JP6514346B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP6514346B2
JP6514346B2 JP2017539202A JP2017539202A JP6514346B2 JP 6514346 B2 JP6514346 B2 JP 6514346B2 JP 2017539202 A JP2017539202 A JP 2017539202A JP 2017539202 A JP2017539202 A JP 2017539202A JP 6514346 B2 JP6514346 B2 JP 6514346B2
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Japan
Prior art keywords
photosensitive resin
mass
resin composition
meth
acrylate
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JP2017539202A
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English (en)
Japanese (ja)
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JPWO2017043544A1 (ja
Inventor
一也 内藤
一也 内藤
有里 山田
有里 山田
隼也 小坂
隼也 小坂
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Asahi Kasei Corp
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Asahi Kasei Corp
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2017539202A 2015-09-11 2016-09-07 感光性樹脂組成物 Active JP6514346B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2015179888 2015-09-11
JP2015179888 2015-09-11
JP2015195984 2015-10-01
JP2015195984 2015-10-01
JP2015199434 2015-10-07
JP2015199434 2015-10-07
JP2015218912 2015-11-06
JP2015218912 2015-11-06
JP2015257519 2015-12-28
JP2015257519 2015-12-28
PCT/JP2016/076342 WO2017043544A1 (ja) 2015-09-11 2016-09-07 感光性樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018231215A Division JP7026606B2 (ja) 2015-09-11 2018-12-10 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2017043544A1 JPWO2017043544A1 (ja) 2018-03-15
JP6514346B2 true JP6514346B2 (ja) 2019-05-15

Family

ID=58239851

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017539202A Active JP6514346B2 (ja) 2015-09-11 2016-09-07 感光性樹脂組成物
JP2018231215A Active JP7026606B2 (ja) 2015-09-11 2018-12-10 感光性樹脂組成物
JP2021186549A Active JP7340581B2 (ja) 2015-09-11 2021-11-16 感光性樹脂組成物

Family Applications After (2)

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JP2018231215A Active JP7026606B2 (ja) 2015-09-11 2018-12-10 感光性樹脂組成物
JP2021186549A Active JP7340581B2 (ja) 2015-09-11 2021-11-16 感光性樹脂組成物

Country Status (6)

Country Link
JP (3) JP6514346B2 (ko)
KR (3) KR20180042842A (ko)
CN (2) CN114296315A (ko)
MY (1) MY186932A (ko)
TW (3) TWI684067B (ko)
WO (1) WO2017043544A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
CN108205240B (zh) * 2018-02-01 2021-05-07 浙江福斯特新材料研究院有限公司 一种高光敏性和优异掩孔性能的感光性树脂组合物及应用
CN112352197A (zh) * 2018-06-22 2021-02-09 旭化成株式会社 感光性树脂组合物和抗蚀图案的形成方法
WO2020032133A1 (ja) * 2018-08-09 2020-02-13 旭化成株式会社 感光性樹脂組成物及びレジストパターンの形成方法
JP2020076945A (ja) * 2018-09-21 2020-05-21 旭化成株式会社 感光性樹脂組成物
JP2022000683A (ja) * 2019-12-13 2022-01-04 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム
CN115485621A (zh) * 2020-04-28 2022-12-16 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
JP2020190735A (ja) * 2020-07-14 2020-11-26 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法及び導体パターン製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4646759B2 (ja) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007226158A (ja) * 2006-02-27 2007-09-06 Asahi Kasei Electronics Co Ltd ドライフィルムレジスト
WO2008078483A1 (ja) * 2006-12-27 2008-07-03 Hitachi Chemical Company, Ltd. 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2008197160A (ja) * 2007-02-08 2008-08-28 Hitachi Chem Co Ltd 半導体素子の層間絶縁膜用感光性樹脂組成物、それを用いた層間絶縁膜及び層間絶縁膜の製造方法
JP5221543B2 (ja) 2007-08-15 2013-06-26 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP2011233769A (ja) 2010-04-28 2011-11-17 Mec Co Ltd 銅配線パターンの形成方法
CN106918991A (zh) * 2010-07-13 2017-07-04 日立化成工业株式会社 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板
KR101444044B1 (ko) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
CN103282829B (zh) * 2010-12-24 2016-08-17 旭化成株式会社 感光性树脂组合物
JP2012226254A (ja) * 2011-04-22 2012-11-15 Asahi Kasei E-Materials Corp ドライフィルムレジストロール
JP6064480B2 (ja) 2011-10-26 2017-01-25 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6113976B2 (ja) 2012-08-29 2017-04-12 旭化成株式会社 感光性樹脂組成物
JP2014182305A (ja) * 2013-03-19 2014-09-29 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターン付き基板の製造方法及びプリント配線板の製造方法
JP5673763B2 (ja) * 2013-09-17 2015-02-18 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP6207943B2 (ja) * 2013-09-19 2017-10-04 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体
JP6486672B2 (ja) 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
JPWO2015098870A1 (ja) 2013-12-27 2017-03-23 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
US10338468B2 (en) * 2014-09-24 2019-07-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device
US20180051183A1 (en) * 2016-08-17 2018-02-22 Xerox Corporation Seven-color ink set for a digital advanced lithographic imaging process

Also Published As

Publication number Publication date
TW201843527A (zh) 2018-12-16
KR20190105142A (ko) 2019-09-11
KR20220127382A (ko) 2022-09-19
CN114296315A (zh) 2022-04-08
JP7026606B2 (ja) 2022-02-28
TWI709815B (zh) 2020-11-11
WO2017043544A1 (ja) 2017-03-16
TWI684067B (zh) 2020-02-01
TWI691793B (zh) 2020-04-21
KR20180042842A (ko) 2018-04-26
TW201712433A (zh) 2017-04-01
CN108027559B (zh) 2021-10-26
JPWO2017043544A1 (ja) 2018-03-15
KR102600211B1 (ko) 2023-11-08
MY186932A (en) 2021-08-26
KR102443749B1 (ko) 2022-09-15
TW201944171A (zh) 2019-11-16
CN108027559A (zh) 2018-05-11
JP2019105841A (ja) 2019-06-27
JP7340581B2 (ja) 2023-09-07
JP2022027767A (ja) 2022-02-14

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