MXPA01008580A - Un paquete de circuito integrado de conexcion de microcircuito de colapso controlado (c4) que tiend dos materiales de subrelleno distintos. - Google Patents

Un paquete de circuito integrado de conexcion de microcircuito de colapso controlado (c4) que tiend dos materiales de subrelleno distintos.

Info

Publication number
MXPA01008580A
MXPA01008580A MXPA01008580A MXPA01008580A MXPA01008580A MX PA01008580 A MXPA01008580 A MX PA01008580A MX PA01008580 A MXPA01008580 A MX PA01008580A MX PA01008580 A MXPA01008580 A MX PA01008580A MX PA01008580 A MXPA01008580 A MX PA01008580A
Authority
MX
Mexico
Prior art keywords
sub
substrate
integrated circuit
filler material
package
Prior art date
Application number
MXPA01008580A
Other languages
English (en)
Spanish (es)
Inventor
Suresh Ramalingam
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of MXPA01008580A publication Critical patent/MXPA01008580A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
MXPA01008580A 1999-03-03 2000-02-08 Un paquete de circuito integrado de conexcion de microcircuito de colapso controlado (c4) que tiend dos materiales de subrelleno distintos. MXPA01008580A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/261,849 US20020014688A1 (en) 1999-03-03 1999-03-03 Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
PCT/US2000/003242 WO2000052756A1 (en) 1999-03-03 2000-02-08 A controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials

Publications (1)

Publication Number Publication Date
MXPA01008580A true MXPA01008580A (es) 2002-04-24

Family

ID=22995146

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA01008580A MXPA01008580A (es) 1999-03-03 2000-02-08 Un paquete de circuito integrado de conexcion de microcircuito de colapso controlado (c4) que tiend dos materiales de subrelleno distintos.

Country Status (7)

Country Link
US (2) US20020014688A1 (https=)
JP (1) JP2002538626A (https=)
KR (1) KR100522383B1 (https=)
CN (1) CN1191627C (https=)
AU (1) AU2986000A (https=)
MX (1) MXPA01008580A (https=)
WO (1) WO2000052756A1 (https=)

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CN110660752A (zh) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 半导体装置封装体及其制造方法
US11075133B2 (en) 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
US12171995B1 (en) 2021-10-07 2024-12-24 Paradromics, Inc. Methods for improved biocompatibility for human implanted medical devices
JP7594195B2 (ja) 2022-07-13 2024-12-04 日亜化学工業株式会社 発光装置の製造方法及び発光装置

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Also Published As

Publication number Publication date
WO2000052756A1 (en) 2000-09-08
CN1350702A (zh) 2002-05-22
CN1191627C (zh) 2005-03-02
KR100522383B1 (ko) 2005-10-19
KR20010108306A (ko) 2001-12-07
US20020014688A1 (en) 2002-02-07
US20020017728A1 (en) 2002-02-14
AU2986000A (en) 2000-09-21
JP2002538626A (ja) 2002-11-12
US7141448B2 (en) 2006-11-28

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Legal Events

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FG Grant or registration
MM Annulment or lapse due to non-payment of fees