MXPA02009975A - Aparato para llenado de material fluido y metodo de llenado relacionado. - Google Patents
Aparato para llenado de material fluido y metodo de llenado relacionado.Info
- Publication number
- MXPA02009975A MXPA02009975A MXPA02009975A MXPA02009975A MXPA02009975A MX PA02009975 A MXPA02009975 A MX PA02009975A MX PA02009975 A MXPA02009975 A MX PA02009975A MX PA02009975 A MXPA02009975 A MX PA02009975A MX PA02009975 A MXPA02009975 A MX PA02009975A
- Authority
- MX
- Mexico
- Prior art keywords
- via hole
- chamber
- paste
- fluid material
- conductive paste
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Abstract
Una bomba de vacio despresuriza una camara de eliminacion para descargar aire o gas que se encuentra en un orificio de interconexion. Despues, una camara de pasta que se proporciona adyacente a la camara de eliminacion se mueve sobre el orificio de interconexion eliminado. Una unidad de exprimido que se proporciona en la camara de pasta empuja una pasta conductora al interior del orificio de interconexion. Al mantener el espacio anterior del orificio de interconexion en una condicion despresurizada es eficaz para dejar que entre profundamente la pasta conductora al interior del orificio de interconexion. El espacio interior del orificio de interconexion se llena por completo con la pasta conductora.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001313120 | 2001-10-10 | ||
JP2002174069A JP3952872B2 (ja) | 2001-10-10 | 2002-06-14 | 流動状物質の充填装置および充填方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA02009975A true MXPA02009975A (es) | 2004-10-15 |
Family
ID=26623837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA02009975A MXPA02009975A (es) | 2001-10-10 | 2002-10-09 | Aparato para llenado de material fluido y metodo de llenado relacionado. |
Country Status (8)
Country | Link |
---|---|
US (1) | US6695020B2 (es) |
EP (1) | EP1303172B1 (es) |
JP (1) | JP3952872B2 (es) |
KR (1) | KR100498778B1 (es) |
CN (1) | CN1188020C (es) |
MX (1) | MXPA02009975A (es) |
SG (1) | SG107114A1 (es) |
TW (1) | TW551007B (es) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3900114B2 (ja) * | 2003-05-29 | 2007-04-04 | 株式会社デンソー | 流動状物質の充填方法および充填装置 |
FR2858255A1 (fr) * | 2003-07-30 | 2005-02-04 | Novatec | Procede de remplissage de zones situees en creux par entrainement de l'air et remplacement par du produit en mouvement |
FR2858253A1 (fr) * | 2003-07-30 | 2005-02-04 | Novatec | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circut imprime |
FR2858254B1 (fr) * | 2003-07-30 | 2007-10-05 | Novatec | Procede et dispositif de remplissage par un produit visqueux de zones situees en creux ou interpistes sur un circuit imprime, et equipement utilisant un tel dispositif |
US6858466B1 (en) * | 2003-11-03 | 2005-02-22 | Hewlett-Packard Development Company, L.P. | System and a method for fluid filling wafer level packages |
US7449067B2 (en) * | 2003-11-03 | 2008-11-11 | International Business Machines Corporation | Method and apparatus for filling vias |
JP2005317899A (ja) * | 2004-03-29 | 2005-11-10 | Denso Corp | 充填物質のレベリング方法およびレベリング装置 |
JP2006167991A (ja) * | 2004-12-13 | 2006-06-29 | Denso Corp | スクリーン印刷装置及びその印刷方法 |
JP5061534B2 (ja) * | 2006-08-29 | 2012-10-31 | 株式会社日立プラントテクノロジー | スクリーン印刷装置とその印刷方法 |
US9314864B2 (en) * | 2007-07-09 | 2016-04-19 | International Business Machines Corporation | C4NP compliant solder fill head seals |
CN101374390B (zh) * | 2007-08-24 | 2011-03-30 | 富葵精密组件(深圳)有限公司 | 用于电路板导电胶填充的导气板及导电胶填充方法 |
JP5034836B2 (ja) * | 2007-09-28 | 2012-09-26 | 東京応化工業株式会社 | 充填装置 |
KR100961656B1 (ko) | 2008-01-14 | 2010-06-09 | 주식회사 고려반도체시스템 | 기판에 솔더를 주입하는 중에 캐비티의 생성을 방지하는용융솔더 주입장치 및 그 주입 방법. |
US7980445B2 (en) * | 2008-01-23 | 2011-07-19 | International Business Machines Corporation | Fill head for full-field solder coverage with a rotatable member |
TWI433627B (zh) * | 2010-03-08 | 2014-04-01 | Denso Corp | A method for manufacturing a multilayer circuit board in which a conductive material is inserted through a through hole, a conductive material filling device for a through hole, and a method of using the same |
JP2013171862A (ja) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | 金属ペースト充填方法及び金属ペースト充填装置及びビアプラグ作製方法 |
JP6138026B2 (ja) | 2013-11-12 | 2017-05-31 | 日本メクトロン株式会社 | 導電ペーストの充填方法、および多層プリント配線板の製造方法 |
JP6201149B2 (ja) * | 2014-02-27 | 2017-09-27 | パナソニックIpマネジメント株式会社 | 部品実装ライン及び部品実装方法 |
WO2016002642A1 (ja) * | 2014-07-04 | 2016-01-07 | 日立造船株式会社 | 静電スクリーン印刷装置 |
CN104135830B (zh) * | 2014-08-08 | 2017-03-29 | 中国电子科技集团公司第二十九研究所 | 一种将金属浆料填入生瓷通孔的填充方法及装置 |
CN105034553B (zh) * | 2015-08-27 | 2018-03-27 | 昆山晟丰精密机械有限公司 | 一种树脂油墨真空塞孔印刷装置及其印刷方法 |
US20170266948A1 (en) * | 2016-03-16 | 2017-09-21 | Intel Corporation | Modular squeegee head apparatus for printing materials |
WO2020160545A1 (en) * | 2019-02-01 | 2020-08-06 | Averatek Corporation | Coating of nano-scaled cavities |
CN112188733A (zh) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | 一种真空塞孔方法 |
CN111559524B (zh) * | 2020-06-18 | 2021-04-20 | 彗晶新材料科技(杭州)有限公司 | 一种高导热膏状材料真空灌装方法、装置及系统 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3314434B2 (ja) * | 1993-02-09 | 2002-08-12 | 松下電器産業株式会社 | クリーム半田のスクリーン印刷方法 |
ITVR940050A1 (it) * | 1994-05-27 | 1995-11-27 | Sovema Srl | Macchina spalmatrice di griglie di piombo per la realizzazione di placche per accumulatori elettrici. |
JPH08108519A (ja) * | 1994-10-08 | 1996-04-30 | Sony Corp | 印刷用スキージ |
US6231333B1 (en) * | 1995-08-24 | 2001-05-15 | International Business Machines Corporation | Apparatus and method for vacuum injection molding |
US5813444A (en) * | 1996-12-26 | 1998-09-29 | Cashion; Donald P. | Apparatus and method for filling a plurality of containers with particulate matter |
JPH11186731A (ja) | 1997-12-22 | 1999-07-09 | Nippon Avionics Co Ltd | ブラインドビアホールの形成方法および多層プリント配線板の製造方法 |
JP2000133937A (ja) | 1998-10-26 | 2000-05-12 | Ibiden Co Ltd | 有底ビアホールの穴埋め方法 |
JP2001111221A (ja) | 1999-10-06 | 2001-04-20 | Ngk Spark Plug Co Ltd | ビアを有するセラミックグリーンシート及びそれを含むセラミック多層配線基板の製造方法 |
FR2803227B1 (fr) * | 2000-01-03 | 2002-02-08 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
FR2803228B1 (fr) * | 2000-01-03 | 2002-02-08 | Novatec Sa Soc | Dispositif de remplissage collectif de cavites borgnes |
US6506332B2 (en) * | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
-
2002
- 2002-06-14 JP JP2002174069A patent/JP3952872B2/ja not_active Expired - Fee Related
- 2002-09-23 EP EP02021126.4A patent/EP1303172B1/en not_active Expired - Fee Related
- 2002-09-25 SG SG200205836A patent/SG107114A1/en unknown
- 2002-09-27 TW TW091122379A patent/TW551007B/zh active
- 2002-10-09 US US10/267,714 patent/US6695020B2/en not_active Expired - Lifetime
- 2002-10-09 MX MXPA02009975A patent/MXPA02009975A/es active IP Right Grant
- 2002-10-10 CN CNB021475105A patent/CN1188020C/zh not_active Expired - Fee Related
- 2002-10-10 KR KR10-2002-0061682A patent/KR100498778B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6695020B2 (en) | 2004-02-24 |
JP3952872B2 (ja) | 2007-08-01 |
EP1303172A3 (en) | 2004-04-07 |
SG107114A1 (en) | 2004-11-29 |
KR20030030943A (ko) | 2003-04-18 |
EP1303172B1 (en) | 2015-07-08 |
JP2003182023A (ja) | 2003-07-03 |
EP1303172A2 (en) | 2003-04-16 |
KR100498778B1 (ko) | 2005-07-01 |
TW551007B (en) | 2003-09-01 |
CN1188020C (zh) | 2005-02-02 |
CN1411331A (zh) | 2003-04-16 |
US20030066572A1 (en) | 2003-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |