ATE371709T1 - Polierzusammensetzung und poliermethode - Google Patents
Polierzusammensetzung und poliermethodeInfo
- Publication number
- ATE371709T1 ATE371709T1 AT05006024T AT05006024T ATE371709T1 AT E371709 T1 ATE371709 T1 AT E371709T1 AT 05006024 T AT05006024 T AT 05006024T AT 05006024 T AT05006024 T AT 05006024T AT E371709 T1 ATE371709 T1 AT E371709T1
- Authority
- AT
- Austria
- Prior art keywords
- polishing
- polishing composition
- composition
- iron
- alloy containing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title abstract 7
- 239000000203 mixture Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
- E04H17/00—Fencing, e.g. fences, enclosures, corrals
- E04H17/02—Wire fencing, e.g. made of wire mesh
- E04H17/06—Parts for wire fences
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- ing And Chemical Polishing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Disintegrating Or Milling (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004081583A JP2005268664A (ja) | 2004-03-19 | 2004-03-19 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE371709T1 true ATE371709T1 (de) | 2007-09-15 |
Family
ID=34836612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05006024T ATE371709T1 (de) | 2004-03-19 | 2005-03-18 | Polierzusammensetzung und poliermethode |
Country Status (6)
Country | Link |
---|---|
US (2) | US20050204637A1 (de) |
EP (1) | EP1577357B1 (de) |
JP (1) | JP2005268664A (de) |
KR (1) | KR101110717B1 (de) |
AT (1) | ATE371709T1 (de) |
DE (1) | DE602005002164T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4814502B2 (ja) * | 2004-09-09 | 2011-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP2006077127A (ja) * | 2004-09-09 | 2006-03-23 | Fujimi Inc | 研磨用組成物及びそれを用いた研磨方法 |
JP2006086462A (ja) | 2004-09-17 | 2006-03-30 | Fujimi Inc | 研磨用組成物およびそれを用いた配線構造体の製造法 |
US20070068902A1 (en) * | 2005-09-29 | 2007-03-29 | Yasushi Matsunami | Polishing composition and polishing method |
FR2893939B1 (fr) * | 2005-11-29 | 2008-02-22 | Snecma Propulsion Solide Sa | Protection contre l'oxydation de materiaux composites contenant du carbone |
CN101153205A (zh) * | 2006-09-29 | 2008-04-02 | 安集微电子(上海)有限公司 | 用于抛光低介电材料的化学机械抛光液 |
JP2008135452A (ja) * | 2006-11-27 | 2008-06-12 | Fujimi Inc | 研磨用組成物及び研磨方法 |
JP2008135453A (ja) * | 2006-11-27 | 2008-06-12 | Fujimi Inc | 研磨用組成物及び研磨方法 |
US20080135520A1 (en) * | 2006-12-12 | 2008-06-12 | Tao Sun | Chemical composition for chemical mechanical planarization |
JP5523662B2 (ja) * | 2007-09-25 | 2014-06-18 | 富士フイルム株式会社 | 研磨液及び研磨方法 |
US20140308155A1 (en) * | 2011-11-25 | 2014-10-16 | Fujimi Incorporated | Method for polishing alloy material and method for producing alloy material |
US9039914B2 (en) * | 2012-05-23 | 2015-05-26 | Cabot Microelectronics Corporation | Polishing composition for nickel-phosphorous-coated memory disks |
SG11201506001VA (en) * | 2013-02-13 | 2015-09-29 | Fujimi Inc | Polishing composition, method for producing polishing composition and method for producing polished article |
WO2016132676A1 (ja) * | 2015-02-19 | 2016-08-25 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物および研磨方法 |
US10315285B2 (en) | 2015-04-06 | 2019-06-11 | Cabot Microelectronics Corporation | CMP composition and method for polishing rigid disks |
CN115353808B (zh) * | 2022-07-13 | 2024-01-23 | 锦矽半导体(上海)有限公司 | 一种镍镀层用抛光液 |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5428721A (en) * | 1990-02-07 | 1995-06-27 | Kabushiki Kaisha Toshiba | Data processing apparatus for editing image by using image conversion |
US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
US5575885A (en) * | 1993-12-14 | 1996-11-19 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing semiconductor device |
JP3397501B2 (ja) * | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
US5954997A (en) * | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US6126853A (en) * | 1996-12-09 | 2000-10-03 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US6432828B2 (en) * | 1998-03-18 | 2002-08-13 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
ATE474899T1 (de) * | 1998-10-23 | 2010-08-15 | Fujifilm Electronic Materials | Eine chemisch-mechanisch polierende aufschlämmung,eine beschleunigerlösung enthaltend |
JP4053165B2 (ja) * | 1998-12-01 | 2008-02-27 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いた研磨方法 |
JP2001053039A (ja) * | 1999-08-05 | 2001-02-23 | Okamoto Machine Tool Works Ltd | ウエハの研磨終点検出方法および研磨終点検出装置 |
ATE405618T1 (de) * | 1999-08-13 | 2008-09-15 | Cabot Microelectronics Corp | Chemisch-mechanische poliersysteme und verfahren zu ihrer verwendung |
US6471735B1 (en) * | 1999-08-17 | 2002-10-29 | Air Liquide America Corporation | Compositions for use in a chemical-mechanical planarization process |
US6258140B1 (en) * | 1999-09-27 | 2001-07-10 | Fujimi America Inc. | Polishing composition |
US6432826B1 (en) * | 1999-11-29 | 2002-08-13 | Applied Materials, Inc. | Planarized Cu cleaning for reduced defects |
US6569215B2 (en) * | 2000-04-17 | 2003-05-27 | Showa Denko Kabushiki Kaisha | Composition for polishing magnetic disk substrate |
JP2002075927A (ja) * | 2000-08-24 | 2002-03-15 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
US6541384B1 (en) * | 2000-09-08 | 2003-04-01 | Applied Materials, Inc. | Method of initiating cooper CMP process |
JP2002110596A (ja) * | 2000-10-02 | 2002-04-12 | Mitsubishi Electric Corp | 半導体加工用研磨剤およびこれに用いる分散剤、並びに上記半導体加工用研磨剤を用いた半導体装置の製造方法 |
JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
JP3768401B2 (ja) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
JP2002164307A (ja) * | 2000-11-24 | 2002-06-07 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP2002231666A (ja) * | 2001-01-31 | 2002-08-16 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
JP3541225B2 (ja) * | 2001-07-16 | 2004-07-07 | 宇宙科学研究所長 | 大型膜宇宙構造物およびその展開方法 |
SG144688A1 (en) * | 2001-07-23 | 2008-08-28 | Fujimi Inc | Polishing composition and polishing method employing it |
MY133305A (en) * | 2001-08-21 | 2007-11-30 | Kao Corp | Polishing composition |
US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
US20030219982A1 (en) * | 2002-05-23 | 2003-11-27 | Hitachi Chemical Co., Ltd | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method |
JP4083502B2 (ja) * | 2002-08-19 | 2008-04-30 | 株式会社フジミインコーポレーテッド | 研磨方法及びそれに用いられる研磨用組成物 |
JP4593064B2 (ja) * | 2002-09-30 | 2010-12-08 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
JP3981616B2 (ja) * | 2002-10-02 | 2007-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
US7736405B2 (en) * | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
TWI347969B (en) * | 2003-09-30 | 2011-09-01 | Fujimi Inc | Polishing composition |
US20050076580A1 (en) * | 2003-10-10 | 2005-04-14 | Air Products And Chemicals, Inc. | Polishing composition and use thereof |
US20070082456A1 (en) * | 2003-11-14 | 2007-04-12 | Nobuo Uotani | Polishing composition and polishing method |
TWI288046B (en) * | 2003-11-14 | 2007-10-11 | Showa Denko Kk | Polishing composition and polishing method |
US20050136671A1 (en) * | 2003-12-22 | 2005-06-23 | Goldberg Wendy B. | Compositions and methods for low downforce pressure polishing of copper |
-
2004
- 2004-03-19 JP JP2004081583A patent/JP2005268664A/ja active Pending
-
2005
- 2005-03-17 US US11/083,363 patent/US20050204637A1/en not_active Abandoned
- 2005-03-18 EP EP05006024A patent/EP1577357B1/de active Active
- 2005-03-18 KR KR1020050022624A patent/KR101110717B1/ko not_active IP Right Cessation
- 2005-03-18 AT AT05006024T patent/ATE371709T1/de not_active IP Right Cessation
- 2005-03-18 DE DE602005002164T patent/DE602005002164T2/de active Active
-
2008
- 2008-01-14 US US12/013,967 patent/US20080210665A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20050204637A1 (en) | 2005-09-22 |
DE602005002164D1 (de) | 2007-10-11 |
KR20060044391A (ko) | 2006-05-16 |
US20080210665A1 (en) | 2008-09-04 |
EP1577357B1 (de) | 2007-08-29 |
EP1577357A1 (de) | 2005-09-21 |
JP2005268664A (ja) | 2005-09-29 |
DE602005002164T2 (de) | 2008-05-21 |
KR101110717B1 (ko) | 2012-02-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |