GB2401109B - Polishing composition - Google Patents

Polishing composition

Info

Publication number
GB2401109B
GB2401109B GB0407024A GB0407024A GB2401109B GB 2401109 B GB2401109 B GB 2401109B GB 0407024 A GB0407024 A GB 0407024A GB 0407024 A GB0407024 A GB 0407024A GB 2401109 B GB2401109 B GB 2401109B
Authority
GB
United Kingdom
Prior art keywords
polishing composition
polishing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0407024A
Other versions
GB2401109A (en
GB0407024D0 (en
GB2401109B8 (en
GB2401109A8 (en
Inventor
Junichi Hirano
Yasushi Matsunami
Noritaka Yokomichi
Toshiki Owaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of GB0407024D0 publication Critical patent/GB0407024D0/en
Publication of GB2401109A publication Critical patent/GB2401109A/en
Application granted granted Critical
Publication of GB2401109B publication Critical patent/GB2401109B/en
Publication of GB2401109B8 publication Critical patent/GB2401109B8/en
Publication of GB2401109A8 publication Critical patent/GB2401109A8/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
GB0407024A 2003-03-31 2004-03-29 Polishing composition Expired - Fee Related GB2401109B8 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003097252A JP4202172B2 (en) 2003-03-31 2003-03-31 Polishing composition

Publications (5)

Publication Number Publication Date
GB0407024D0 GB0407024D0 (en) 2004-04-28
GB2401109A GB2401109A (en) 2004-11-03
GB2401109B true GB2401109B (en) 2007-10-10
GB2401109B8 GB2401109B8 (en) 2007-11-14
GB2401109A8 GB2401109A8 (en) 2007-11-14

Family

ID=32212185

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0407024A Expired - Fee Related GB2401109B8 (en) 2003-03-31 2004-03-29 Polishing composition

Country Status (4)

Country Link
JP (1) JP4202172B2 (en)
CN (1) CN100389161C (en)
GB (1) GB2401109B8 (en)
MY (1) MY164438A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4202201B2 (en) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド Polishing composition
JP2006077127A (en) * 2004-09-09 2006-03-23 Fujimi Inc Polishing composition and polishing method using the composition
JP4523935B2 (en) * 2006-12-27 2010-08-11 昭和電工株式会社 An aqueous polishing slurry for polishing a silicon carbide single crystal substrate and a polishing method.
KR101564673B1 (en) 2008-02-01 2015-10-30 가부시키가이샤 후지미인코퍼레이티드 Polishing composition and polishing method using the same
CN103097476B (en) * 2010-09-08 2016-02-17 巴斯夫欧洲公司 Chemically machinery polished is used for moisture polishing composition and the method for the substrate of electronics, machinery and optics
JP6015931B2 (en) * 2011-12-15 2016-10-26 Jsr株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
CN102796458B (en) * 2012-07-17 2014-04-23 清华大学 Chemical mechanical polishing aqueous composite and chemical mechanical polishing process of titanium substrate
CN104471016B (en) * 2012-07-17 2018-06-22 福吉米株式会社 Alloy material composition for polishing and the manufacturing method using its alloy material
CN103897604B (en) * 2012-12-28 2015-12-02 上海新安纳电子科技有限公司 A kind of chemical mechanical polishing liquid of hard disc of computer
KR102611598B1 (en) * 2017-04-27 2023-12-08 주식회사 동진쎄미켐 Aqueous slurry composition for chemical mechanical polishing
WO2018199453A1 (en) * 2017-04-27 2018-11-01 주식회사 동진쎄미켐 Slurry composition for chemical mechanical polishing
KR102422952B1 (en) * 2017-06-12 2022-07-19 삼성전자주식회사 Slurry composition for polishing a metal layer and method for fabricating semiconductor device using the same
JP7058097B2 (en) * 2017-09-29 2022-04-21 株式会社フジミインコーポレーテッド Method for manufacturing polishing composition and magnetic disk substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2397068A (en) * 2002-12-26 2004-07-14 Kao Corp Polishing composition
GB2397579A (en) * 2002-12-26 2004-07-28 Kao Corp Polishing composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG54606A1 (en) * 1996-12-05 1998-11-16 Fujimi Inc Polishing composition
US6051870A (en) * 1997-12-17 2000-04-18 Advanced Micro Devices Process for fabricating semiconductor device including improved phosphorous-doped silicon dioxide dielectric film
US6258140B1 (en) * 1999-09-27 2001-07-10 Fujimi America Inc. Polishing composition
JP3877924B2 (en) * 2000-01-24 2007-02-07 昭和電工株式会社 Magnetic disk substrate polishing composition
TW471057B (en) * 2000-06-09 2002-01-01 Macronix Int Co Ltd Method for reducing dishing effect during chemical mechanical polishing
JP4231632B2 (en) * 2001-04-27 2009-03-04 花王株式会社 Polishing liquid composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2397068A (en) * 2002-12-26 2004-07-14 Kao Corp Polishing composition
GB2397579A (en) * 2002-12-26 2004-07-28 Kao Corp Polishing composition

Also Published As

Publication number Publication date
GB2401109A (en) 2004-11-03
CN1536046A (en) 2004-10-13
GB0407024D0 (en) 2004-04-28
JP2004300348A (en) 2004-10-28
GB2401109B8 (en) 2007-11-14
JP4202172B2 (en) 2008-12-24
GB2401109A8 (en) 2007-11-14
CN100389161C (en) 2008-05-21
MY164438A (en) 2017-12-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080329