |
US4234361A (en) * | 1979-07-05 | 1980-11-18 | Wisconsin Alumni Research Foundation | Process for producing an electrostatically deformable thin silicon membranes utilizing a two-stage diffusion step to form an etchant resistant layer |
US4294602A (en) * | 1979-08-09 | 1981-10-13 | The Boeing Company | Electro-optically assisted bonding |
US4261086A (en) * | 1979-09-04 | 1981-04-14 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
US4386453A (en) * | 1979-09-04 | 1983-06-07 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
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US4322980A (en) * | 1979-11-08 | 1982-04-06 | Hitachi, Ltd. | Semiconductor pressure sensor having plural pressure sensitive diaphragms and method |
NL8003696A (nl) * | 1980-06-26 | 1982-01-18 | Philips Nv | Werkwijze voor het vervaardigen van een elektrische ontladingsinrichting, welke een van een elektroden- patroon voorzien glazen substraat bevat en aldus ver- kregen elektrische ontladingsinrichting. |
GB2090710B (en) * | 1980-12-26 | 1984-10-03 | Matsushita Electric Ind Co Ltd | Thermistor heating device |
US4393105A (en) * | 1981-04-20 | 1983-07-12 | Spire Corporation | Method of fabricating a thermal pane window and product |
US4390925A (en) * | 1981-08-26 | 1983-06-28 | Leeds & Northrup Company | Multiple-cavity variable capacitance pressure transducer |
US4384899A (en) * | 1981-11-09 | 1983-05-24 | Motorola Inc. | Bonding method adaptable for manufacturing capacitive pressure sensing elements |
US4475790A (en) * | 1982-01-25 | 1984-10-09 | Spire Corporation | Fiber optic coupler |
FI65674C (fi) * | 1982-12-21 | 1984-06-11 | Vaisala Oy | Kapacitiv fuktighetsgivare och foerfarande foer framstaellningdaerav |
US4527428A (en) * | 1982-12-30 | 1985-07-09 | Hitachi, Ltd. | Semiconductor pressure transducer |
US4501060A (en) * | 1983-01-24 | 1985-02-26 | At&T Bell Laboratories | Dielectrically isolated semiconductor devices |
JPS6051700A (ja) * | 1983-08-31 | 1985-03-23 | Toshiba Corp | シリコン結晶体の接合方法 |
JPS60131746A (ja) * | 1983-12-20 | 1985-07-13 | Hitachi Ltd | 荷電粒子線用加速管 |
US4543457A (en) * | 1984-01-25 | 1985-09-24 | Transensory Devices, Inc. | Microminiature force-sensitive switch |
US4525766A (en) * | 1984-01-25 | 1985-06-25 | Transensory Devices, Inc. | Method and apparatus for forming hermetically sealed electrical feedthrough conductors |
US4632871A (en) * | 1984-02-16 | 1986-12-30 | Varian Associates, Inc. | Anodic bonding method and apparatus for X-ray masks |
US4613891A (en) * | 1984-02-17 | 1986-09-23 | At&T Bell Laboratories | Packaging microminiature devices |
FI69211C (fi) * | 1984-02-21 | 1985-12-10 | Vaisala Oy | Kapacitiv styckgivare |
FI75426C (fi) * | 1984-10-11 | 1988-06-09 | Vaisala Oy | Absoluttryckgivare. |
US4625560A (en) * | 1985-05-13 | 1986-12-02 | The Scott & Fetzer Company | Capacitive digital integrated circuit pressure transducer |
US4741796A (en) * | 1985-05-29 | 1988-05-03 | Siemens Aktiengesellschaft | Method for positioning and bonding a solid body to a support base |
US4643532A (en) * | 1985-06-24 | 1987-02-17 | At&T Bell Laboratories | Field-assisted bonding method and articles produced thereby |
US4639631A (en) * | 1985-07-01 | 1987-01-27 | Motorola, Inc. | Electrostatically sealed piezoelectric device |
US4680243A (en) * | 1985-08-02 | 1987-07-14 | Micronix Corporation | Method for producing a mask for use in X-ray photolithography and resulting structure |
NL8600216A (nl) * | 1986-01-30 | 1987-08-17 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleiderinrichting. |
DE3621331A1 (de) * | 1986-06-26 | 1988-01-14 | Fraunhofer Ges Forschung | Mikroventil |
US4773972A (en) * | 1986-10-30 | 1988-09-27 | Ford Motor Company | Method of making silicon capacitive pressure sensor with glass layer between silicon wafers |
CH671653A5 (pt) * | 1986-11-03 | 1989-09-15 | Landis & Gyr Ag | |
US4737756A (en) * | 1987-01-08 | 1988-04-12 | Imo Delaval Incorporated | Electrostatically bonded pressure transducers for corrosive fluids |
US4875750A (en) * | 1987-02-25 | 1989-10-24 | Siemens Aktiengesellschaft | Optoelectronic coupling element and method for its manufacture |
FI872049A (fi) * | 1987-05-08 | 1988-11-09 | Vaisala Oy | Kondensatorkonstruktion foer anvaendning vid tryckgivare. |
FI84401C (fi) * | 1987-05-08 | 1991-11-25 | Vaisala Oy | Kapacitiv tryckgivarkonstruktion. |
US5013396A (en) * | 1987-06-01 | 1991-05-07 | The Regents Of The University Of Michigan | Method of making an ultraminiature pressure sensor |
US5207103A (en) * | 1987-06-01 | 1993-05-04 | Wise Kensall D | Ultraminiature single-crystal sensor with movable member |
US4881410A (en) * | 1987-06-01 | 1989-11-21 | The Regents Of The University Of Michigan | Ultraminiature pressure sensor and method of making same |
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US2567877A (en) * | 1947-07-11 | 1951-09-11 | Ment Jack De | Electrochemical bonding of aluminum with other materials |
US3256598A (en) * | 1963-07-25 | 1966-06-21 | Martin Marietta Corp | Diffusion bonding |
-
1966
- 1966-04-22 GB GB17792/66A patent/GB1138401A/en not_active Expired
- 1966-04-25 SE SE05597/66A patent/SE351518B/xx unknown
- 1966-04-28 IL IL25656A patent/IL25656A/en unknown
- 1966-05-04 DE DE19661665042 patent/DE1665042A1/de active Pending
- 1966-05-04 BE BE680529D patent/BE680529A/xx not_active IP Right Cessation
- 1966-05-05 NO NO162890A patent/NO119844B/no unknown
- 1966-05-05 CH CH652066A patent/CH451273A/de unknown
- 1966-05-05 DK DK231466AA patent/DK127988B/da unknown
- 1966-05-06 JP JP2835566A patent/JPS5328747B1/ja active Pending
- 1966-05-06 FR FR60520A patent/FR1478918A/fr not_active Expired
- 1966-05-06 BR BR179299/66A patent/BR6679299D0/pt unknown
- 1966-05-06 NL NL666606217A patent/NL153720B/xx not_active IP Right Cessation
- 1966-10-03 US US583907A patent/US3397278A/en not_active Expired - Lifetime
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---|---|
GB1138401A (en) | 1969-01-01 |
BR6679299D0 (pt) | 1973-08-09 |
SE351518B (pt) | 1972-11-27 |
DK127988B (da) | 1974-02-11 |
DE1665042A1 (de) | 1970-10-08 |
CH451273A (de) | 1968-05-15 |
FR1478918A (fr) | 1967-04-28 |
IL25656A (en) | 1970-09-17 |
NL6606217A (pt) | 1966-11-07 |
NO119844B (pt) | 1970-07-13 |
BE680529A (pt) | 1966-11-04 |
JPS5328747B1 (pt) | 1978-08-16 |
US3397278A (en) | 1968-08-13 |
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Owner name: MALLORY |