MY144163A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY144163A MY144163A MYPI20055484A MYPI20055484A MY144163A MY 144163 A MY144163 A MY 144163A MY PI20055484 A MYPI20055484 A MY PI20055484A MY PI20055484 A MYPI20055484 A MY PI20055484A MY 144163 A MY144163 A MY 144163A
- Authority
- MY
- Malaysia
- Prior art keywords
- polishing composition
- substrate
- compound
- hard disk
- amino groups
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 6
- -1 AMINO GROUPS Chemical group 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 101000740162 Homo sapiens Sodium- and chloride-dependent transporter XTRP3 Proteins 0.000 abstract 1
- 102100037189 Sodium- and chloride-dependent transporter XTRP3 Human genes 0.000 abstract 1
- 150000007519 polyprotic acids Polymers 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347212A JP4836441B2 (ja) | 2004-11-30 | 2004-11-30 | 研磨液組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY144163A true MY144163A (en) | 2011-08-15 |
Family
ID=35580228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI20055484A MY144163A (en) | 2004-11-30 | 2005-11-24 | Polishing composition |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060112647A1 (zh) |
JP (1) | JP4836441B2 (zh) |
CN (1) | CN1781971B (zh) |
GB (1) | GB2421244B (zh) |
MY (1) | MY144163A (zh) |
TW (1) | TWI370844B (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4577296B2 (ja) * | 2006-10-27 | 2010-11-10 | 富士電機デバイステクノロジー株式会社 | 磁気記録媒体用非金属基板の再生方法 |
JP2009013046A (ja) * | 2007-06-05 | 2009-01-22 | Asahi Glass Co Ltd | ガラス基板表面を加工する方法 |
JP2008307676A (ja) * | 2007-06-18 | 2008-12-25 | Kao Corp | ハードディスク基板用研磨液組成物 |
JP5063339B2 (ja) * | 2007-12-28 | 2012-10-31 | 花王株式会社 | ハードディスク基板用研磨液組成物、並びにこれを用いた研磨方法及びハードディスク基板の製造方法 |
JP5576634B2 (ja) * | 2008-11-05 | 2014-08-20 | 山口精研工業株式会社 | 研磨剤組成物及び磁気ディスク基板の研磨方法 |
JP5657247B2 (ja) * | 2009-12-25 | 2015-01-21 | 花王株式会社 | 研磨液組成物 |
JP5940278B2 (ja) * | 2010-10-27 | 2016-06-29 | 花王株式会社 | ガラスハードディスク基板の製造方法 |
JP5925454B2 (ja) | 2010-12-16 | 2016-05-25 | 花王株式会社 | 磁気ディスク基板用研磨液組成物 |
JP5979872B2 (ja) * | 2011-01-31 | 2016-08-31 | 花王株式会社 | 磁気ディスク基板の製造方法 |
KR101521036B1 (ko) | 2011-02-23 | 2015-05-15 | 다이니치 세이카 고교 가부시키가이샤 | 수성 액상 조성물, 수성 도공액, 기능성 도공막 및 복합재료 |
JP5933950B2 (ja) * | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 銅または銅合金用エッチング液 |
JP5870195B2 (ja) | 2012-08-21 | 2016-02-24 | 大日精化工業株式会社 | 水性液状組成物、水性塗工液、機能性塗工膜、及び複合材料 |
EP2910334A4 (en) * | 2012-10-03 | 2016-08-03 | Fujimi Inc | POLISHING METHOD AND METHOD FOR PRODUCING AN ALLOYING MATERIAL |
CN106716530B (zh) * | 2014-09-17 | 2019-06-21 | Hoya株式会社 | 磁盘用基板的制造方法 |
JP6659449B2 (ja) * | 2016-05-09 | 2020-03-04 | 山口精研工業株式会社 | 無電解ニッケル−リンめっきされたアルミニウム磁気ディスク基板用研磨剤組成物 |
JP6734146B2 (ja) * | 2016-08-23 | 2020-08-05 | 山口精研工業株式会社 | 磁気ディスク基板用研磨剤組成物 |
CN108148507B (zh) * | 2017-12-18 | 2020-12-04 | 清华大学 | 一种用于熔石英的抛光组合物 |
JP2021137931A (ja) * | 2020-03-06 | 2021-09-16 | 株式会社フジミインコーポレーテッド | アルミナスラリー、これを用いたウェットブラスト加工用スラリー及び加工方法 |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4639394A (en) * | 1985-04-01 | 1987-01-27 | Ppg Industries, Inc. | Non-aqueous dispersions prepared with styrene polymer dispersion stabilizers |
US5209816A (en) * | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
US5350788A (en) * | 1993-03-11 | 1994-09-27 | E. I. Du Pont De Nemours And Company | Method for reducing odors in recycled plastics and compositions relating thereto |
US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
US5362784A (en) * | 1993-05-28 | 1994-11-08 | E. I. Du Pont De Nemours And Company | Aldehyde scavenging compositions and methods relating thereto |
US6855266B1 (en) * | 1999-08-13 | 2005-02-15 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
ATE292167T1 (de) * | 1999-08-13 | 2005-04-15 | Cabot Microelectronics Corp | Poliersystem mit stopmittel und verfahren zu seiner verwendung |
JP4264781B2 (ja) * | 1999-09-20 | 2009-05-20 | 株式会社フジミインコーポレーテッド | 研磨用組成物および研磨方法 |
JP3575750B2 (ja) * | 2000-05-12 | 2004-10-13 | 花王株式会社 | 研磨液組成物 |
JP2002164307A (ja) * | 2000-11-24 | 2002-06-07 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP3768401B2 (ja) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
US7323416B2 (en) * | 2001-03-14 | 2008-01-29 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
JP2003347247A (ja) * | 2002-05-28 | 2003-12-05 | Hitachi Chem Co Ltd | 半導体絶縁膜用cmp研磨剤及び基板の研磨方法 |
JP3875155B2 (ja) * | 2002-07-31 | 2007-01-31 | 花王株式会社 | ロールオフ低減剤 |
GB2393186B (en) * | 2002-07-31 | 2006-02-22 | Kao Corp | Polishing composition |
GB2393447B (en) * | 2002-08-07 | 2006-04-19 | Kao Corp | Polishing composition |
JP4446371B2 (ja) * | 2002-08-30 | 2010-04-07 | 花王株式会社 | 研磨液組成物 |
JP2004193495A (ja) * | 2002-12-13 | 2004-07-08 | Toshiba Corp | 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法 |
JP2004311484A (ja) * | 2003-04-02 | 2004-11-04 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
WO2004100242A1 (ja) * | 2003-05-09 | 2004-11-18 | Sanyo Chemical Industries, Ltd. | Cmpプロセス用研磨液及び研磨方法 |
JP2004335978A (ja) * | 2003-05-12 | 2004-11-25 | Jsr Corp | 化学機械研磨方法 |
US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
-
2004
- 2004-11-30 JP JP2004347212A patent/JP4836441B2/ja not_active Expired - Fee Related
-
2005
- 2005-11-16 CN CN2005101253766A patent/CN1781971B/zh not_active Expired - Fee Related
- 2005-11-17 GB GB0523438A patent/GB2421244B/en not_active Expired - Fee Related
- 2005-11-24 MY MYPI20055484A patent/MY144163A/en unknown
- 2005-11-29 US US11/288,294 patent/US20060112647A1/en not_active Abandoned
- 2005-11-30 TW TW094142196A patent/TWI370844B/zh not_active IP Right Cessation
-
2008
- 2008-07-10 US US12/216,762 patent/US20080280538A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
GB0523438D0 (en) | 2005-12-28 |
JP4836441B2 (ja) | 2011-12-14 |
CN1781971B (zh) | 2010-05-05 |
GB2421244A (en) | 2006-06-21 |
GB2421244B (en) | 2009-03-18 |
TW200621967A (en) | 2006-07-01 |
US20060112647A1 (en) | 2006-06-01 |
JP2006150534A (ja) | 2006-06-15 |
TWI370844B (en) | 2012-08-21 |
CN1781971A (zh) | 2006-06-07 |
US20080280538A1 (en) | 2008-11-13 |
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