TW263568B - - Google Patents
Info
- Publication number
- TW263568B TW263568B TW081110156A TW81110156A TW263568B TW 263568 B TW263568 B TW 263568B TW 081110156 A TW081110156 A TW 081110156A TW 81110156 A TW81110156 A TW 81110156A TW 263568 B TW263568 B TW 263568B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/24—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups C08G8/10 - C08G8/20
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34669391A JP3182823B2 (ja) | 1991-12-27 | 1991-12-27 | ポジ型レジスト組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW263568B true TW263568B (zh) | 1995-11-21 |
Family
ID=18385180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081110156A TW263568B (zh) | 1991-12-27 | 1992-12-18 |
Country Status (8)
Country | Link |
---|---|
US (1) | US5468590A (zh) |
EP (1) | EP0550009B1 (zh) |
JP (1) | JP3182823B2 (zh) |
KR (1) | KR100247843B1 (zh) |
CA (1) | CA2085962A1 (zh) |
DE (1) | DE69229332T2 (zh) |
MX (1) | MX9207572A (zh) |
TW (1) | TW263568B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686428B (zh) * | 2015-05-20 | 2020-03-01 | 日商迪愛生股份有限公司 | 酚醛清漆型之含酚性羥基之樹脂及抗蝕劑膜 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3319092B2 (ja) * | 1993-11-08 | 2002-08-26 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
EP0660186A1 (en) * | 1993-12-20 | 1995-06-28 | Mitsubishi Chemical Corporation | Photosensitive resin composition and method for forming a pattern using the composition |
JP3424341B2 (ja) * | 1994-04-11 | 2003-07-07 | 住友化学工業株式会社 | 感光性樹脂組成物 |
JP3230925B2 (ja) * | 1994-04-12 | 2001-11-19 | 富士写真フイルム株式会社 | ポジ型フオトレジスト組成物 |
TW332264B (en) * | 1994-09-07 | 1998-05-21 | Mitsubishi Chem Corp | Photosensitive resin composition and method for forming a photoresist pattern |
DE69519781T2 (de) * | 1994-10-05 | 2001-06-07 | Arakawa Chemical Industries, Ltd. | Strahlungsempfindliche Harzzusammensetzung |
JP3427562B2 (ja) * | 1995-05-09 | 2003-07-22 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
US5709977A (en) * | 1995-07-13 | 1998-01-20 | Fuji Photo Film Co., Ltd. | Positive working photoresist composition |
JP3076523B2 (ja) * | 1996-03-25 | 2000-08-14 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物 |
JP3057010B2 (ja) * | 1996-08-29 | 2000-06-26 | 東京応化工業株式会社 | ポジ型レジスト組成物及びレジストパターンの形成方法 |
US6040107A (en) * | 1998-02-06 | 2000-03-21 | Olin Microelectronic Chemicals, Inc. | Photosensitive diazonaphthoquinone esters based on selected cyclic alkyl ether-containing phenolics and their use in radiation sensitive mixtures |
JP2002189294A (ja) * | 2000-12-21 | 2002-07-05 | Mitsubishi Chemicals Corp | ポジ型画像形成材料 |
CA2444785C (en) * | 2003-10-28 | 2005-02-15 | Centennial 2000 Inc. | Prime rib meat product and process of manufacture |
KR101737798B1 (ko) * | 2010-03-24 | 2017-05-30 | 삼성디스플레이 주식회사 | 포토레지스트 조성물 및 이를 이용한 패턴의 형성 방법 |
US8822123B2 (en) | 2012-07-13 | 2014-09-02 | Momentive Specialty Chemicals Inc. | Polymeric materials and methods for making the polymeric materials |
WO2015141427A1 (ja) * | 2014-03-20 | 2015-09-24 | Dic株式会社 | ノボラック型フェノール性水酸基含有樹脂、その製造方法、硬化性組成物、レジスト用組成物及びカラーレジスト |
US10047186B2 (en) * | 2014-11-25 | 2018-08-14 | Dic Corporation | Novolac phenol resin, manufacturing method therefor, photosensitive composition, resist material and coating film |
TWI668252B (zh) * | 2014-12-02 | 2019-08-11 | 日商迪愛生股份有限公司 | Resist agent underlayer film forming composition and resist underlayer film |
CN108139674B (zh) * | 2015-10-19 | 2021-09-28 | 日产化学工业株式会社 | 含有含长链烷基的酚醛清漆的抗蚀剂下层膜形成用组合物 |
JP6940834B2 (ja) * | 2019-01-21 | 2021-09-29 | Dic株式会社 | フェノール性水酸基含有樹脂、感光性組成物、レジスト膜、硬化性組成物及び硬化物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61141441A (ja) * | 1984-12-14 | 1986-06-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジスト組成物 |
US4920028A (en) * | 1988-03-31 | 1990-04-24 | Morton Thiokol, Inc. | High contrast high thermal stability positive photoresists with mixed cresol and hydroxybenzaldehyde prepared novolak and photosensitive diazoquinone |
US5177172A (en) * | 1988-05-31 | 1993-01-05 | Ocg Microelectronic Materials, Inc. | Selected methylol-substituted trihydroxybenzophenones and their use in phenolic resin compositions |
EP0358871B1 (en) * | 1988-07-07 | 1998-09-30 | Sumitomo Chemical Company, Limited | Radiation-sensitive positive resist composition |
CA2023791A1 (en) * | 1989-08-24 | 1991-02-25 | Ayako Ida | Radiation-sensitive positive resist composition |
JP3063148B2 (ja) * | 1989-12-27 | 2000-07-12 | 住友化学工業株式会社 | ポジ型レジスト組成物 |
-
1991
- 1991-12-27 JP JP34669391A patent/JP3182823B2/ja not_active Expired - Lifetime
-
1992
- 1992-12-18 TW TW081110156A patent/TW263568B/zh not_active IP Right Cessation
- 1992-12-21 CA CA002085962A patent/CA2085962A1/en not_active Abandoned
- 1992-12-22 KR KR1019920025116A patent/KR100247843B1/ko not_active IP Right Cessation
- 1992-12-23 DE DE69229332T patent/DE69229332T2/de not_active Expired - Fee Related
- 1992-12-23 EP EP92121878A patent/EP0550009B1/en not_active Expired - Lifetime
- 1992-12-24 MX MX9207572A patent/MX9207572A/es not_active IP Right Cessation
-
1994
- 1994-11-29 US US08/348,994 patent/US5468590A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI686428B (zh) * | 2015-05-20 | 2020-03-01 | 日商迪愛生股份有限公司 | 酚醛清漆型之含酚性羥基之樹脂及抗蝕劑膜 |
Also Published As
Publication number | Publication date |
---|---|
US5468590A (en) | 1995-11-21 |
JP3182823B2 (ja) | 2001-07-03 |
DE69229332T2 (de) | 2000-03-02 |
EP0550009A1 (en) | 1993-07-07 |
KR930013869A (ko) | 1993-07-22 |
MX9207572A (es) | 1993-06-30 |
KR100247843B1 (ko) | 2000-06-01 |
EP0550009B1 (en) | 1999-06-02 |
JPH05181270A (ja) | 1993-07-23 |
CA2085962A1 (en) | 1993-06-28 |
DE69229332D1 (de) | 1999-07-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |