WO2008078483A1 - 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 - Google Patents
感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 Download PDFInfo
- Publication number
- WO2008078483A1 WO2008078483A1 PCT/JP2007/072622 JP2007072622W WO2008078483A1 WO 2008078483 A1 WO2008078483 A1 WO 2008078483A1 JP 2007072622 W JP2007072622 W JP 2007072622W WO 2008078483 A1 WO2008078483 A1 WO 2008078483A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- wiring board
- printed wiring
- resist pattern
- photosensitive resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Ceramic Engineering (AREA)
- Engineering & Computer Science (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117020669A KR101168828B1 (ko) | 2006-12-27 | 2007-11-22 | 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법 |
KR1020097012516A KR101141909B1 (ko) | 2006-12-27 | 2007-11-22 | 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법 |
CN2007800481739A CN101568883B (zh) | 2006-12-27 | 2007-11-22 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法以及印刷电路板的制造方法 |
JP2008550999A JP5029617B2 (ja) | 2006-12-27 | 2007-11-22 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006352734 | 2006-12-27 | ||
JP2006-352734 | 2006-12-27 |
Publications (1)
Publication Number | Publication Date |
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WO2008078483A1 true WO2008078483A1 (ja) | 2008-07-03 |
Family
ID=39562276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/072622 WO2008078483A1 (ja) | 2006-12-27 | 2007-11-22 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (4) | JP5029617B2 (ja) |
KR (2) | KR101168828B1 (ja) |
CN (3) | CN102385253B (ja) |
TW (2) | TWI644175B (ja) |
WO (1) | WO2008078483A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010098183A1 (ja) * | 2009-02-26 | 2010-09-02 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2012137768A (ja) * | 2006-12-27 | 2012-07-19 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2012252320A (ja) * | 2011-05-10 | 2012-12-20 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法 |
JP2013092676A (ja) * | 2011-10-26 | 2013-05-16 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JPWO2012067107A1 (ja) * | 2010-11-17 | 2014-05-12 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2015018029A (ja) * | 2013-07-09 | 2015-01-29 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
US10104781B2 (en) | 2013-12-27 | 2018-10-16 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
US10564543B2 (en) | 2014-09-18 | 2020-02-18 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board |
Families Citing this family (11)
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CN102597877A (zh) * | 2010-07-30 | 2012-07-18 | 日立化成工业株式会社 | 感光性树脂组合物、以及使用其的感光性元件、抗蚀剂图形的制造方法、引线框的制造方法、印刷线路板和印刷线路板的制造方法 |
CN103076717A (zh) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
CN103076719B (zh) * | 2011-10-26 | 2019-08-09 | 日立化成株式会社 | 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷配线板的制造方法 |
TWI521016B (zh) | 2012-07-18 | 2016-02-11 | 財團法人工業技術研究院 | 蝕刻含聚亞醯胺之膜層的方法 |
JP6361191B2 (ja) * | 2014-03-14 | 2018-07-25 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びタッチパネルの製造方法 |
KR102600211B1 (ko) * | 2015-09-11 | 2023-11-08 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 |
CN106909026B (zh) * | 2017-03-31 | 2019-11-22 | 苏州福斯特光伏材料有限公司 | 一种可直接描绘曝光成像的抗蚀剂组合物及抗蚀剂层压体 |
CN109856912A (zh) * | 2019-03-11 | 2019-06-07 | 浙江福斯特新材料研究院有限公司 | 一种高附着力感光性树脂组合物 |
CN111752096B (zh) * | 2019-03-29 | 2022-10-14 | 常州正洁智造科技有限公司 | 用于彩色滤光片的感光性树脂组合物及彩色滤光片 |
WO2021192058A1 (ja) * | 2020-03-24 | 2021-09-30 | 昭和電工マテリアルズ株式会社 | 感光性樹脂組成物、感光性エレメント、及び配線基板の製造方法 |
JP2023059827A (ja) | 2021-10-15 | 2023-04-27 | 三菱製紙株式会社 | 感光性樹脂組成物及びめっき方法 |
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2007
- 2007-11-22 CN CN201110253925.3A patent/CN102385253B/zh active Active
- 2007-11-22 CN CN201110391729.2A patent/CN102393605B/zh active Active
- 2007-11-22 KR KR1020117020669A patent/KR101168828B1/ko active IP Right Grant
- 2007-11-22 CN CN2007800481739A patent/CN101568883B/zh active Active
- 2007-11-22 WO PCT/JP2007/072622 patent/WO2008078483A1/ja active Application Filing
- 2007-11-22 JP JP2008550999A patent/JP5029617B2/ja active Active
- 2007-11-22 KR KR1020097012516A patent/KR101141909B1/ko active IP Right Grant
- 2007-12-03 TW TW101106957A patent/TWI644175B/zh active
- 2007-12-03 TW TW96145926A patent/TWI412887B/zh active
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2012
- 2012-02-06 JP JP2012023401A patent/JP2012137768A/ja active Pending
- 2012-06-25 JP JP2012142488A patent/JP2012198573A/ja active Pending
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2014
- 2014-03-25 JP JP2014061919A patent/JP5679080B2/ja active Active
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012137768A (ja) * | 2006-12-27 | 2012-07-19 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
TWI479261B (zh) * | 2009-02-26 | 2015-04-01 | Hitachi Chemical Co Ltd | A photosensitive resin composition and a photosensitive member using the same, a method of forming a photoresist pattern, and a method of manufacturing the printed circuit board |
CN102317864A (zh) * | 2009-02-26 | 2012-01-11 | 日立化成工业株式会社 | 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法 |
WO2010098183A1 (ja) * | 2009-02-26 | 2010-09-02 | 日立化成工業株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
CN104808444A (zh) * | 2009-02-26 | 2015-07-29 | 日立化成工业株式会社 | 感光性树脂组合物、以及感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法 |
JP5327310B2 (ja) * | 2009-02-26 | 2013-10-30 | 日立化成株式会社 | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
KR101339530B1 (ko) | 2009-02-26 | 2013-12-10 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 및 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법 |
CN103543608A (zh) * | 2009-02-26 | 2014-01-29 | 日立化成工业株式会社 | 感光性树脂组合物、以及使用了该组合物的感光性元件、抗蚀剂图案的形成方法和印刷线路板的制造方法 |
JPWO2012067107A1 (ja) * | 2010-11-17 | 2014-05-12 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2012252320A (ja) * | 2011-05-10 | 2012-12-20 | Hitachi Chem Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法 |
JP2016118793A (ja) * | 2011-05-10 | 2016-06-30 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法 |
JP2013092676A (ja) * | 2011-10-26 | 2013-05-16 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2015018029A (ja) * | 2013-07-09 | 2015-01-29 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
US10104781B2 (en) | 2013-12-27 | 2018-10-16 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
US10564543B2 (en) | 2014-09-18 | 2020-02-18 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board |
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KR20090084944A (ko) | 2009-08-05 |
KR101168828B1 (ko) | 2012-07-25 |
JPWO2008078483A1 (ja) | 2010-04-15 |
JP2014134815A (ja) | 2014-07-24 |
CN102393605A (zh) | 2012-03-28 |
JP5029617B2 (ja) | 2012-09-19 |
JP2012198573A (ja) | 2012-10-18 |
JP5679080B2 (ja) | 2015-03-04 |
JP2012137768A (ja) | 2012-07-19 |
CN101568883A (zh) | 2009-10-28 |
TWI644175B (zh) | 2018-12-11 |
CN102385253B (zh) | 2014-08-27 |
CN101568883B (zh) | 2012-01-18 |
TW200848929A (en) | 2008-12-16 |
KR20110112473A (ko) | 2011-10-12 |
KR101141909B1 (ko) | 2012-05-03 |
TW201224656A (en) | 2012-06-16 |
CN102393605B (zh) | 2014-06-11 |
CN102385253A (zh) | 2012-03-21 |
TWI412887B (zh) | 2013-10-21 |
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