NL7612047A - Glas voor het hermetisch omhullen en passiveren van halfgeleiderinrichtingen. - Google Patents
Glas voor het hermetisch omhullen en passiveren van halfgeleiderinrichtingen.Info
- Publication number
- NL7612047A NL7612047A NL7612047A NL7612047A NL7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A
- Authority
- NL
- Netherlands
- Prior art keywords
- passivation
- glass
- semiconductor devices
- hermetic covering
- hermetic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/12—Silica-free oxide glass compositions
- C03C3/14—Silica-free oxide glass compositions containing boron
- C03C3/142—Silica-free oxide glass compositions containing boron containing lead
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
- C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
- C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
- C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2214/00—Nature of the non-vitreous component
- C03C2214/04—Particles; Flakes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752548736 DE2548736C3 (de) | 1975-10-31 | 1975-10-31 | Composit-Passivierungsglas auf der Basis PbO-B2 Okskö-ab O3) m't einem thermischen Ausdehnungskoeffizienten (200-300 Grad C) zwischen 40 und 60 mal 10"7 / Grad C für Silicium-Halbleiterbauelemente mit Aufschmelztemperaturen von höchstens 600 Grad C |
DE19762606029 DE2606029C3 (de) | 1976-02-14 | 1976-02-14 | Composit-Passivierungsglas auf der Basis PbO - B2 O3 - (SiO2 - Al2 O3 ) mit einem thermischen Ausdehnungskoeffizienten (20-300 Grad C) von bis zu 75 mal 10 7 /Grad C für Silicium-Halbleiterbauelemente mit |
Publications (1)
Publication Number | Publication Date |
---|---|
NL7612047A true NL7612047A (nl) | 1977-05-03 |
Family
ID=25769562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL7612047A NL7612047A (nl) | 1975-10-31 | 1976-10-29 | Glas voor het hermetisch omhullen en passiveren van halfgeleiderinrichtingen. |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS5256867A (nl) |
FR (1) | FR2329602A1 (nl) |
NL (1) | NL7612047A (nl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4515898A (en) * | 1981-09-01 | 1985-05-07 | Motorola, Inc. | Glass bonding means and method |
US4696909A (en) * | 1986-04-07 | 1987-09-29 | Owens-Illinois Television Products Inc. | Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5594975A (en) * | 1979-01-16 | 1980-07-18 | Asahi Glass Co Ltd | Low expansion powder composition for bonding use |
JPS5669242A (en) * | 1979-11-09 | 1981-06-10 | Asahi Glass Co Ltd | Improved glass composition for sealing |
US4246034A (en) * | 1980-01-14 | 1981-01-20 | Corning Glass Works | Devitrifying solder sealing glasses |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR87810E (fr) * | 1961-09-29 | 1966-05-20 | Ibm | Objets revêtus et procédé de réalisation de leurs revêtements protecteurs |
DE1596995A1 (de) * | 1967-12-28 | 1971-04-01 | Siemens Ag | Glaslot |
JPS4941083A (nl) * | 1972-08-28 | 1974-04-17 | ||
JPS5922691B2 (ja) * | 1976-06-28 | 1984-05-28 | 三菱油化株式会社 | ヒドロシンナムアルデヒド誘導体 |
-
1976
- 1976-10-29 NL NL7612047A patent/NL7612047A/nl not_active Application Discontinuation
- 1976-10-29 JP JP12956476A patent/JPS5256867A/ja active Granted
- 1976-10-29 FR FR7632727A patent/FR2329602A1/fr not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4515898A (en) * | 1981-09-01 | 1985-05-07 | Motorola, Inc. | Glass bonding means and method |
US4696909A (en) * | 1986-04-07 | 1987-09-29 | Owens-Illinois Television Products Inc. | Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses |
Also Published As
Publication number | Publication date |
---|---|
JPS557697B2 (nl) | 1980-02-27 |
JPS5256867A (en) | 1977-05-10 |
FR2329602A1 (fr) | 1977-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
BV | The patent application has lapsed |