JPS5368567A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5368567A
JPS5368567A JP14431176A JP14431176A JPS5368567A JP S5368567 A JPS5368567 A JP S5368567A JP 14431176 A JP14431176 A JP 14431176A JP 14431176 A JP14431176 A JP 14431176A JP S5368567 A JPS5368567 A JP S5368567A
Authority
JP
Japan
Prior art keywords
regions
production
wafers
semiconductor device
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14431176A
Other languages
Japanese (ja)
Inventor
Hiroshi Gamo
Takeshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14431176A priority Critical patent/JPS5368567A/en
Priority to NLAANVRAGE7713114,A priority patent/NL177866C/en
Priority to DE2753207A priority patent/DE2753207C2/en
Priority to GB49911/77A priority patent/GB1559717A/en
Publication of JPS5368567A publication Critical patent/JPS5368567A/en
Priority to US06/137,971 priority patent/US4304043A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To reduce the damaging of wafers while maintainning the thickness of pellet forming regions at a specified value, make possible the use of wafers of a large diameter and obtain a multiplicity of pellets with good yield by sectioning one sheet of semiconductor wafer to plural pellet forming region and increasing the thickness of the remaining regions other than these to make these regions as reinforcing regions.
COPYRIGHT: (C)1978,JPO&Japio
JP14431176A 1976-11-30 1976-11-30 Production of semiconductor device Pending JPS5368567A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP14431176A JPS5368567A (en) 1976-11-30 1976-11-30 Production of semiconductor device
NLAANVRAGE7713114,A NL177866C (en) 1976-11-30 1977-11-29 METHOD FOR MANUFACTURING SEPARATE SEMICONDUCTOR ELEMENTS, WITH SEMICONDUCTOR MEMORY CONDUCTED IN A DISC-SHAPED BODY MATERIAL.
DE2753207A DE2753207C2 (en) 1976-11-30 1977-11-29 Method for manufacturing semiconductor components
GB49911/77A GB1559717A (en) 1976-11-30 1977-11-30 Process for preparing semiconductor device
US06/137,971 US4304043A (en) 1976-11-30 1980-04-07 Process for preparing semiconductor device _by forming reinforcing regions to facilitate separation of pellets

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14431176A JPS5368567A (en) 1976-11-30 1976-11-30 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5368567A true JPS5368567A (en) 1978-06-19

Family

ID=15359126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14431176A Pending JPS5368567A (en) 1976-11-30 1976-11-30 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5368567A (en)

Similar Documents

Publication Publication Date Title
JPS52128066A (en) Manufacture of semiconductor device
JPS5297666A (en) Production of semiconductor device containing pn junctions
JPS5339061A (en) Production of semiconductor device
JPS53114685A (en) Manufacture for semiconductor device
JPS52131464A (en) Manufacture of semiconductor device
JPS5368567A (en) Production of semiconductor device
JPS5260567A (en) Production of semiconductor device
JPS531471A (en) Manufacture for semiconductor device
JPS5339067A (en) Production of semiconductor device
JPS5368182A (en) Production of semiconductor memory device
JPS5258379A (en) Production of semiconductor element
JPS5423466A (en) Manufacture for semiconductor device
JPS5368568A (en) Production of semiconductor device
JPS5356980A (en) Production of semiconductor device
JPS5363866A (en) Production of semiconductor device
JPS5311574A (en) Production of semiconductor device
JPS5346222A (en) Solid state pick up unit
JPS5230173A (en) Manufacturing method of semiconductor element
JPS53145572A (en) Production of semiconductor device
JPS52143767A (en) Production of semiconductor device
JPS5244163A (en) Process for productin of semiconductor element
JPS5314585A (en) Semiconductor device
JPS5374383A (en) Manufacture of compound semiconductor device
JPS5345968A (en) Semiconductor device
JPS52135667A (en) Dicing method of semiconductor wafer