NL7612047A - GLASS FOR THE HERMETIC COVERING AND PASSIVATION OF SEMICONDUCTOR DEVICES. - Google Patents

GLASS FOR THE HERMETIC COVERING AND PASSIVATION OF SEMICONDUCTOR DEVICES.

Info

Publication number
NL7612047A
NL7612047A NL7612047A NL7612047A NL7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A NL 7612047 A NL7612047 A NL 7612047A
Authority
NL
Netherlands
Prior art keywords
passivation
glass
semiconductor devices
hermetic covering
hermetic
Prior art date
Application number
NL7612047A
Other languages
Dutch (nl)
Original Assignee
Jenaer Glaswerk Schott & Gen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19752548736 external-priority patent/DE2548736C3/en
Priority claimed from DE19762606029 external-priority patent/DE2606029C3/en
Application filed by Jenaer Glaswerk Schott & Gen filed Critical Jenaer Glaswerk Schott & Gen
Publication of NL7612047A publication Critical patent/NL7612047A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/142—Silica-free oxide glass compositions containing boron containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
NL7612047A 1975-10-31 1976-10-29 GLASS FOR THE HERMETIC COVERING AND PASSIVATION OF SEMICONDUCTOR DEVICES. NL7612047A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19752548736 DE2548736C3 (en) 1975-10-31 1975-10-31 Composite passivation glass based on PbO-B2 Okskö-ab O3) with a thermal expansion coefficient (200-300 degrees C) between 40 and 60 times 10 "7 / degrees C for silicon semiconductor components with melting temperatures of at most 600 degrees C.
DE19762606029 DE2606029C3 (en) 1976-02-14 1976-02-14 Composite passivation glass based on PbO - B2 O3 - (SiO2 - Al2 O3) with a thermal expansion coefficient (20-300 degrees C) of up to 75 times 10 7 / degrees C for silicon semiconductor components with

Publications (1)

Publication Number Publication Date
NL7612047A true NL7612047A (en) 1977-05-03

Family

ID=25769562

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7612047A NL7612047A (en) 1975-10-31 1976-10-29 GLASS FOR THE HERMETIC COVERING AND PASSIVATION OF SEMICONDUCTOR DEVICES.

Country Status (3)

Country Link
JP (1) JPS5256867A (en)
FR (1) FR2329602A1 (en)
NL (1) NL7612047A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515898A (en) * 1981-09-01 1985-05-07 Motorola, Inc. Glass bonding means and method
US4696909A (en) * 1986-04-07 1987-09-29 Owens-Illinois Television Products Inc. Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5594975A (en) * 1979-01-16 1980-07-18 Asahi Glass Co Ltd Low expansion powder composition for bonding use
JPS5669242A (en) * 1979-11-09 1981-06-10 Asahi Glass Co Ltd Improved glass composition for sealing
US4246034A (en) * 1980-01-14 1981-01-20 Corning Glass Works Devitrifying solder sealing glasses

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR87810E (en) * 1961-09-29 1966-05-20 Ibm Coated articles and method for producing their protective coatings
DE1596995A1 (en) * 1967-12-28 1971-04-01 Siemens Ag Glass solder
JPS4941083A (en) * 1972-08-28 1974-04-17
JPS5922691B2 (en) * 1976-06-28 1984-05-28 三菱油化株式会社 Hydrocinnamaldehyde derivatives

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4515898A (en) * 1981-09-01 1985-05-07 Motorola, Inc. Glass bonding means and method
US4696909A (en) * 1986-04-07 1987-09-29 Owens-Illinois Television Products Inc. Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses

Also Published As

Publication number Publication date
FR2329602A1 (en) 1977-05-27
JPS557697B2 (en) 1980-02-27
JPS5256867A (en) 1977-05-10

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Legal Events

Date Code Title Description
BV The patent application has lapsed