CN1191627C - 具有二种不同的底层填充材料的可控崩塌芯片连接(c4)集成电路封装件 - Google Patents

具有二种不同的底层填充材料的可控崩塌芯片连接(c4)集成电路封装件 Download PDF

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Publication number
CN1191627C
CN1191627C CNB00804578XA CN00804578A CN1191627C CN 1191627 C CN1191627 C CN 1191627C CN B00804578X A CNB00804578X A CN B00804578XA CN 00804578 A CN00804578 A CN 00804578A CN 1191627 C CN1191627 C CN 1191627C
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CN
China
Prior art keywords
substrate
underfill material
integrated circuit
package
underfill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB00804578XA
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English (en)
Chinese (zh)
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CN1350702A (zh
Inventor
S·拉马林加姆
V·穆拉里
D·库克
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Intel Corp
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Intel Corp
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Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of CN1350702A publication Critical patent/CN1350702A/zh
Application granted granted Critical
Publication of CN1191627C publication Critical patent/CN1191627C/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB00804578XA 1999-03-03 2000-02-08 具有二种不同的底层填充材料的可控崩塌芯片连接(c4)集成电路封装件 Expired - Fee Related CN1191627C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/261,849 1999-03-03
US09/261849 1999-03-03
US09/261,849 US20020014688A1 (en) 1999-03-03 1999-03-03 Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials

Publications (2)

Publication Number Publication Date
CN1350702A CN1350702A (zh) 2002-05-22
CN1191627C true CN1191627C (zh) 2005-03-02

Family

ID=22995146

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB00804578XA Expired - Fee Related CN1191627C (zh) 1999-03-03 2000-02-08 具有二种不同的底层填充材料的可控崩塌芯片连接(c4)集成电路封装件

Country Status (7)

Country Link
US (2) US20020014688A1 (https=)
JP (1) JP2002538626A (https=)
KR (1) KR100522383B1 (https=)
CN (1) CN1191627C (https=)
AU (1) AU2986000A (https=)
MX (1) MXPA01008580A (https=)
WO (1) WO2000052756A1 (https=)

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CN110660752A (zh) * 2018-06-29 2020-01-07 台湾积体电路制造股份有限公司 半导体装置封装体及其制造方法
US11075133B2 (en) 2018-06-29 2021-07-27 Taiwan Semiconductor Manufacturing Company, Ltd. Underfill structure for semiconductor packages and methods of forming the same
US12171995B1 (en) 2021-10-07 2024-12-24 Paradromics, Inc. Methods for improved biocompatibility for human implanted medical devices
JP7594195B2 (ja) 2022-07-13 2024-12-04 日亜化学工業株式会社 発光装置の製造方法及び発光装置

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Also Published As

Publication number Publication date
WO2000052756A1 (en) 2000-09-08
CN1350702A (zh) 2002-05-22
KR100522383B1 (ko) 2005-10-19
KR20010108306A (ko) 2001-12-07
MXPA01008580A (es) 2002-04-24
US20020014688A1 (en) 2002-02-07
US20020017728A1 (en) 2002-02-14
AU2986000A (en) 2000-09-21
JP2002538626A (ja) 2002-11-12
US7141448B2 (en) 2006-11-28

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