DE602005002164D1 - Polierzusammensetzung und Poliermethode - Google Patents

Polierzusammensetzung und Poliermethode

Info

Publication number
DE602005002164D1
DE602005002164D1 DE602005002164T DE602005002164T DE602005002164D1 DE 602005002164 D1 DE602005002164 D1 DE 602005002164D1 DE 602005002164 T DE602005002164 T DE 602005002164T DE 602005002164 T DE602005002164 T DE 602005002164T DE 602005002164 D1 DE602005002164 D1 DE 602005002164D1
Authority
DE
Germany
Prior art keywords
polishing
polishing composition
composition
iron
alloy containing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005002164T
Other languages
English (en)
Other versions
DE602005002164T2 (de
Inventor
Kazusei Tamai
Yasuyuki Yamato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of DE602005002164D1 publication Critical patent/DE602005002164D1/de
Application granted granted Critical
Publication of DE602005002164T2 publication Critical patent/DE602005002164T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H17/00—Fencing, e.g. fences, enclosures, corrals
    • E04H17/02—Wire fencing, e.g. made of wire mesh
    • E04H17/06—Parts for wire fences

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • ing And Chemical Polishing (AREA)
  • Disintegrating Or Milling (AREA)
  • Weting (AREA)
DE602005002164T 2004-03-19 2005-03-18 Polierzusammensetzung und Poliermethode Active DE602005002164T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004081583 2004-03-19
JP2004081583A JP2005268664A (ja) 2004-03-19 2004-03-19 研磨用組成物

Publications (2)

Publication Number Publication Date
DE602005002164D1 true DE602005002164D1 (de) 2007-10-11
DE602005002164T2 DE602005002164T2 (de) 2008-05-21

Family

ID=34836612

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005002164T Active DE602005002164T2 (de) 2004-03-19 2005-03-18 Polierzusammensetzung und Poliermethode

Country Status (6)

Country Link
US (2) US20050204637A1 (de)
EP (1) EP1577357B1 (de)
JP (1) JP2005268664A (de)
KR (1) KR101110717B1 (de)
AT (1) ATE371709T1 (de)
DE (1) DE602005002164T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2006077127A (ja) * 2004-09-09 2006-03-23 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
JP2006086462A (ja) 2004-09-17 2006-03-30 Fujimi Inc 研磨用組成物およびそれを用いた配線構造体の製造法
US20070068902A1 (en) * 2005-09-29 2007-03-29 Yasushi Matsunami Polishing composition and polishing method
FR2893939B1 (fr) * 2005-11-29 2008-02-22 Snecma Propulsion Solide Sa Protection contre l'oxydation de materiaux composites contenant du carbone
CN101153205A (zh) * 2006-09-29 2008-04-02 安集微电子（上海）有限公司 用于抛光低介电材料的化学机械抛光液
JP2008135452A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
JP2008135453A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
US20080135520A1 (en) * 2006-12-12 2008-06-12 Tao Sun Chemical composition for chemical mechanical planarization
JP5523662B2 (ja) * 2007-09-25 2014-06-18 富士フイルム株式会社 研磨液及び研磨方法
JPWO2013077281A1 (ja) * 2011-11-25 2015-04-27 株式会社フジミインコーポレーテッド 合金材料の研磨方法及び合金材料の製造方法
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
KR102226441B1 (ko) * 2013-02-13 2021-03-12 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마용 조성물 제조 방법 및 연마물 제조 방법
WO2016132676A1 (ja) * 2015-02-19 2016-08-25 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物および研磨方法
US10315285B2 (en) 2015-04-06 2019-06-11 Cabot Microelectronics Corporation CMP composition and method for polishing rigid disks
CN115353808B (zh) * 2022-07-13 2024-01-23 锦矽半导体(上海)有限公司 一种镍镀层用抛光液

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US5391258A (en) * 1993-05-26 1995-02-21 Rodel, Inc. Compositions and methods for polishing
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
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US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
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KR100473442B1 (ko) * 1998-10-23 2005-03-08 아치 스페셜티 케미칼즈, 인코포레이티드 금속층의 화학적 기계적 연마를 위한 활성제, 활성제 용액, 슬러리 시스템 및 연마방법
JP4053165B2 (ja) * 1998-12-01 2008-02-27 株式会社フジミインコーポレーテッド 研磨用組成物およびそれを用いた研磨方法
JP2001053039A (ja) * 1999-08-05 2001-02-23 Okamoto Machine Tool Works Ltd ウエハの研磨終点検出方法および研磨終点検出装置
AU6379500A (en) * 1999-08-13 2001-03-13 Cabot Microelectronics Corporation Chemical mechanical polishing systems and methods for their use
US6471735B1 (en) * 1999-08-17 2002-10-29 Air Liquide America Corporation Compositions for use in a chemical-mechanical planarization process
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
US6432826B1 (en) * 1999-11-29 2002-08-13 Applied Materials, Inc. Planarized Cu cleaning for reduced defects
US6569215B2 (en) * 2000-04-17 2003-05-27 Showa Denko Kabushiki Kaisha Composition for polishing magnetic disk substrate
JP2002075927A (ja) * 2000-08-24 2002-03-15 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
US6541384B1 (en) * 2000-09-08 2003-04-01 Applied Materials, Inc. Method of initiating cooper CMP process
JP2002110596A (ja) * 2000-10-02 2002-04-12 Mitsubishi Electric Corp 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法
JP2002113431A (ja) * 2000-10-10 2002-04-16 Tokyo Electron Ltd 洗浄方法
JP3768401B2 (ja) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 化学的機械的研磨用スラリー
JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP3541225B2 (ja) * 2001-07-16 2004-07-07 宇宙科学研究所長 大型膜宇宙構造物およびその展開方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
MY133305A (en) * 2001-08-21 2007-11-30 Kao Corp Polishing composition
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US20030219982A1 (en) * 2002-05-23 2003-11-27 Hitachi Chemical Co., Ltd CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP3981616B2 (ja) * 2002-10-02 2007-09-26 株式会社フジミインコーポレーテッド 研磨用組成物
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
US7485162B2 (en) * 2003-09-30 2009-02-03 Fujimi Incorporated Polishing composition
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
WO2005047410A1 (en) * 2003-11-14 2005-05-26 Showa Denko K.K. Polishing composition and polishing method
US20050136671A1 (en) * 2003-12-22 2005-06-23 Goldberg Wendy B. Compositions and methods for low downforce pressure polishing of copper

Also Published As

Publication number Publication date
KR101110717B1 (ko) 2012-02-29
EP1577357B1 (de) 2007-08-29
KR20060044391A (ko) 2006-05-16
JP2005268664A (ja) 2005-09-29
ATE371709T1 (de) 2007-09-15
EP1577357A1 (de) 2005-09-21
DE602005002164T2 (de) 2008-05-21
US20050204637A1 (en) 2005-09-22
US20080210665A1 (en) 2008-09-04

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