TW200745750A - Photo-sensitive composition, photo-sensitive film, photo-sensitive laminate, permanent pattern-forming method and printing substrate - Google Patents

Photo-sensitive composition, photo-sensitive film, photo-sensitive laminate, permanent pattern-forming method and printing substrate

Info

Publication number
TW200745750A
TW200745750A TW096107432A TW96107432A TW200745750A TW 200745750 A TW200745750 A TW 200745750A TW 096107432 A TW096107432 A TW 096107432A TW 96107432 A TW96107432 A TW 96107432A TW 200745750 A TW200745750 A TW 200745750A
Authority
TW
Taiwan
Prior art keywords
photo
sensitive
sensitive composition
permanent pattern
forming method
Prior art date
Application number
TW096107432A
Other languages
Chinese (zh)
Other versions
TWI403837B (en
Inventor
Masanobu Takashima
Hiroshi Kamikawa
Kazuhiro Fujimaki
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200745750A publication Critical patent/TW200745750A/en
Application granted granted Critical
Publication of TWI403837B publication Critical patent/TWI403837B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Graft Or Block Polymers (AREA)

Abstract

The objects of the invention are to provide a photo-sensitive composition having compatible properties both in excellent preservation and high sensitivity and being capable of effectively forming a high fineness permanent pattern such as a protecting film, an insulating film, etc. as well as provide a photo-sensitive film, a permanent pattern-forming method using aforesaid photo-sensitive composition, and a printing substrate having a permanent pattern formed by aforesaid permanent pattern-forming method. Therefore, a preferred embodiment is a photosensitive composition comprises a binder, a polymerizable compound, a photo-polymerization initiator and a heat crosslinking agent and when the said photo-sensitive composition is laminated onto a substrate, the relationship between the shortest developing time T1 and T2 satisfies 0.5 < T2/T1 < 3, wherein T1 is the shortest developing time required for removing unexposed portion of a said photo-sensitive composition onto aforesaid substrate after being put in the dark at 25 DEG C for 20 minutes; and whereas the said photo-sensitive composition is laminated onto aforesaid substrate, T2 is the shortest developing time required for removing unexposed portion of a said photo-sensitive composition on the aforesaid substrate after being put in the dark at 40 DEG C for 72 hours.
TW96107432A 2006-03-08 2007-03-05 Photo-sensitive composition, photo-sensitive film, permanent pattern-forming method using the same and printing substrate TWI403837B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006063261A JP4711862B2 (en) 2006-03-08 2006-03-08 Photosensitive composition, photosensitive film, permanent pattern forming method, and printed circuit board

Publications (2)

Publication Number Publication Date
TW200745750A true TW200745750A (en) 2007-12-16
TWI403837B TWI403837B (en) 2013-08-01

Family

ID=38474731

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96107432A TWI403837B (en) 2006-03-08 2007-03-05 Photo-sensitive composition, photo-sensitive film, permanent pattern-forming method using the same and printing substrate

Country Status (5)

Country Link
JP (1) JP4711862B2 (en)
KR (1) KR20080104135A (en)
CN (1) CN101401039B (en)
TW (1) TWI403837B (en)
WO (1) WO2007102289A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829929B (en) * 2020-05-14 2024-01-21 奇美實業股份有限公司 Black photosensitive resin composition, black pattern, color filter, and liquid crystal display device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009086015A (en) * 2007-09-27 2009-04-23 Hitachi Via Mechanics Ltd Maskless exposure apparatus
JP5232576B2 (en) * 2008-09-05 2013-07-10 富士フイルム株式会社 Method and composition for producing curable polymer compound, and planographic printing plate precursor
JP5393198B2 (en) * 2009-02-27 2014-01-22 東京応化工業株式会社 Photosensitive resin composition
TWI516507B (en) * 2010-06-01 2016-01-11 新日鐵住金化學股份有限公司 Thermocurable resin composition containing (meth) acrylate resin and cured article using the same
JP5817237B2 (en) * 2010-07-29 2015-11-18 Jsr株式会社 Radiation-sensitive resin composition, cured film, color filter, method for forming cured film, and method for forming color filter
CN102597877A (en) * 2010-07-30 2012-07-18 日立化成工业株式会社 Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing lead frame, printed wiring board, and method for producing printed wiring board
CN102378494B (en) * 2011-10-31 2014-03-26 深南电路有限公司 Resistance welding processing method for circuit board
WO2013084283A1 (en) * 2011-12-05 2013-06-13 日立化成株式会社 Method for forming protective film for touch panel electrodes, photosensitive resin composition, and photosensitive element
WO2013084282A1 (en) 2011-12-05 2013-06-13 日立化成株式会社 Method for forming resin cured film pattern, photosensitive resin composition, and photosensitive element
JP7275719B2 (en) * 2019-03-22 2023-05-18 富士フイルムビジネスイノベーション株式会社 Electrostatic charge image developing toner, electrostatic charge image developer, toner cartridge, process cartridge, image forming apparatus and image forming method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1573545A (en) * 2003-06-20 2005-02-02 富士胶片株式会社 Light-sensitive sheet, light-sensitive layers, image pattern forming method, and wiring pattern forming method
CN1580953A (en) * 2003-08-15 2005-02-16 富士胶片株式会社 Light-sensitive transfer sheet, light-sensitive layers, picture pattern forming method and layout pattern forming method
JP4489566B2 (en) * 2003-11-27 2010-06-23 太陽インキ製造株式会社 Curable resin composition, cured product thereof, and printed wiring board
JP4389582B2 (en) * 2003-12-26 2009-12-24 住友化学株式会社 Photosensitive resin composition
JP2005309247A (en) * 2004-04-23 2005-11-04 Fuji Photo Film Co Ltd Photosensitive composition, photosensitive film, permanent pattern and method for forming the same
JP2006058821A (en) * 2004-08-24 2006-03-02 Mitsubishi Chemicals Corp Colored resin composition, color filter and liquid crystal display
JP2007197530A (en) * 2006-01-25 2007-08-09 Taiyo Ink Mfg Ltd Curable composition and cured product thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI829929B (en) * 2020-05-14 2024-01-21 奇美實業股份有限公司 Black photosensitive resin composition, black pattern, color filter, and liquid crystal display device

Also Published As

Publication number Publication date
CN101401039B (en) 2012-06-20
TWI403837B (en) 2013-08-01
WO2007102289A1 (en) 2007-09-13
CN101401039A (en) 2009-04-01
KR20080104135A (en) 2008-12-01
JP2007240882A (en) 2007-09-20
JP4711862B2 (en) 2011-06-29

Similar Documents

Publication Publication Date Title
TW200745750A (en) Photo-sensitive composition, photo-sensitive film, photo-sensitive laminate, permanent pattern-forming method and printing substrate
TW200741332A (en) Reflective-type mask blank for EUV lithography
TW200732839A (en) Resist protective film material and pattern formation method
ATE496977T1 (en) TOPCOAT COMPOSITION, ALKALINE DEVELOPER SOLUBLE TOPCOAT FILM COMPRISING THE COMPOSITION AND PATTERN FORMING METHOD USING THERETO
WO2007148324A3 (en) A system and method for preventing photography
TW200641523A (en) Photosensitive resin composition for use in forming light-blocking layer, light-blocking layer and color filter
TW200710579A (en) Bottom resist layer composition and patterning process using the same
TW200700903A (en) Photosensitive composition and black matrix
EP1596251A4 (en) Immersion exposure process-use resist protection film forming material, composite film, and resist pattern forming method
WO2008140119A1 (en) Method for pattern formation
TW200627066A (en) Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and semiconductor device
TWI318723B (en) Photosensitive resin composition for black resist and light-shielding film made by using such photosensitive resin composition for black resisit
TW200705107A (en) A photosensitive resin compound and adhesion improvement agent
WO2003014831A3 (en) Photosensitive, flexo printing element and method for the production of newspaper flexo printing plates
JP2008524650A5 (en)
TW200629464A (en) Coating and developing apparatus and coating and developing method
WO2009078380A1 (en) Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate
TW200614344A (en) Device manufacturing method
TW200632559A (en) Positive dry film photoresist and composition for preparing the same
EP3919528A4 (en) Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and electronic device manufacturing method
EP2319892A4 (en) Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic component
TW200701300A (en) Method for forming resist pattern and method for manufacturing semiconductor device
TW200737300A (en) Reflexible photo-mask blank, manufacturing method thereof, reflexible photomask, and manufacturing method of semiconductor apparatus
TW200739266A (en) Rework process for photoresist film
TW200739265A (en) Positive photoresist composition and method of forming photoresist pattern using the same

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees