JPS52154356A - Pellet mounting method - Google Patents

Pellet mounting method

Info

Publication number
JPS52154356A
JPS52154356A JP7110076A JP7110076A JPS52154356A JP S52154356 A JPS52154356 A JP S52154356A JP 7110076 A JP7110076 A JP 7110076A JP 7110076 A JP7110076 A JP 7110076A JP S52154356 A JPS52154356 A JP S52154356A
Authority
JP
Japan
Prior art keywords
mounting method
pellet mounting
pellet
yield
improvement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7110076A
Other languages
Japanese (ja)
Inventor
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7110076A priority Critical patent/JPS52154356A/en
Publication of JPS52154356A publication Critical patent/JPS52154356A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To achieve the improvement in the yield of automatic wire bonding by accurately fixing a pellet in the specified position of a supporting substrate in the production of semiconductor devices.
COPYRIGHT: (C)1977,JPO&Japio
JP7110076A 1976-06-18 1976-06-18 Pellet mounting method Pending JPS52154356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7110076A JPS52154356A (en) 1976-06-18 1976-06-18 Pellet mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7110076A JPS52154356A (en) 1976-06-18 1976-06-18 Pellet mounting method

Publications (1)

Publication Number Publication Date
JPS52154356A true JPS52154356A (en) 1977-12-22

Family

ID=13450774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7110076A Pending JPS52154356A (en) 1976-06-18 1976-06-18 Pellet mounting method

Country Status (1)

Country Link
JP (1) JPS52154356A (en)

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