ATE547743T1 - Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster - Google Patents

Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster

Info

Publication number
ATE547743T1
ATE547743T1 AT08004849T AT08004849T ATE547743T1 AT E547743 T1 ATE547743 T1 AT E547743T1 AT 08004849 T AT08004849 T AT 08004849T AT 08004849 T AT08004849 T AT 08004849T AT E547743 T1 ATE547743 T1 AT E547743T1
Authority
AT
Austria
Prior art keywords
producing
carbon atoms
photosensitive composition
relief pattern
group containing
Prior art date
Application number
AT08004849T
Other languages
English (en)
Inventor
Kenichiro Sato
Naoya Sugimoto
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Application granted granted Critical
Publication of ATE547743T1 publication Critical patent/ATE547743T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polyamides (AREA)
AT08004849T 2007-03-14 2008-03-14 Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster ATE547743T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007065325 2007-03-14
JP2007178473 2007-07-06

Publications (1)

Publication Number Publication Date
ATE547743T1 true ATE547743T1 (de) 2012-03-15

Family

ID=39577289

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08004849T ATE547743T1 (de) 2007-03-14 2008-03-14 Lichtempfindliche zusammensetzung und herstellungsverfahren für ein gehärtetes reliefmuster

Country Status (4)

Country Link
US (1) US7615324B2 (de)
EP (1) EP1970761B1 (de)
JP (1) JP2009037201A (de)
AT (1) ATE547743T1 (de)

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JP4911454B2 (ja) * 2006-09-19 2012-04-04 富士フイルム株式会社 ポリベンゾオキサゾール前駆体、それを用いた感光性樹脂組成物及び半導体装置の製造方法
JP5537962B2 (ja) * 2009-01-16 2014-07-02 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物及びこれを用いたパターン形成方法
JP5751025B2 (ja) * 2011-05-31 2015-07-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置
JP5887172B2 (ja) * 2011-07-29 2016-03-16 富士フイルム株式会社 感光性樹脂組成物、レリーフパターン形成材料、感光性膜、ポリイミド膜、硬化レリーフパターンの製造方法、及び半導体装置
KR20160085303A (ko) * 2013-12-11 2016-07-15 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 액정 표시 장치 및 유기 el 표시 장치
JP6286227B2 (ja) 2014-02-21 2018-02-28 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、感活性光線性又は感放射線性膜、感活性光線性又は感放射線性膜を備えたマスクブランクス、パターン形成方法、及び電子デバイスの製造方法
JP6209103B2 (ja) * 2014-02-25 2017-10-04 富士フイルム株式会社 感活性光線性又は感放射線性樹脂組成物、それを用いたレジスト膜、レジスト塗布マスクブランクス、レジストパターン形成方法、及び、フォトマスク
SG11201705933WA (en) * 2015-01-23 2017-09-28 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component
KR101921918B1 (ko) * 2015-03-27 2018-11-26 도레이 카부시키가이샤 디아민 화합물에 유래하는 구조를 갖는 내열성 수지 또는 내열성 수지 전구체
JP6743692B2 (ja) * 2015-03-27 2020-08-19 東レ株式会社 感光性樹脂組成物、感光性シート、半導体装置および半導体装置の製造方法
CN112424692A (zh) * 2018-07-25 2021-02-26 Jsr株式会社 感光性树脂组合物、具有图案的树脂膜的制造方法、具有图案的树脂膜、及半导体电路基板
KR102782505B1 (ko) * 2020-12-07 2025-03-14 주식회사 엘지화학 폴리이미드 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치
EP4043963B1 (de) * 2021-02-11 2023-07-05 Xetos AG Verbessertes ausbleichen

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JP4525202B2 (ja) 2004-06-22 2010-08-18 住友ベークライト株式会社 ポジ型感光性樹脂組成物並びに半導体装置及び表示素子並びに半導体装置、表示素子の製造方法
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Also Published As

Publication number Publication date
US7615324B2 (en) 2009-11-10
EP1970761B1 (de) 2012-02-29
JP2009037201A (ja) 2009-02-19
US20080227024A1 (en) 2008-09-18
EP1970761A1 (de) 2008-09-17

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