MY193800A - Photosensitive resin laminate and method for manufacturing same - Google Patents
Photosensitive resin laminate and method for manufacturing sameInfo
- Publication number
- MY193800A MY193800A MYUI2020002645A MYUI2020002645A MY193800A MY 193800 A MY193800 A MY 193800A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY UI2020002645 A MYUI2020002645 A MY UI2020002645A MY 193800 A MY193800 A MY 193800A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- resin composition
- laminate
- resin laminate
- composition layer
- Prior art date
Links
- 239000011347 resin Substances 0.000 title abstract 3
- 229920005989 resin Polymers 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011342 resin composition Substances 0.000 abstract 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018006341 | 2018-01-18 | ||
JP2018098049 | 2018-05-22 | ||
PCT/JP2019/000935 WO2019142786A1 (ja) | 2018-01-18 | 2019-01-15 | 感光性樹脂積層体およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY193800A true MY193800A (en) | 2022-10-27 |
Family
ID=67301750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYUI2020002645A MY193800A (en) | 2018-01-18 | 2019-01-15 | Photosensitive resin laminate and method for manufacturing same |
Country Status (6)
Country | Link |
---|---|
JP (3) | JP7057794B2 (ko) |
KR (2) | KR102505387B1 (ko) |
CN (1) | CN111527450B (ko) |
MY (1) | MY193800A (ko) |
TW (2) | TWI774909B (ko) |
WO (1) | WO2019142786A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL311594A (en) | 2021-09-29 | 2024-05-01 | Fujifilm Corp | A resin composition sensitive to radiation or an actinic beam and a method for producing a durable sample |
Family Cites Families (32)
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KR100567641B1 (ko) * | 1996-06-06 | 2006-07-19 | 에이제토 엘렉토로닉 마티리알즈 가부시키가이샤 | 아미노방향족발색단의금속이온함량을감소시키는방법및이를금속함량이낮은포토레지스트용저부반사방지피복물의합성에사용하는방법 |
JPH10123707A (ja) * | 1996-10-17 | 1998-05-15 | Nippon Synthetic Chem Ind Co Ltd:The | 感光性樹脂組成物およびその用途 |
JP3766288B2 (ja) * | 2000-03-31 | 2006-04-12 | 株式会社東芝 | 複合部材の製造方法及び電子パッケージ |
US20020127494A1 (en) * | 2001-03-08 | 2002-09-12 | Sturni Lance C. | Process for preparing a multi-layer circuit assembly |
JP4080364B2 (ja) * | 2002-03-29 | 2008-04-23 | 大日本印刷株式会社 | ラジカル発生剤及び感光性樹脂組成物 |
JP2004045490A (ja) * | 2002-07-09 | 2004-02-12 | Fuji Photo Film Co Ltd | 感光性樹脂転写材料を用いた金属酸化物構造体の製造方法 |
JP4259855B2 (ja) * | 2002-11-26 | 2009-04-30 | 旭化成エレクトロニクス株式会社 | 感光性樹脂組成物 |
JP2004306018A (ja) * | 2003-03-26 | 2004-11-04 | Sumitomo Bakelite Co Ltd | 金属上への感光性樹脂膜の形成方法並びに半導体装置及び表示素子 |
JP4422562B2 (ja) * | 2004-06-15 | 2010-02-24 | 富士フイルム株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
JP2006039231A (ja) * | 2004-07-27 | 2006-02-09 | Matsushita Electric Works Ltd | 光電気配線混載基板の製造方法 |
JP2006243564A (ja) * | 2005-03-04 | 2006-09-14 | Fuji Photo Film Co Ltd | 感光性組成物及び感光性フィルム、並びに、永久パターン及びその形成方法 |
KR101128307B1 (ko) * | 2007-04-04 | 2012-04-12 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 감광성 수지 조성물 및 적층체 |
JP2009072964A (ja) * | 2007-09-19 | 2009-04-09 | Asahi Kasei Chemicals Corp | 印刷用積層体の製造方法 |
CN102428406B (zh) * | 2009-05-20 | 2014-09-03 | 旭化成电子材料株式会社 | 感光性树脂组合物 |
TWI491981B (zh) * | 2009-11-04 | 2015-07-11 | Sumitomo Chemical Co | Coloring the photosensitive resin composition |
JP2011213782A (ja) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | ポリマー溶液の製造方法、ポリマーの精製方法 |
KR20140005929A (ko) | 2011-01-25 | 2014-01-15 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 제조 방법 및 프린트 배선판의 제조 방법 |
JP2013057902A (ja) * | 2011-09-09 | 2013-03-28 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物及び感光性樹脂積層体 |
KR102057483B1 (ko) * | 2012-06-28 | 2019-12-19 | 후지필름 가부시키가이샤 | 감광성 수지 조성물, 경화물과 그 제조 방법, 수지 패턴 제조 방법, 경화막, 액정 표시 장치, 유기 el 표시 장치, 및 터치패널 표시 장치 |
WO2014080908A1 (ja) * | 2012-11-26 | 2014-05-30 | 東レ株式会社 | ネガ型感光性樹脂組成物 |
JP6118086B2 (ja) * | 2012-12-03 | 2017-04-19 | 富士フイルム株式会社 | 分散組成物、感光性樹脂組成物、硬化物及びその製造方法、樹脂パターン製造方法、硬化膜、有機el表示装置、液晶表示装置、並びに、タッチパネル表示装置 |
JP6295950B2 (ja) * | 2013-03-28 | 2018-03-20 | 東レ株式会社 | 感光性樹脂組成物、保護膜又は絶縁膜、タッチパネル及びその製造方法 |
JP2015049508A (ja) * | 2014-02-24 | 2015-03-16 | 住友ベークライト株式会社 | 感光性樹脂材料および樹脂膜 |
KR20150108744A (ko) * | 2014-03-18 | 2015-09-30 | 다이요 잉키 세이조 가부시키가이샤 | 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 |
JP5686217B1 (ja) * | 2014-04-30 | 2015-03-18 | 住友ベークライト株式会社 | 感光性樹脂材料および樹脂膜 |
WO2015174468A1 (ja) | 2014-05-13 | 2015-11-19 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
TWI671594B (zh) | 2014-05-13 | 2019-09-11 | 日商日立化成股份有限公司 | 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法 |
TWI671343B (zh) * | 2014-06-27 | 2019-09-11 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置 |
WO2016047691A1 (ja) * | 2014-09-24 | 2016-03-31 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜及び表示装置 |
JP2016110691A (ja) * | 2014-12-01 | 2016-06-20 | 大日本印刷株式会社 | 導電性基板の製造方法、及び導電性基板 |
CN106483760B (zh) * | 2015-09-02 | 2019-11-12 | 东京应化工业株式会社 | 感光性组合物、其制造方法、膜的形成方法、粘度增加抑制方法、光聚合引发剂及其制造方法 |
JP2017097060A (ja) * | 2015-11-19 | 2017-06-01 | 住友ベークライト株式会社 | 感光性樹脂組成物及び感光性樹脂パターンの製造方法 |
-
2019
- 2019-01-15 WO PCT/JP2019/000935 patent/WO2019142786A1/ja active Application Filing
- 2019-01-15 KR KR1020207019065A patent/KR102505387B1/ko active IP Right Grant
- 2019-01-15 MY MYUI2020002645A patent/MY193800A/en unknown
- 2019-01-15 CN CN201980006875.3A patent/CN111527450B/zh active Active
- 2019-01-15 KR KR1020227013942A patent/KR20220061260A/ko not_active Application Discontinuation
- 2019-01-15 JP JP2019566468A patent/JP7057794B2/ja active Active
- 2019-01-16 TW TW108101625A patent/TWI774909B/zh active
- 2019-01-16 TW TW109126151A patent/TW202041971A/zh unknown
-
2022
- 2022-01-24 JP JP2022008891A patent/JP2022058739A/ja active Pending
-
2024
- 2024-02-21 JP JP2024024839A patent/JP2024051000A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP7057794B2 (ja) | 2022-04-20 |
JP2022058739A (ja) | 2022-04-12 |
CN111527450B (zh) | 2023-08-08 |
JP2024051000A (ja) | 2024-04-10 |
KR102505387B1 (ko) | 2023-03-02 |
KR20220061260A (ko) | 2022-05-12 |
KR20200086743A (ko) | 2020-07-17 |
WO2019142786A1 (ja) | 2019-07-25 |
TW202041971A (zh) | 2020-11-16 |
JPWO2019142786A1 (ja) | 2020-09-17 |
TWI774909B (zh) | 2022-08-21 |
TW201932981A (zh) | 2019-08-16 |
CN111527450A (zh) | 2020-08-11 |
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