GB2421244B - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- GB2421244B GB2421244B GB0523438A GB0523438A GB2421244B GB 2421244 B GB2421244 B GB 2421244B GB 0523438 A GB0523438 A GB 0523438A GB 0523438 A GB0523438 A GB 0523438A GB 2421244 B GB2421244 B GB 2421244B
- Authority
- GB
- United Kingdom
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004347212A JP4836441B2 (en) | 2004-11-30 | 2004-11-30 | Polishing liquid composition |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0523438D0 GB0523438D0 (en) | 2005-12-28 |
GB2421244A GB2421244A (en) | 2006-06-21 |
GB2421244B true GB2421244B (en) | 2009-03-18 |
Family
ID=35580228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0523438A Expired - Fee Related GB2421244B (en) | 2004-11-30 | 2005-11-17 | Polishing composition |
Country Status (6)
Country | Link |
---|---|
US (2) | US20060112647A1 (en) |
JP (1) | JP4836441B2 (en) |
CN (1) | CN1781971B (en) |
GB (1) | GB2421244B (en) |
MY (1) | MY144163A (en) |
TW (1) | TWI370844B (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4577296B2 (en) * | 2006-10-27 | 2010-11-10 | 富士電機デバイステクノロジー株式会社 | Reproduction method of non-metallic substrate for magnetic recording medium |
JP2009013046A (en) * | 2007-06-05 | 2009-01-22 | Asahi Glass Co Ltd | Method of processing glass substrate |
JP2008307676A (en) * | 2007-06-18 | 2008-12-25 | Kao Corp | Polishing liquid composition for hard disk substrate |
JP5063339B2 (en) * | 2007-12-28 | 2012-10-31 | 花王株式会社 | Polishing liquid composition for hard disk substrate, polishing method using the same, and manufacturing method of hard disk substrate |
JP5576634B2 (en) * | 2008-11-05 | 2014-08-20 | 山口精研工業株式会社 | Abrasive composition and method for polishing magnetic disk substrate |
JP5657247B2 (en) * | 2009-12-25 | 2015-01-21 | 花王株式会社 | Polishing liquid composition |
JP5940278B2 (en) * | 2010-10-27 | 2016-06-29 | 花王株式会社 | Manufacturing method of glass hard disk substrate |
JP5925454B2 (en) | 2010-12-16 | 2016-05-25 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
JP5979872B2 (en) * | 2011-01-31 | 2016-08-31 | 花王株式会社 | Manufacturing method of magnetic disk substrate |
CN103403109B (en) * | 2011-02-23 | 2015-12-23 | 大日精化工业株式会社 | Water-based fluid composition, water-based coating fluid, functional coated film and matrix material |
JP5933950B2 (en) * | 2011-09-30 | 2016-06-15 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | Etching solution for copper or copper alloy |
WO2014030208A1 (en) | 2012-08-21 | 2014-02-27 | 大日精化工業株式会社 | Aqueous liquid composition, aqueous coating liquid, funtional coating film and composite material |
EP2910334A4 (en) * | 2012-10-03 | 2016-08-03 | Fujimi Inc | Polishing method and method for producing alloy material |
CN106716530B (en) * | 2014-09-17 | 2019-06-21 | Hoya株式会社 | The manufacturing method of substrate for magnetic disc |
JP6659449B2 (en) * | 2016-05-09 | 2020-03-04 | 山口精研工業株式会社 | Abrasive composition for electroless nickel-phosphorus plated aluminum magnetic disk substrate |
JP6734146B2 (en) * | 2016-08-23 | 2020-08-05 | 山口精研工業株式会社 | Abrasive composition for magnetic disk substrate |
CN108148507B (en) * | 2017-12-18 | 2020-12-04 | 清华大学 | Polishing composition for fused quartz |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001012740A1 (en) * | 1999-08-13 | 2001-02-22 | Cabot Microelectronics Corporation | Polishing system and method of its use |
EP1085067A1 (en) * | 1999-09-20 | 2001-03-21 | Fujimi Incorporated | Polishing composition and polishing process |
EP1209731A1 (en) * | 2000-11-24 | 2002-05-29 | Fujimi Incorporated | Polishing composition and polishing method employing it |
JP2004311484A (en) * | 2003-04-02 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Abrasive composition |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4639394A (en) * | 1985-04-01 | 1987-01-27 | Ppg Industries, Inc. | Non-aqueous dispersions prepared with styrene polymer dispersion stabilizers |
US5209816A (en) * | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
US5350788A (en) * | 1993-03-11 | 1994-09-27 | E. I. Du Pont De Nemours And Company | Method for reducing odors in recycled plastics and compositions relating thereto |
US5391258A (en) * | 1993-05-26 | 1995-02-21 | Rodel, Inc. | Compositions and methods for polishing |
US5362784A (en) * | 1993-05-28 | 1994-11-08 | E. I. Du Pont De Nemours And Company | Aldehyde scavenging compositions and methods relating thereto |
US6855266B1 (en) * | 1999-08-13 | 2005-02-15 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
JP3575750B2 (en) * | 2000-05-12 | 2004-10-13 | 花王株式会社 | Polishing liquid composition |
JP3768401B2 (en) * | 2000-11-24 | 2006-04-19 | Necエレクトロニクス株式会社 | Chemical mechanical polishing slurry |
US7323416B2 (en) * | 2001-03-14 | 2008-01-29 | Applied Materials, Inc. | Method and composition for polishing a substrate |
US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
US6755721B2 (en) * | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
JP2003347247A (en) * | 2002-05-28 | 2003-12-05 | Hitachi Chem Co Ltd | Cmp polishing agent for semiconductor insulating film and method of polishing substrate |
GB2393186B (en) * | 2002-07-31 | 2006-02-22 | Kao Corp | Polishing composition |
JP3875155B2 (en) * | 2002-07-31 | 2007-01-31 | 花王株式会社 | Roll-off reducing agent |
GB2393447B (en) * | 2002-08-07 | 2006-04-19 | Kao Corp | Polishing composition |
JP4446371B2 (en) * | 2002-08-30 | 2010-04-07 | 花王株式会社 | Polishing liquid composition |
JP2004193495A (en) * | 2002-12-13 | 2004-07-08 | Toshiba Corp | Cmp slurry, and method of producing semiconductor device using same |
KR20060015723A (en) * | 2003-05-09 | 2006-02-20 | 산요가세이고교 가부시키가이샤 | Polishing liquid for cmp process and polishing method |
JP2004335978A (en) * | 2003-05-12 | 2004-11-25 | Jsr Corp | Chemical mechanical polishing method |
US7247566B2 (en) * | 2003-10-23 | 2007-07-24 | Dupont Air Products Nanomaterials Llc | CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers |
-
2004
- 2004-11-30 JP JP2004347212A patent/JP4836441B2/en not_active Expired - Fee Related
-
2005
- 2005-11-16 CN CN2005101253766A patent/CN1781971B/en not_active Expired - Fee Related
- 2005-11-17 GB GB0523438A patent/GB2421244B/en not_active Expired - Fee Related
- 2005-11-24 MY MYPI20055484A patent/MY144163A/en unknown
- 2005-11-29 US US11/288,294 patent/US20060112647A1/en not_active Abandoned
- 2005-11-30 TW TW094142196A patent/TWI370844B/en not_active IP Right Cessation
-
2008
- 2008-07-10 US US12/216,762 patent/US20080280538A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001012740A1 (en) * | 1999-08-13 | 2001-02-22 | Cabot Microelectronics Corporation | Polishing system and method of its use |
EP1085067A1 (en) * | 1999-09-20 | 2001-03-21 | Fujimi Incorporated | Polishing composition and polishing process |
EP1209731A1 (en) * | 2000-11-24 | 2002-05-29 | Fujimi Incorporated | Polishing composition and polishing method employing it |
JP2004311484A (en) * | 2003-04-02 | 2004-11-04 | Sumitomo Bakelite Co Ltd | Abrasive composition |
Also Published As
Publication number | Publication date |
---|---|
GB0523438D0 (en) | 2005-12-28 |
TWI370844B (en) | 2012-08-21 |
US20080280538A1 (en) | 2008-11-13 |
CN1781971A (en) | 2006-06-07 |
CN1781971B (en) | 2010-05-05 |
GB2421244A (en) | 2006-06-21 |
US20060112647A1 (en) | 2006-06-01 |
JP4836441B2 (en) | 2011-12-14 |
JP2006150534A (en) | 2006-06-15 |
MY144163A (en) | 2011-08-15 |
TW200621967A (en) | 2006-07-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20161117 |