JPS557697B2 - - Google Patents

Info

Publication number
JPS557697B2
JPS557697B2 JP12956476A JP12956476A JPS557697B2 JP S557697 B2 JPS557697 B2 JP S557697B2 JP 12956476 A JP12956476 A JP 12956476A JP 12956476 A JP12956476 A JP 12956476A JP S557697 B2 JPS557697 B2 JP S557697B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12956476A
Other languages
Japanese (ja)
Other versions
JPS5256867A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19752548736 external-priority patent/DE2548736C3/en
Priority claimed from DE19762606029 external-priority patent/DE2606029C3/en
Application filed filed Critical
Publication of JPS5256867A publication Critical patent/JPS5256867A/en
Publication of JPS557697B2 publication Critical patent/JPS557697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/12—Silica-free oxide glass compositions
    • C03C3/14—Silica-free oxide glass compositions containing boron
    • C03C3/142—Silica-free oxide glass compositions containing boron containing lead
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07—Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • C03C3/074—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
    • C03C3/0745—Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc containing more than 50% lead oxide, by weight
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
    • C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2214/00—Nature of the non-vitreous component
    • C03C2214/04—Particles; Flakes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12956476A 1975-10-31 1976-10-29 Glass for hermetic coating and stabilization of surface Granted JPS5256867A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19752548736 DE2548736C3 (en) 1975-10-31 1975-10-31 Composite passivation glass based on PbO-B2 Okskö-ab O3) with a thermal expansion coefficient (200-300 degrees C) between 40 and 60 times 10 "7 / degrees C for silicon semiconductor components with melting temperatures of at most 600 degrees C.
DE19762606029 DE2606029C3 (en) 1976-02-14 1976-02-14 Composite passivation glass based on PbO - B2 O3 - (SiO2 - Al2 O3) with a thermal expansion coefficient (20-300 degrees C) of up to 75 times 10 7 / degrees C for silicon semiconductor components with

Publications (2)

Publication Number Publication Date
JPS5256867A JPS5256867A (en) 1977-05-10
JPS557697B2 true JPS557697B2 (en) 1980-02-27

Family

ID=25769562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12956476A Granted JPS5256867A (en) 1975-10-31 1976-10-29 Glass for hermetic coating and stabilization of surface

Country Status (3)

Country Link
JP (1) JPS5256867A (en)
FR (1) FR2329602A1 (en)
NL (1) NL7612047A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5594975A (en) * 1979-01-16 1980-07-18 Asahi Glass Co Ltd Low expansion powder composition for bonding use
JPS5669242A (en) * 1979-11-09 1981-06-10 Asahi Glass Co Ltd Improved glass composition for sealing
US4246034A (en) * 1980-01-14 1981-01-20 Corning Glass Works Devitrifying solder sealing glasses
US4515898A (en) * 1981-09-01 1985-05-07 Motorola, Inc. Glass bonding means and method
US4696909A (en) * 1986-04-07 1987-09-29 Owens-Illinois Television Products Inc. Platinum corrosion reducing premelted oxide compositions for lead containing solder glasses

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1237412A (en) * 1967-12-28 1971-06-30 Siemens Ag Improvements in or relating to glass solders
JPS4941083A (en) * 1972-08-28 1974-04-17
JPS532444A (en) * 1976-06-28 1978-01-11 Mitsubishi Petrochem Co Ltd Preparation of hydroxycinnamaldehyde derivatives

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR87810E (en) * 1961-09-29 1966-05-20 Ibm Coated articles and method for producing their protective coatings

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1237412A (en) * 1967-12-28 1971-06-30 Siemens Ag Improvements in or relating to glass solders
JPS4941083A (en) * 1972-08-28 1974-04-17
JPS532444A (en) * 1976-06-28 1978-01-11 Mitsubishi Petrochem Co Ltd Preparation of hydroxycinnamaldehyde derivatives

Also Published As

Publication number Publication date
FR2329602A1 (en) 1977-05-27
JPS5256867A (en) 1977-05-10
NL7612047A (en) 1977-05-03

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