NL7713114A - Werkwijze voor het vervaardigen van halfge- leiderinrichtingen. - Google Patents

Werkwijze voor het vervaardigen van halfge- leiderinrichtingen.

Info

Publication number
NL7713114A
NL7713114A NL7713114A NL7713114A NL7713114A NL 7713114 A NL7713114 A NL 7713114A NL 7713114 A NL7713114 A NL 7713114A NL 7713114 A NL7713114 A NL 7713114A NL 7713114 A NL7713114 A NL 7713114A
Authority
NL
Netherlands
Prior art keywords
procedure
conductor devices
manufacturing semi
semi
manufacturing
Prior art date
Application number
NL7713114A
Other languages
English (en)
Other versions
NL177866B (nl
NL177866C (nl
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP14431176A external-priority patent/JPS5368567A/ja
Priority claimed from JP51144312A external-priority patent/JPS5826653B2/ja
Priority claimed from JP15107576A external-priority patent/JPS5374358A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of NL7713114A publication Critical patent/NL7713114A/nl
Publication of NL177866B publication Critical patent/NL177866B/nl
Application granted granted Critical
Publication of NL177866C publication Critical patent/NL177866C/nl

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/763—Polycrystalline semiconductor regions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49789—Obtaining plural product pieces from unitary workpiece
    • Y10T29/4979—Breaking through weakened portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Weting (AREA)
  • Thyristors (AREA)
NLAANVRAGE7713114,A 1976-11-30 1977-11-29 Werkwijze voor het vervaardigen van afzonderlijke halfgeleiderelementen, waarbij in een schijfvormig lichaam van halfgeleidermateriaal gevormde halfgeleiderelementen van elkaar worden gescheiden door het schijfvormige lichaam te breken. NL177866C (nl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP14431176A JPS5368567A (en) 1976-11-30 1976-11-30 Production of semiconductor device
JP51144312A JPS5826653B2 (ja) 1976-11-30 1976-11-30 半導体装置の製造方法
JP15107576A JPS5374358A (en) 1976-12-15 1976-12-15 Manufacture of semiconductor device

Publications (3)

Publication Number Publication Date
NL7713114A true NL7713114A (nl) 1978-06-01
NL177866B NL177866B (nl) 1985-07-01
NL177866C NL177866C (nl) 1985-12-02

Family

ID=27318800

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7713114,A NL177866C (nl) 1976-11-30 1977-11-29 Werkwijze voor het vervaardigen van afzonderlijke halfgeleiderelementen, waarbij in een schijfvormig lichaam van halfgeleidermateriaal gevormde halfgeleiderelementen van elkaar worden gescheiden door het schijfvormige lichaam te breken.

Country Status (4)

Country Link
US (1) US4304043A (nl)
DE (1) DE2753207C2 (nl)
GB (1) GB1559717A (nl)
NL (1) NL177866C (nl)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2082836A (en) * 1980-08-20 1982-03-10 Philips Electronic Associated Corrugated semiconductor devices
JPS63124486A (ja) * 1986-11-13 1988-05-27 Mitsubishi Electric Corp 半導体レ−ザの製造方法
FR2609212B1 (fr) * 1986-12-29 1989-10-20 Thomson Semiconducteurs Procede de decoupe collective, par voie chimique, de dispositifs semiconducteurs, et dispositif decoupe par ce procede
US5017512A (en) * 1989-07-27 1991-05-21 Mitsubishi Denki Kabushiki Kaisha Wafer having a dicing area having a step region covered with a conductive layer and method of manufacturing the same
JP2003510811A (ja) * 1999-09-22 2003-03-18 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体装置の製造方法
JP2006140294A (ja) * 2004-11-11 2006-06-01 Fujitsu Ltd 半導体基板、半導体装置の製造方法及び半導体装置の試験方法
US20160148875A1 (en) * 2013-08-08 2016-05-26 Sharp Kabushiki Kaisha Semiconductor element substrate, and method for producing same
WO2017217108A1 (ja) * 2016-06-13 2017-12-21 バンドー化学株式会社 研磨材
CN109307981B (zh) * 2017-07-26 2022-03-22 天津环鑫科技发展有限公司 一种gpp生产的光刻版工艺

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1221363B (de) * 1964-04-25 1966-07-21 Telefunken Patent Verfahren zum Verringern des Bahnwiderstands von Halbleiterbauelementen
US3493820A (en) * 1966-12-01 1970-02-03 Raytheon Co Airgap isolated semiconductor device
US3513022A (en) * 1967-04-26 1970-05-19 Rca Corp Method of fabricating semiconductor devices
US3628107A (en) * 1969-05-05 1971-12-14 Gen Electric Passivated semiconductor device with peripheral protective junction
US3716429A (en) * 1970-06-18 1973-02-13 Rca Corp Method of making semiconductor devices
DE2115305C2 (de) * 1971-03-30 1982-09-30 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Solarzelle aus einem Halbleiterkörper
US3783044A (en) * 1971-04-09 1974-01-01 Motorola Inc Photoresist keys and depth indicator
US3972113A (en) * 1973-05-14 1976-08-03 Mitsubishi Denki Kabushiki Kaisha Process of producing semiconductor devices
US3941625A (en) * 1973-10-11 1976-03-02 General Electric Company Glass passivated gold diffused SCR pellet and method for making
US3928094A (en) * 1975-01-16 1975-12-23 Fairchild Camera Instr Co Method of aligning a wafer beneath a mask and system therefor and wafer having a unique alignment pattern
US3968563A (en) * 1975-03-27 1976-07-13 E. I. Du Pont De Nemours And Company Precision registration system for leads
JPS5258379A (en) * 1975-11-08 1977-05-13 Toshiba Corp Production of semiconductor element

Also Published As

Publication number Publication date
DE2753207A1 (de) 1978-06-01
NL177866B (nl) 1985-07-01
NL177866C (nl) 1985-12-02
GB1559717A (en) 1980-01-23
DE2753207C2 (de) 1989-10-12
US4304043A (en) 1981-12-08

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Legal Events

Date Code Title Description
BC A request for examination has been filed
A85 Still pending on 85-01-01
V1 Lapsed because of non-payment of the annual fee

Effective date: 19960601