JPS576697B2 - - Google Patents

Info

Publication number
JPS576697B2
JPS576697B2 JP8950277A JP8950277A JPS576697B2 JP S576697 B2 JPS576697 B2 JP S576697B2 JP 8950277 A JP8950277 A JP 8950277A JP 8950277 A JP8950277 A JP 8950277A JP S576697 B2 JPS576697 B2 JP S576697B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8950277A
Other languages
Japanese (ja)
Other versions
JPS5423466A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8950277A priority Critical patent/JPS5423466A/en
Publication of JPS5423466A publication Critical patent/JPS5423466A/en
Publication of JPS576697B2 publication Critical patent/JPS576697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
JP8950277A 1977-07-25 1977-07-25 Manufacture for semiconductor device Granted JPS5423466A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8950277A JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8950277A JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5423466A JPS5423466A (en) 1979-02-22
JPS576697B2 true JPS576697B2 (en) 1982-02-06

Family

ID=13972534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8950277A Granted JPS5423466A (en) 1977-07-25 1977-07-25 Manufacture for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5423466A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095034A (en) * 1975-05-02 1978-06-13 Basf Aktiengesellschaft Manufacture of α-naphthyl-N-methyl-carbamate
JPS5994434A (en) * 1982-11-19 1984-05-31 Nitto Electric Ind Co Ltd Detachable method of semiconductor element
JP6392445B2 (en) 2015-03-24 2018-09-19 株式会社東芝 Transliteration support device, transliteration support method, and transliteration support program

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497864A (en) * 1972-03-30 1974-01-24
JPS49105445A (en) * 1973-02-07 1974-10-05

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS497864A (en) * 1972-03-30 1974-01-24
JPS49105445A (en) * 1973-02-07 1974-10-05

Also Published As

Publication number Publication date
JPS5423466A (en) 1979-02-22

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