ATE371709T1 - Polierzusammensetzung und poliermethode - Google Patents

Polierzusammensetzung und poliermethode

Info

Publication number
ATE371709T1
ATE371709T1 AT05006024T AT05006024T ATE371709T1 AT E371709 T1 ATE371709 T1 AT E371709T1 AT 05006024 T AT05006024 T AT 05006024T AT 05006024 T AT05006024 T AT 05006024T AT E371709 T1 ATE371709 T1 AT E371709T1
Authority
AT
Austria
Prior art keywords
polishing
polishing composition
composition
iron
alloy containing
Prior art date
Application number
AT05006024T
Other languages
English (en)
Inventor
Kazusei Tamai
Yasuyuki Yamato
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Application granted granted Critical
Publication of ATE371709T1 publication Critical patent/ATE371709T1/de

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04H—BUILDINGS OR LIKE STRUCTURES FOR PARTICULAR PURPOSES; SWIMMING OR SPLASH BATHS OR POOLS; MASTS; FENCING; TENTS OR CANOPIES, IN GENERAL
    • E04H17/00—Fencing, e.g. fences, enclosures, corrals
    • E04H17/02—Wire fencing, e.g. made of wire mesh
    • E04H17/06—Parts for wire fences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • ing And Chemical Polishing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Disintegrating Or Milling (AREA)
  • Weting (AREA)
AT05006024T 2004-03-19 2005-03-18 Polierzusammensetzung und poliermethode ATE371709T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004081583A JP2005268664A (ja) 2004-03-19 2004-03-19 研磨用組成物

Publications (1)

Publication Number Publication Date
ATE371709T1 true ATE371709T1 (de) 2007-09-15

Family

ID=34836612

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05006024T ATE371709T1 (de) 2004-03-19 2005-03-18 Polierzusammensetzung und poliermethode

Country Status (6)

Country Link
US (2) US20050204637A1 (de)
EP (1) EP1577357B1 (de)
JP (1) JP2005268664A (de)
KR (1) KR101110717B1 (de)
AT (1) ATE371709T1 (de)
DE (1) DE602005002164T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP2006077127A (ja) * 2004-09-09 2006-03-23 Fujimi Inc 研磨用組成物及びそれを用いた研磨方法
JP2006086462A (ja) 2004-09-17 2006-03-30 Fujimi Inc 研磨用組成物およびそれを用いた配線構造体の製造法
US20070068902A1 (en) * 2005-09-29 2007-03-29 Yasushi Matsunami Polishing composition and polishing method
FR2893939B1 (fr) * 2005-11-29 2008-02-22 Snecma Propulsion Solide Sa Protection contre l'oxydation de materiaux composites contenant du carbone
CN101153205A (zh) * 2006-09-29 2008-04-02 安集微电子（上海）有限公司 用于抛光低介电材料的化学机械抛光液
JP2008135452A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
JP2008135453A (ja) * 2006-11-27 2008-06-12 Fujimi Inc 研磨用組成物及び研磨方法
US20080135520A1 (en) * 2006-12-12 2008-06-12 Tao Sun Chemical composition for chemical mechanical planarization
JP5523662B2 (ja) * 2007-09-25 2014-06-18 富士フイルム株式会社 研磨液及び研磨方法
US20140308155A1 (en) * 2011-11-25 2014-10-16 Fujimi Incorporated Method for polishing alloy material and method for producing alloy material
US9039914B2 (en) * 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
SG11201506001VA (en) * 2013-02-13 2015-09-29 Fujimi Inc Polishing composition, method for producing polishing composition and method for producing polished article
WO2016132676A1 (ja) * 2015-02-19 2016-08-25 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物および研磨方法
US10315285B2 (en) 2015-04-06 2019-06-11 Cabot Microelectronics Corporation CMP composition and method for polishing rigid disks
CN115353808B (zh) * 2022-07-13 2024-01-23 锦矽半导体(上海)有限公司 一种镍镀层用抛光液

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US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
JP3397501B2 (ja) * 1994-07-12 2003-04-14 株式会社東芝 研磨剤および研磨方法
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
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ATE474899T1 (de) * 1998-10-23 2010-08-15 Fujifilm Electronic Materials Eine chemisch-mechanisch polierende aufschlämmung,eine beschleunigerlösung enthaltend
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JP2002164307A (ja) * 2000-11-24 2002-06-07 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP2002231666A (ja) * 2001-01-31 2002-08-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
JP3541225B2 (ja) * 2001-07-16 2004-07-07 宇宙科学研究所長 大型膜宇宙構造物およびその展開方法
SG144688A1 (en) * 2001-07-23 2008-08-28 Fujimi Inc Polishing composition and polishing method employing it
MY133305A (en) * 2001-08-21 2007-11-30 Kao Corp Polishing composition
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US20030219982A1 (en) * 2002-05-23 2003-11-27 Hitachi Chemical Co., Ltd CMP (chemical mechanical polishing) polishing liquid for metal and polishing method
JP4083502B2 (ja) * 2002-08-19 2008-04-30 株式会社フジミインコーポレーテッド 研磨方法及びそれに用いられる研磨用組成物
JP4593064B2 (ja) * 2002-09-30 2010-12-08 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
JP3981616B2 (ja) * 2002-10-02 2007-09-26 株式会社フジミインコーポレーテッド 研磨用組成物
US7736405B2 (en) * 2003-05-12 2010-06-15 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for copper and associated materials and method of using same
TWI347969B (en) * 2003-09-30 2011-09-01 Fujimi Inc Polishing composition
US20050076580A1 (en) * 2003-10-10 2005-04-14 Air Products And Chemicals, Inc. Polishing composition and use thereof
US20070082456A1 (en) * 2003-11-14 2007-04-12 Nobuo Uotani Polishing composition and polishing method
TWI288046B (en) * 2003-11-14 2007-10-11 Showa Denko Kk Polishing composition and polishing method
US20050136671A1 (en) * 2003-12-22 2005-06-23 Goldberg Wendy B. Compositions and methods for low downforce pressure polishing of copper

Also Published As

Publication number Publication date
US20050204637A1 (en) 2005-09-22
DE602005002164D1 (de) 2007-10-11
KR20060044391A (ko) 2006-05-16
US20080210665A1 (en) 2008-09-04
EP1577357B1 (de) 2007-08-29
EP1577357A1 (de) 2005-09-21
JP2005268664A (ja) 2005-09-29
DE602005002164T2 (de) 2008-05-21
KR101110717B1 (ko) 2012-02-29

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