MY186932A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- MY186932A MY186932A MYUI2018700667A MYUI2018700667A MY186932A MY 186932 A MY186932 A MY 186932A MY UI2018700667 A MYUI2018700667 A MY UI2018700667A MY UI2018700667 A MYUI2018700667 A MY UI2018700667A MY 186932 A MY186932 A MY 186932A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- resin composition
- copper
- pattern
- laminated
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/04—Acids; Metal salts or ammonium salts thereof
- C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/106—Esters of polycondensation macromers
- C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015179888 | 2015-09-11 | ||
JP2015195984 | 2015-10-01 | ||
JP2015199434 | 2015-10-07 | ||
JP2015218912 | 2015-11-06 | ||
JP2015257519 | 2015-12-28 | ||
PCT/JP2016/076342 WO2017043544A1 (ja) | 2015-09-11 | 2016-09-07 | 感光性樹脂組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186932A true MY186932A (en) | 2021-08-26 |
Family
ID=58239851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYUI2018700667A MY186932A (en) | 2015-09-11 | 2016-09-07 | Photosensitive resin composition |
Country Status (6)
Country | Link |
---|---|
JP (3) | JP6514346B2 (ko) |
KR (3) | KR102443749B1 (ko) |
CN (2) | CN114296315A (ko) |
MY (1) | MY186932A (ko) |
TW (3) | TWI709815B (ko) |
WO (1) | WO2017043544A1 (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6809873B2 (ja) * | 2015-12-28 | 2021-01-06 | 旭化成株式会社 | 積層体 |
JP2019133143A (ja) * | 2018-01-30 | 2019-08-08 | 旭化成株式会社 | 感光性樹脂積層体及びレジストパターンの製造方法 |
CN108205240B (zh) * | 2018-02-01 | 2021-05-07 | 浙江福斯特新材料研究院有限公司 | 一种高光敏性和优异掩孔性能的感光性树脂组合物及应用 |
CN112352197A (zh) * | 2018-06-22 | 2021-02-09 | 旭化成株式会社 | 感光性树脂组合物和抗蚀图案的形成方法 |
CN112534351A (zh) * | 2018-08-09 | 2021-03-19 | 旭化成株式会社 | 感光性树脂组合物及抗蚀图案的形成方法 |
JP2020076945A (ja) * | 2018-09-21 | 2020-05-21 | 旭化成株式会社 | 感光性樹脂組成物 |
JP2022000683A (ja) * | 2019-12-13 | 2022-01-04 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム |
WO2021220980A1 (ja) * | 2020-04-28 | 2021-11-04 | 富士フイルム株式会社 | 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法 |
JP2020190735A (ja) * | 2020-07-14 | 2020-11-26 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4646759B2 (ja) * | 2005-09-20 | 2011-03-09 | 旭化成イーマテリアルズ株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
JP2007226158A (ja) * | 2006-02-27 | 2007-09-06 | Asahi Kasei Electronics Co Ltd | ドライフィルムレジスト |
KR101141909B1 (ko) * | 2006-12-27 | 2012-05-03 | 히다치 가세고교 가부시끼가이샤 | 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법 |
JP5221543B2 (ja) | 2007-08-15 | 2013-06-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及びその積層体 |
JP2011233769A (ja) | 2010-04-28 | 2011-11-17 | Mec Co Ltd | 銅配線パターンの形成方法 |
US9439291B2 (en) | 2010-12-16 | 2016-09-06 | Hitachi Chemical Company, Ltd. | Photosensitive element, method for forming resist pattern, and method for producing printed circuit board |
KR20130098406A (ko) * | 2010-12-24 | 2013-09-04 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | 감광성 수지 조성물 |
JP2012226254A (ja) | 2011-04-22 | 2012-11-15 | Asahi Kasei E-Materials Corp | ドライフィルムレジストロール |
JP6064480B2 (ja) | 2011-10-26 | 2017-01-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP6113976B2 (ja) | 2012-08-29 | 2017-04-12 | 旭化成株式会社 | 感光性樹脂組成物 |
JP2014182305A (ja) * | 2013-03-19 | 2014-09-29 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法及びプリント配線板の製造方法 |
JP5673763B2 (ja) * | 2013-09-17 | 2015-02-18 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP6207943B2 (ja) | 2013-09-19 | 2017-10-04 | 旭化成株式会社 | 感光性樹脂組成物及び感光性樹脂積層体 |
JP6486672B2 (ja) * | 2013-12-20 | 2019-03-20 | 旭化成株式会社 | 感光性エレメント、及びその製造方法 |
CN105849641B (zh) | 2013-12-27 | 2019-12-13 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法 |
JP2015152854A (ja) * | 2014-02-18 | 2015-08-24 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 |
US10338468B2 (en) | 2014-09-24 | 2019-07-02 | Asahi Kasei Kabushiki Kaisha | Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device |
-
2016
- 2016-09-07 JP JP2017539202A patent/JP6514346B2/ja active Active
- 2016-09-07 CN CN202111430178.6A patent/CN114296315A/zh active Pending
- 2016-09-07 MY MYUI2018700667A patent/MY186932A/en unknown
- 2016-09-07 WO PCT/JP2016/076342 patent/WO2017043544A1/ja active Application Filing
- 2016-09-07 CN CN201680052525.7A patent/CN108027559B/zh active Active
- 2016-09-07 KR KR1020197026060A patent/KR102443749B1/ko active IP Right Grant
- 2016-09-07 KR KR1020227031231A patent/KR102600211B1/ko active IP Right Grant
- 2016-09-07 KR KR1020187003696A patent/KR20180042842A/ko not_active Application Discontinuation
- 2016-09-09 TW TW108118424A patent/TWI709815B/zh active
- 2016-09-09 TW TW107132088A patent/TWI684067B/zh active
- 2016-09-09 TW TW105129243A patent/TWI691793B/zh active
-
2018
- 2018-12-10 JP JP2018231215A patent/JP7026606B2/ja active Active
-
2021
- 2021-11-16 JP JP2021186549A patent/JP7340581B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2019105841A (ja) | 2019-06-27 |
JP7340581B2 (ja) | 2023-09-07 |
WO2017043544A1 (ja) | 2017-03-16 |
TW201944171A (zh) | 2019-11-16 |
KR20180042842A (ko) | 2018-04-26 |
KR20220127382A (ko) | 2022-09-19 |
JP7026606B2 (ja) | 2022-02-28 |
TWI691793B (zh) | 2020-04-21 |
KR102443749B1 (ko) | 2022-09-15 |
TWI684067B (zh) | 2020-02-01 |
TW201712433A (zh) | 2017-04-01 |
CN108027559A (zh) | 2018-05-11 |
JP6514346B2 (ja) | 2019-05-15 |
JPWO2017043544A1 (ja) | 2018-03-15 |
KR20190105142A (ko) | 2019-09-11 |
JP2022027767A (ja) | 2022-02-14 |
TWI709815B (zh) | 2020-11-11 |
CN114296315A (zh) | 2022-04-08 |
CN108027559B (zh) | 2021-10-26 |
KR102600211B1 (ko) | 2023-11-08 |
TW201843527A (zh) | 2018-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY186932A (en) | Photosensitive resin composition | |
MY187481A (en) | Photosensitive resin composition | |
EP4023636A4 (en) | ACTINIC-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE | |
EP3348542A4 (en) | COMPOUND, RESIN, RESIST COMPOSITION AND RADIATION SENSITIVE COMPOSITION, METHOD FOR FORMING A RESIST STRUCTURE, METHOD FOR PRODUCING AN AMORPHOUS FILMS, MATERIAL FOR FORMING A lithographic LAYER FILMS, COMPOSITION FOR PRODUCING A lithographic LAYER FILMS, METHOD FOR PRODUCING A CONTROL STRUCTURE AND CLEANING PROCESS | |
EP3919528A4 (en) | ACTINIC RADIATION SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD OF MAKING A PATTERN, AND METHOD OF MAKING AN ELECTRONIC DEVICE | |
MY196431A (en) | Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board | |
MX350841B (es) | Método y aparato para fabricación tridimensional. | |
IL284859A (en) | A radiation-sensitive or actinic beam-sensitive resin composition, a resistant layer, a method for creating a pattern and a method for producing an electronic device | |
TW200606598A (en) | Method of forming plated product using negative photoresist composition and photosensitive composition used therein | |
EP2715451A4 (en) | PATTERN FORMATION METHOD, ACTINIC OR RADIATION SENSITIVE SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | |
MY189073A (en) | Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board | |
EP3327005A4 (en) | COMPOUND, RESIN, LITHOGRAPHY-BASED UNDERLAYER FILM FORMING MATERIAL, COMPOSITION FOR FORMING LITHOGRAPHY-BASED UNDERLAYER FILM, LITHOGRAPHY-BASED FILM FORMING, PHOTOSENSITIVE RESIN PATTERN FORMING METHOD, PATTERN FORMING METHOD CIRCUIT, AND PURIFICATION METHOD | |
EP2864839A4 (en) | PATTERN FORMATION METHOD, ACTINIC RADIATION OR RADIATION SENSITIVE RESIN COMPOSITION, RESISTIVE FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | |
EP3885378A4 (en) | ACTINIC RAY OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND PRODUCTION METHOD FOR ELECTRONIC DEVICE | |
IL287442A (en) | A radiation-sensitive or actinic beam-sensitive resin composition, a resistant layer, a method for creating a pattern and a method for producing an electronic device | |
MY176799A (en) | Photosensitive resin element | |
EP3761114A4 (en) | ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND RESIN | |
PH12019502065A1 (en) | Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component | |
EP3605226A4 (en) | ACTINIC OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE | |
FR2974194B1 (fr) | Procede de lithographie | |
PH12015501133A1 (en) | Substrate for mounting semiconductor element and method for manufacturing said substrate | |
EP3757676A4 (en) | COMPOSITION OF PHOTOSENSITIVE RESIN, ASSOCIATED PRODUCTION PROCESS, RESERVE FILM, PATTERN FORMATION PROCESS AND PRODUCTION PROCESS OF AN ELECTRONIC DEVICE | |
MY197618A (en) | Photosensitive resin laminate and method for producing resist pattern | |
IL228135B (en) | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition and resist film | |
MY191860A (en) | Photosensitive resin composition, photosensitive resin laminate, production method of substrate having resist pattern, and production method of circuit board |