JPS5423466A - Manufacture for semiconductor device - Google Patents

Manufacture for semiconductor device

Info

Publication number
JPS5423466A
JPS5423466A JP8950277A JP8950277A JPS5423466A JP S5423466 A JPS5423466 A JP S5423466A JP 8950277 A JP8950277 A JP 8950277A JP 8950277 A JP8950277 A JP 8950277A JP S5423466 A JPS5423466 A JP S5423466A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacture
semiconductor
rationalize
hours
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8950277A
Other languages
Japanese (ja)
Other versions
JPS576697B2 (en
Inventor
Kazuyoshi Fujiyoshi
Norio Tokito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8950277A priority Critical patent/JPS5423466A/en
Publication of JPS5423466A publication Critical patent/JPS5423466A/en
Publication of JPS576697B2 publication Critical patent/JPS576697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To rationalize the manufacturing process of a semiconductor device, by enabling automatic pick up without requiring man-hours, in a process obtaining a semiconductor pellet from a semiconductor wafer.
COPYRIGHT: (C)1979,JPO&Japio
JP8950277A 1977-07-25 1977-07-25 Manufacture for semiconductor device Granted JPS5423466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8950277A JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8950277A JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5423466A true JPS5423466A (en) 1979-02-22
JPS576697B2 JPS576697B2 (en) 1982-02-06

Family

ID=13972534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8950277A Granted JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5423466A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51133231A (en) * 1975-05-02 1976-11-18 Basf Ag Process for manufacturing nnalkyll or nnalkenyllcarbamic acid ester
JPS5994434A (en) * 1982-11-19 1984-05-31 Nitto Electric Ind Co Ltd Detachable method of semiconductor element
US10373606B2 (en) 2015-03-24 2019-08-06 Kabushiki Kaisha Toshiba Transliteration support device, transliteration support method, and computer program product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497864A (en) * 1972-03-30 1974-01-24
JPS49105445A (en) * 1973-02-07 1974-10-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497864A (en) * 1972-03-30 1974-01-24
JPS49105445A (en) * 1973-02-07 1974-10-05

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51133231A (en) * 1975-05-02 1976-11-18 Basf Ag Process for manufacturing nnalkyll or nnalkenyllcarbamic acid ester
JPS5994434A (en) * 1982-11-19 1984-05-31 Nitto Electric Ind Co Ltd Detachable method of semiconductor element
US10373606B2 (en) 2015-03-24 2019-08-06 Kabushiki Kaisha Toshiba Transliteration support device, transliteration support method, and computer program product

Also Published As

Publication number Publication date
JPS576697B2 (en) 1982-02-06

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