WO2009078380A1 - Procédé pour fabriquer une réserve durcie à l'aide d'un stratifié de résine photosensible négative, stratifié de résine photosensible négative et utilisation du stratifié de résine photosensible négative - Google Patents

Procédé pour fabriquer une réserve durcie à l'aide d'un stratifié de résine photosensible négative, stratifié de résine photosensible négative et utilisation du stratifié de résine photosensible négative Download PDF

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Publication number
WO2009078380A1
WO2009078380A1 PCT/JP2008/072771 JP2008072771W WO2009078380A1 WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1 JP 2008072771 W JP2008072771 W JP 2008072771W WO 2009078380 A1 WO2009078380 A1 WO 2009078380A1
Authority
WO
WIPO (PCT)
Prior art keywords
negative photosensitive
photosensitive resin
resin laminate
photosensitive layer
resist
Prior art date
Application number
PCT/JP2008/072771
Other languages
English (en)
Japanese (ja)
Inventor
Youichiroh Ide
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to CN200880121352.5A priority Critical patent/CN101952777B/zh
Priority to JP2009546256A priority patent/JP5199282B2/ja
Publication of WO2009078380A1 publication Critical patent/WO2009078380A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention porte sur un procédé pour fabriquer une réserve durcie, qui permet la formation d'un motif de réserve présentant une excellente adhérence et une excellente résolution après développement, tout en ayant une excellente forme de réserve. L'invention porte également sur un stratifié de résine photosensible négative et sur l'utilisation d'un stratifié de résine photosensible négative. Spécifiquement, l'invention porte sur un procédé pour fabriquer une réserve durcie, qui comprend une étape de formation de stratifié, un stratifié de résine photosensible négative étant formé, dans lequel au moins un corps de support (A), une couche photosensible négative (B) et un substrat (C) sont stratifiés. L'invention concerne ensuite une étape d'exposition, la couche photosensible négative (B) étant exposée à travers une lentille à l'aide d'une lumière projetant l'image d'un photomasque, et une étape de développement, une réserve durcie composée de la partie durcie de la couche photosensible négative (B) étant formée par le développement et le retrait de la partie non exposée de la couche photosensible négative (B). La couche photosensible négative (B) présente une transmittance de lumière n'étant pas inférieure à 25 % et pas supérieure à 50 % à une longueur d'onde de 365 nm.
PCT/JP2008/072771 2007-12-18 2008-12-15 Procédé pour fabriquer une réserve durcie à l'aide d'un stratifié de résine photosensible négative, stratifié de résine photosensible négative et utilisation du stratifié de résine photosensible négative WO2009078380A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880121352.5A CN101952777B (zh) 2007-12-18 2008-12-15 使用负型感光性树脂层压体的抗蚀剂固化物的制造方法、负型感光性树脂层压体、以及负型感光性树脂层压体的使用方法
JP2009546256A JP5199282B2 (ja) 2007-12-18 2008-12-15 ネガ型感光性樹脂積層体を用いたレジスト硬化物の製造方法、ネガ型感光性樹脂積層体、及びネガ型感光性樹脂積層体の使用方法

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007-325795 2007-12-18
JP2007325795 2007-12-18
JP2007-326102 2007-12-18
JP2007325831 2007-12-18
JP2007-325831 2007-12-18
JP2007326102 2007-12-18

Publications (1)

Publication Number Publication Date
WO2009078380A1 true WO2009078380A1 (fr) 2009-06-25

Family

ID=40795495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/072771 WO2009078380A1 (fr) 2007-12-18 2008-12-15 Procédé pour fabriquer une réserve durcie à l'aide d'un stratifié de résine photosensible négative, stratifié de résine photosensible négative et utilisation du stratifié de résine photosensible négative

Country Status (5)

Country Link
JP (1) JP5199282B2 (fr)
KR (1) KR101175079B1 (fr)
CN (2) CN101952777B (fr)
TW (1) TWI424266B (fr)
WO (1) WO2009078380A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (ja) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた積層体
JP2015062080A (ja) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
WO2016104585A1 (fr) * 2014-12-25 2016-06-30 日立化成株式会社 Composition de résine photosensible et élément photosensible l'utilisant, et procédé de formation de motif de réserve et procédé de production de carte de circuit imprimé
WO2016163540A1 (fr) * 2015-04-08 2016-10-13 旭化成株式会社 Composition de résine photosensible
JPWO2016185604A1 (ja) * 2015-05-21 2017-07-13 株式会社メイコー プリント配線板の製造方法及びエッチングレジストのパターン形成方法
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
KR20230033718A (ko) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 감광성 수지 적층체

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10386721B2 (en) * 2015-02-26 2019-08-20 Adeka Corporation Pattern formation method and electronic device manufactured using same
KR20170111411A (ko) * 2016-03-28 2017-10-12 동우 화인켐 주식회사 레지스트 박리액 조성물, 및 디스플레이 장치용 플랫 패널의 제조방법 및 그에 의해 제조된 디스플레이 장치용 플랫 패널, 및 디스플레이 장치
KR20180077743A (ko) * 2016-12-29 2018-07-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
WO2020203790A1 (fr) * 2019-03-29 2020-10-08 太陽インキ製造株式会社 Composition de résine photosensible et son produit durci

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (ja) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JP2001042522A (ja) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001056553A (ja) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The 蛍光体パターンの形成方法
JP2002268215A (ja) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd 感光性樹脂組成物とその利用

Family Cites Families (5)

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TW200303895A (en) * 2002-03-06 2003-09-16 Hitachi Chemical Co Ltd Photosensitive resin composition
JP4346315B2 (ja) * 2003-01-14 2009-10-21 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその用途
JP4368639B2 (ja) * 2003-08-19 2009-11-18 株式会社アドテックエンジニアリング 投影露光装置
JP2005352180A (ja) * 2004-06-10 2005-12-22 Renesas Technology Corp 半導体装置の製造方法
KR101017550B1 (ko) * 2006-04-28 2011-02-28 아사히 가세이 일렉트로닉스 가부시끼가이샤 감광성 수지 적층체

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03236956A (ja) * 1989-05-17 1991-10-22 Asahi Chem Ind Co Ltd 光硬化性樹脂積層体及びそれを用いるプリント配線板の製造方法
JP2001042522A (ja) * 1999-05-27 2001-02-16 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法及びプリント配線板の製造法
JP2001056553A (ja) * 1999-08-20 2001-02-27 Nippon Synthetic Chem Ind Co Ltd:The 蛍光体パターンの形成方法
JP2002268215A (ja) * 2001-03-08 2002-09-18 Hitachi Chem Co Ltd 感光性樹脂組成物とその利用

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012215676A (ja) * 2011-03-31 2012-11-08 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びそれを用いた積層体
US9989854B2 (en) 2013-07-23 2018-06-05 Hitachi Chemical Company, Ltd. Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
US10520816B2 (en) 2014-05-23 2019-12-31 Hitachi Chemical Company, Ltd. Method for forming resist pattern, method for manufacturing printed wiring board, photosensitive resin composition for projection exposure and photosensitive element
JP2015062080A (ja) * 2014-12-15 2015-04-02 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
WO2016104585A1 (fr) * 2014-12-25 2016-06-30 日立化成株式会社 Composition de résine photosensible et élément photosensible l'utilisant, et procédé de formation de motif de réserve et procédé de production de carte de circuit imprimé
JPWO2016104585A1 (ja) * 2014-12-25 2017-10-05 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法
WO2016163540A1 (fr) * 2015-04-08 2016-10-13 旭化成株式会社 Composition de résine photosensible
JPWO2016163540A1 (ja) * 2015-04-08 2017-11-02 旭化成株式会社 感光性樹脂組成物
JPWO2016185604A1 (ja) * 2015-05-21 2017-07-13 株式会社メイコー プリント配線板の製造方法及びエッチングレジストのパターン形成方法
JP2019133143A (ja) * 2018-01-30 2019-08-08 旭化成株式会社 感光性樹脂積層体及びレジストパターンの製造方法
KR20230033718A (ko) 2020-10-23 2023-03-08 아사히 가세이 가부시키가이샤 감광성 수지 적층체

Also Published As

Publication number Publication date
KR101175079B1 (ko) 2012-08-21
CN102937776A (zh) 2013-02-20
JP5199282B2 (ja) 2013-05-15
KR20100032939A (ko) 2010-03-26
JPWO2009078380A1 (ja) 2011-04-28
CN102937776B (zh) 2017-04-19
CN101952777A (zh) 2011-01-19
CN101952777B (zh) 2014-04-09
TWI424266B (zh) 2014-01-21
TW200947116A (en) 2009-11-16

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