WO2009078380A1 - Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate - Google Patents

Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate Download PDF

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Publication number
WO2009078380A1
WO2009078380A1 PCT/JP2008/072771 JP2008072771W WO2009078380A1 WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1 JP 2008072771 W JP2008072771 W JP 2008072771W WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1
Authority
WO
WIPO (PCT)
Prior art keywords
negative photosensitive
photosensitive resin
resin laminate
photosensitive layer
resist
Prior art date
Application number
PCT/JP2008/072771
Other languages
French (fr)
Japanese (ja)
Inventor
Youichiroh Ide
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to CN200880121352.5A priority Critical patent/CN101952777B/en
Priority to JP2009546256A priority patent/JP5199282B2/en
Publication of WO2009078380A1 publication Critical patent/WO2009078380A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Disclosed is a method for producing a cured resist which enables formation of a resist pattern having excellent adhesion and resolution after development, while having an excellent resist shape. Also disclosed are a negative photosensitive resin laminate, and use of a negative photosensitive resin laminate. Specifically disclosed is a method for producing a cured resist, which comprises a laminate-forming step wherein a negative photosensitive resin laminate, in which at least a supporting body (A), a negative photosensitive layer (B) and a substrate (C) are laminated, is formed, an exposure step wherein the negative photosensitive layer (B) is exposed through a lens using light projecting the image of a photomask, and a development step wherein a cured resist composed of the cured portion of the negative photosensitive layer (B) is formed by developing and removing the unexposed portion of the negative photosensitive layer (B). The negative photosensitive layer (B) has a light transmittance of not less than 25% but not more than 50% at a wavelength of 365 nm.
PCT/JP2008/072771 2007-12-18 2008-12-15 Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate WO2009078380A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880121352.5A CN101952777B (en) 2007-12-18 2008-12-15 Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate
JP2009546256A JP5199282B2 (en) 2007-12-18 2008-12-15 Method of producing resist cured product using negative photosensitive resin laminate, negative photosensitive resin laminate, and method of using negative photosensitive resin laminate

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007326102 2007-12-18
JP2007-325831 2007-12-18
JP2007-326102 2007-12-18
JP2007325831 2007-12-18
JP2007-325795 2007-12-18
JP2007325795 2007-12-18

Publications (1)

Publication Number Publication Date
WO2009078380A1 true WO2009078380A1 (en) 2009-06-25

Family

ID=40795495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072771 WO2009078380A1 (en) 2007-12-18 2008-12-15 Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate

Country Status (5)

Country Link
JP (1) JP5199282B2 (en)
KR (1) KR101175079B1 (en)
CN (2) CN101952777B (en)
TW (1) TWI424266B (en)
WO (1) WO2009078380A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (en) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp Photosensitive resin composition and laminate using the same
JP2015062080A (en) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
WO2016104585A1 (en) * 2014-12-25 2016-06-30 日立化成株式会社 Photosensitive resin composition, and photosensitive element using same, as well as method for forming resist pattern and method for producing printed circuit board
WO2016163540A1 (en) * 2015-04-08 2016-10-13 旭化成株式会社 Photosensitive resin composition
JPWO2016185604A1 (en) * 2015-05-21 2017-07-13 株式会社メイコー Printed wiring board manufacturing method and etching resist pattern forming method
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
JP2019133143A (en) * 2018-01-30 2019-08-08 旭化成株式会社 Photosensitive resin laminate and method for manufacturing resist pattern
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
KR20230033718A (en) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 photosensitive resin laminate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016136752A1 (en) * 2015-02-26 2016-09-01 株式会社Adeka Pattern formation method and electronic device manufactured using same
KR20170111411A (en) * 2016-03-28 2017-10-12 동우 화인켐 주식회사 Resist stripper composition, and method for manufacturing a plat panel for a display device and plat panel for a display device, and display device
KR20180077743A (en) * 2016-12-29 2018-07-09 주식회사 동진쎄미켐 Negative photosensitive resin composition
KR20210149691A (en) * 2019-03-29 2021-12-09 다이요 잉키 세이조 가부시키가이샤 Photoresist composition and cured product thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (en) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd Photo-setting resin laminate and manufacture of printed wiring board using the same
JP2001042522A (en) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element, production of resist pattern and production of printed circuit board
JP2001056553A (en) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The Phosphor pattern forming method
JP2002268215A (en) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd Photosensitive resin composition and its utilization

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200303895A (en) * 2002-03-06 2003-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition
JP4346315B2 (en) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and use thereof
JP4368639B2 (en) * 2003-08-19 2009-11-18 株式会社アドテックエンジニアリング Projection exposure equipment
JP2005352180A (en) * 2004-06-10 2005-12-22 Renesas Technology Corp Method for manufacturing semiconductor device
KR101017550B1 (en) * 2006-04-28 2011-02-28 아사히 가세이 일렉트로닉스 가부시끼가이샤 Photosensitive resin laminate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (en) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd Photo-setting resin laminate and manufacture of printed wiring board using the same
JP2001042522A (en) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element, production of resist pattern and production of printed circuit board
JP2001056553A (en) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The Phosphor pattern forming method
JP2002268215A (en) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd Photosensitive resin composition and its utilization

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (en) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp Photosensitive resin composition and laminate using the same
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
JP2015062080A (en) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
WO2016104585A1 (en) * 2014-12-25 2016-06-30 日立化成株式会社 Photosensitive resin composition, and photosensitive element using same, as well as method for forming resist pattern and method for producing printed circuit board
JPWO2016104585A1 (en) * 2014-12-25 2017-10-05 日立化成株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
WO2016163540A1 (en) * 2015-04-08 2016-10-13 旭化成株式会社 Photosensitive resin composition
JPWO2016163540A1 (en) * 2015-04-08 2017-11-02 旭化成株式会社 Photosensitive resin composition
JPWO2016185604A1 (en) * 2015-05-21 2017-07-13 株式会社メイコー Printed wiring board manufacturing method and etching resist pattern forming method
JP2019133143A (en) * 2018-01-30 2019-08-08 旭化成株式会社 Photosensitive resin laminate and method for manufacturing resist pattern
KR20230033718A (en) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 photosensitive resin laminate

Also Published As

Publication number Publication date
CN102937776B (en) 2017-04-19
CN102937776A (en) 2013-02-20
KR101175079B1 (en) 2012-08-21
TWI424266B (en) 2014-01-21
JP5199282B2 (en) 2013-05-15
KR20100032939A (en) 2010-03-26
JPWO2009078380A1 (en) 2011-04-28
TW200947116A (en) 2009-11-16
CN101952777A (en) 2011-01-19
CN101952777B (en) 2014-04-09

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