MX9207572A - Composicion de capa protectora positiva. - Google Patents

Composicion de capa protectora positiva.

Info

Publication number
MX9207572A
MX9207572A MX9207572A MX9207572A MX9207572A MX 9207572 A MX9207572 A MX 9207572A MX 9207572 A MX9207572 A MX 9207572A MX 9207572 A MX9207572 A MX 9207572A MX 9207572 A MX9207572 A MX 9207572A
Authority
MX
Mexico
Prior art keywords
composition
protective layer
positive protective
compound
resin
Prior art date
Application number
MX9207572A
Other languages
English (en)
Inventor
Kazuhiko Hashimoto
Haruyoshi Osaki
Chinehito Ebina
Kyoko Nagase
Hiroshi Moriuma
Yasunori Uetani
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of MX9207572A publication Critical patent/MX9207572A/es

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/24—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups C08G8/10 - C08G8/20

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

Se describe una composición de capa protectora positiva que contiene un compuesto de diazida de quinona y una resina soluble en álcali la cual contiene una resina (A) obtenida mediante una reacción de condensación de un compuesto aldehído, por lo menos un compuesto fenol de la fórmula (I), la cual composición es excelente en la compensación entre varias propiedades, como un perfil, una sensibilidad, resistencia térmica y una profundidad de foco.
MX9207572A 1991-12-27 1992-12-24 Composicion de capa protectora positiva. MX9207572A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34669391A JP3182823B2 (ja) 1991-12-27 1991-12-27 ポジ型レジスト組成物

Publications (1)

Publication Number Publication Date
MX9207572A true MX9207572A (es) 1993-06-30

Family

ID=18385180

Family Applications (1)

Application Number Title Priority Date Filing Date
MX9207572A MX9207572A (es) 1991-12-27 1992-12-24 Composicion de capa protectora positiva.

Country Status (8)

Country Link
US (1) US5468590A (es)
EP (1) EP0550009B1 (es)
JP (1) JP3182823B2 (es)
KR (1) KR100247843B1 (es)
CA (1) CA2085962A1 (es)
DE (1) DE69229332T2 (es)
MX (1) MX9207572A (es)
TW (1) TW263568B (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3319092B2 (ja) * 1993-11-08 2002-08-26 住友化学工業株式会社 ポジ型レジスト組成物
EP0660186A1 (en) * 1993-12-20 1995-06-28 Mitsubishi Chemical Corporation Photosensitive resin composition and method for forming a pattern using the composition
JP3424341B2 (ja) * 1994-04-11 2003-07-07 住友化学工業株式会社 感光性樹脂組成物
JP3230925B2 (ja) * 1994-04-12 2001-11-19 富士写真フイルム株式会社 ポジ型フオトレジスト組成物
TW332264B (en) * 1994-09-07 1998-05-21 Mitsubishi Chem Corp Photosensitive resin composition and method for forming a photoresist pattern
DE69519781T2 (de) * 1994-10-05 2001-06-07 Arakawa Chemical Industries, Ltd. Strahlungsempfindliche Harzzusammensetzung
JP3427562B2 (ja) * 1995-05-09 2003-07-22 住友化学工業株式会社 ポジ型レジスト組成物
US5709977A (en) * 1995-07-13 1998-01-20 Fuji Photo Film Co., Ltd. Positive working photoresist composition
JP3076523B2 (ja) * 1996-03-25 2000-08-14 東京応化工業株式会社 ポジ型ホトレジスト組成物
JP3057010B2 (ja) * 1996-08-29 2000-06-26 東京応化工業株式会社 ポジ型レジスト組成物及びレジストパターンの形成方法
US6040107A (en) * 1998-02-06 2000-03-21 Olin Microelectronic Chemicals, Inc. Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures
JP2002189294A (ja) * 2000-12-21 2002-07-05 Mitsubishi Chemicals Corp ポジ型画像形成材料
CA2444785C (en) * 2003-10-28 2005-02-15 Centennial 2000 Inc. Prime rib meat product and process of manufacture
KR101737798B1 (ko) * 2010-03-24 2017-05-30 삼성디스플레이 주식회사 포토레지스트 조성물 및 이를 이용한 패턴의 형성 방법
US8822123B2 (en) 2012-07-13 2014-09-02 Momentive Specialty Chemicals Inc. Polymeric materials and methods for making the polymeric materials
CN106068292B (zh) * 2014-03-20 2019-02-05 Dic株式会社 酚醛清漆型含酚羟基树脂、其制造方法、固化性组合物、保护剂用组合物及彩色光阻剂
US10047186B2 (en) * 2014-11-25 2018-08-14 Dic Corporation Novolac phenol resin, manufacturing method therefor, photosensitive composition, resist material and coating film
TWI668252B (zh) * 2014-12-02 2019-08-11 日商迪愛生股份有限公司 Resist agent underlayer film forming composition and resist underlayer film
KR102559230B1 (ko) * 2015-05-20 2023-07-25 디아이씨 가부시끼가이샤 노볼락형 페놀성 수산기 함유 수지 및 레지스트막
JP7176844B2 (ja) * 2015-10-19 2022-11-22 日産化学株式会社 長鎖アルキル基含有ノボラックを含むレジスト下層膜形成組成物
JP6940834B2 (ja) * 2019-01-21 2021-09-29 Dic株式会社 フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61141441A (ja) * 1984-12-14 1986-06-28 Tokyo Ohka Kogyo Co Ltd ポジ型ホトレジスト組成物
US4920028A (en) * 1988-03-31 1990-04-24 Morton Thiokol, Inc. High contrast high thermal stability positive photoresists with mixed cresol and hydroxybenzaldehyde prepared novolak and photosensitive diazoquinone
US5177172A (en) * 1988-05-31 1993-01-05 Ocg Microelectronic Materials, Inc. Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions
JPH063544B2 (ja) * 1988-07-07 1994-01-12 住友化学工業株式会社 ポジ型感放射線性レジスト組成物
CA2023791A1 (en) * 1989-08-24 1991-02-25 Ayako Ida Radiation-sensitive positive resist composition
JP3063148B2 (ja) * 1989-12-27 2000-07-12 住友化学工業株式会社 ポジ型レジスト組成物

Also Published As

Publication number Publication date
CA2085962A1 (en) 1993-06-28
JP3182823B2 (ja) 2001-07-03
TW263568B (es) 1995-11-21
EP0550009A1 (en) 1993-07-07
US5468590A (en) 1995-11-21
KR100247843B1 (ko) 2000-06-01
DE69229332T2 (de) 2000-03-02
EP0550009B1 (en) 1999-06-02
DE69229332D1 (de) 1999-07-08
JPH05181270A (ja) 1993-07-23
KR930013869A (ko) 1993-07-22

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Legal Events

Date Code Title Description
FG Grant or registration
MM Annulment or lapse due to non-payment of fees