ES2570737T3 - Método para conformar un diseño metálico sobre un sustrato - Google Patents

Método para conformar un diseño metálico sobre un sustrato

Info

Publication number
ES2570737T3
ES2570737T3 ES05712634T ES05712634T ES2570737T3 ES 2570737 T3 ES2570737 T3 ES 2570737T3 ES 05712634 T ES05712634 T ES 05712634T ES 05712634 T ES05712634 T ES 05712634T ES 2570737 T3 ES2570737 T3 ES 2570737T3
Authority
ES
Spain
Prior art keywords
photosensitive film
substrate
metallic pattern
development
seconds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES05712634T
Other languages
English (en)
Inventor
Kyle Baldwin
John Ganjei
Elke Kotur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Application granted granted Critical
Publication of ES2570737T3 publication Critical patent/ES2570737T3/es
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0577—Double layer of resist having the same pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

Un método para producir un diseño metálico sobre un sustrato que comprende las etapas de: a) proporcionar una primera película fotosensible sobre el sustrato; b) proporcionar una segunda película fotosensible directamente sobre la primera película fotosensible; c) colocar una imagen negativa del diseño metálico deseado sobre la segunda película fotosensible y exponer la primera película fotosensible y la segunda película fotosensible a la radiación actínica; d) revelar las zonas no curadas de la primera película fotosensible y la segunda película fotosensible para producir una imagen negativa del diseño metálico deseado sobre el sustrato; e) depositar metal sobre el sustrato; y f) retirar la primera película fotosensible y la segunda película fotosensible del sustrato para dejar el diseño metálico sobre el sustrato, donde la primera película fotosensible tiene un tiempo de revelado más rápido que la segunda película fotosensible caracterizado por que el tiempo de residencia de revelado (en H carbonato de potasio al 1 % a 32 ºC (90 ºF)) de la primera película fotosensible está comprendido entre 40 y 60 segundos y el tiempo de residencia de revelado de la segunda película fotosensible está comprendido entre 80 y 120 segundos.
ES05712634T 2004-04-06 2005-02-03 Método para conformar un diseño metálico sobre un sustrato Active ES2570737T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/820,236 US7378225B2 (en) 2004-04-06 2004-04-06 Method of forming a metal pattern on a substrate
PCT/US2005/003260 WO2005103824A2 (en) 2004-04-06 2005-02-03 Method of forming a metal pattern on a substrate

Publications (1)

Publication Number Publication Date
ES2570737T3 true ES2570737T3 (es) 2016-05-20

Family

ID=35054749

Family Applications (1)

Application Number Title Priority Date Filing Date
ES05712634T Active ES2570737T3 (es) 2004-04-06 2005-02-03 Método para conformar un diseño metálico sobre un sustrato

Country Status (6)

Country Link
US (1) US7378225B2 (es)
EP (1) EP1733281B1 (es)
JP (1) JP2007532945A (es)
CN (1) CN1957298B (es)
ES (1) ES2570737T3 (es)
WO (1) WO2005103824A2 (es)

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JP5277679B2 (ja) * 2007-03-30 2013-08-28 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2008141481A1 (fr) * 2007-05-24 2008-11-27 Princo Corp. Structure et procédé de fabrication d'un câblage métallique sur une carte multicouches
TWI354523B (en) * 2007-05-25 2011-12-11 Princo Corp Method for manufacturing metal lines in multi-laye
US20080308003A1 (en) * 2007-06-13 2008-12-18 Krol Andrew M UV inkjet resist
US8815333B2 (en) 2007-12-05 2014-08-26 Princo Middle East Fze Manufacturing method of metal structure in multi-layer substrate
KR101320225B1 (ko) * 2008-03-21 2013-10-21 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
KR101294585B1 (ko) * 2008-04-14 2013-08-07 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물 및 그 적층체
WO2012102933A2 (en) 2011-01-24 2012-08-02 Sunrise Micro Devices, Inc. Detection of insufficient supplied power
US10007286B2 (en) 2011-01-24 2018-06-26 Sunrise Micro Devices, Inc. Switching regulator overload detector
US9829793B2 (en) * 2011-10-04 2017-11-28 The University Of Western Ontario Fabrication of free standing membranes and use thereof for synthesis of nanoparticle patterns
JP6361260B2 (ja) * 2014-04-18 2018-07-25 大日本印刷株式会社 積層体の製造方法、カラーフィルタの製造方法、積層体およびカラーフィルタ
CN104536266B (zh) * 2015-01-30 2018-08-07 杭州福斯特应用材料股份有限公司 一种干膜抗蚀剂层压体
JP7030450B2 (ja) * 2017-08-18 2022-03-07 三菱製紙株式会社 レジストパターンの形成方法
US10031415B1 (en) 2017-08-21 2018-07-24 Funai Electric Co., Ltd. Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film
US10599034B2 (en) 2017-08-21 2020-03-24 Funai Electric Co., Ltd. Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film

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US4413051A (en) * 1981-05-04 1983-11-01 Dynamics Research Corporation Method for providing high resolution, highly defined, thick film patterns
EP0127691B1 (de) * 1983-06-01 1987-05-13 Ibm Deutschland Gmbh Verfahren zum Herstellen von gedruckten Schaltungen mit einer Leiterzugebene
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Also Published As

Publication number Publication date
WO2005103824A3 (en) 2006-12-21
CN1957298B (zh) 2010-05-12
EP1733281A4 (en) 2010-06-09
EP1733281B1 (en) 2016-04-27
US7378225B2 (en) 2008-05-27
US20050221232A1 (en) 2005-10-06
CN1957298A (zh) 2007-05-02
JP2007532945A (ja) 2007-11-15
WO2005103824A2 (en) 2005-11-03
EP1733281A2 (en) 2006-12-20

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