KR100522383B1 - 두 가지 다른 하부 충전 재료를 갖는 붕괴 제어형 칩 접속(ｃ4) 집적회로 패키지의 제조 방법 - Google Patents

두 가지 다른 하부 충전 재료를 갖는 붕괴 제어형 칩 접속(ｃ4) 집적회로 패키지의 제조 방법 Download PDF

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Publication number
KR100522383B1
KR100522383B1 KR10-2001-7011227A KR20017011227A KR100522383B1 KR 100522383 B1 KR100522383 B1 KR 100522383B1 KR 20017011227 A KR20017011227 A KR 20017011227A KR 100522383 B1 KR100522383 B1 KR 100522383B1
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KR
South Korea
Prior art keywords
fill material
integrated circuit
substrate
package
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR10-2001-7011227A
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English (en)
Korean (ko)
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KR20010108306A (ko
Inventor
라말링감수레쉬
머랠리벤카테산
쿠크듀언
Original Assignee
인텔 코오퍼레이션
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Publication date
Application filed by 인텔 코오퍼레이션 filed Critical 인텔 코오퍼레이션
Publication of KR20010108306A publication Critical patent/KR20010108306A/ko
Application granted granted Critical
Publication of KR100522383B1 publication Critical patent/KR100522383B1/ko
Assigned to 마이크론 테크놀로지, 인크. reassignment 마이크론 테크놀로지, 인크. 권리의 전부이전등록 Assignors: 뉴모닉스 비.브이. 액팅 쓰루 잇츠 스위스 브랜치
Assigned to 뉴모닉스 비.브이. 액팅 쓰루 잇츠 스위스 브랜치 reassignment 뉴모닉스 비.브이. 액팅 쓰루 잇츠 스위스 브랜치 권리의 전부이전등록 Assignors: 인텔 코오퍼레이션
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR10-2001-7011227A 1999-03-03 2000-02-08 두 가지 다른 하부 충전 재료를 갖는 붕괴 제어형 칩 접속(ｃ4) 집적회로 패키지의 제조 방법 Expired - Lifetime KR100522383B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/261,849 1999-03-03
US09/261,849 US20020014688A1 (en) 1999-03-03 1999-03-03 Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR10-2005-7001212A Division KR100498675B1 (ko) 1999-03-03 2000-02-08 두 가지 다른 하부 충전 재료를 갖는 붕괴 제어형 칩접속(ｃ4) 집적회로 패키지

Publications (2)

Publication Number Publication Date
KR20010108306A KR20010108306A (ko) 2001-12-07
KR100522383B1 true KR100522383B1 (ko) 2005-10-19

Family

ID=22995146

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2001-7011227A Expired - Lifetime KR100522383B1 (ko) 1999-03-03 2000-02-08 두 가지 다른 하부 충전 재료를 갖는 붕괴 제어형 칩 접속(ｃ4) 집적회로 패키지의 제조 방법

Country Status (7)

Country Link
US (2) US20020014688A1 (https=)
JP (1) JP2002538626A (https=)
KR (1) KR100522383B1 (https=)
CN (1) CN1191627C (https=)
AU (1) AU2986000A (https=)
MX (1) MXPA01008580A (https=)
WO (1) WO2000052756A1 (https=)

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US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US20090279275A1 (en) * 2008-05-09 2009-11-12 Stephen Peter Ayotte Method of attaching an integrated circuit chip to a module
CN102105971B (zh) * 2009-04-24 2013-05-22 松下电器产业株式会社 半导体封装元器件的安装方法和安装结构体
US8686749B2 (en) * 2010-04-30 2014-04-01 International Business Machines Corporation Thermal interface material, test structure and method of use
JP2012049175A (ja) * 2010-08-24 2012-03-08 Toshiba Corp 半導体装置の製造方法
KR20120040536A (ko) 2010-10-19 2012-04-27 삼성전자주식회사 반도체 패키지 및 그 제조 방법
US9559064B2 (en) * 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
US9373559B2 (en) * 2014-03-05 2016-06-21 International Business Machines Corporation Low-stress dual underfill packaging
US9524956B2 (en) 2014-10-31 2016-12-20 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure and method
WO2017180482A1 (en) * 2016-04-11 2017-10-19 Paradromics, Inc. Neural-interface probe and methods of packaging the same
WO2018183967A1 (en) 2017-03-30 2018-10-04 Paradromics, Inc. Patterned microwire bundles and methods of producing the same
EP3682471B1 (en) * 2017-09-15 2023-11-08 Cryptography Research, Inc. Packaging techniques for backside mesh connectivity
CN110660752A (zh) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 半导体装置封装体及其制造方法
US11075133B2 (en) 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
US12171995B1 (en) 2021-10-07 2024-12-24 Paradromics, Inc. Methods for improved biocompatibility for human implanted medical devices
JP7594195B2 (ja) 2022-07-13 2024-12-04 日亜化学工業株式会社 発光装置の製造方法及び発光装置

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Also Published As

Publication number Publication date
WO2000052756A1 (en) 2000-09-08
CN1350702A (zh) 2002-05-22
CN1191627C (zh) 2005-03-02
KR20010108306A (ko) 2001-12-07
MXPA01008580A (es) 2002-04-24
US20020014688A1 (en) 2002-02-07
US20020017728A1 (en) 2002-02-14
AU2986000A (en) 2000-09-21
JP2002538626A (ja) 2002-11-12
US7141448B2 (en) 2006-11-28

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