MX2009004793A - Fundente para suelda libre de plomo, y metodo de soldeo. - Google Patents
Fundente para suelda libre de plomo, y metodo de soldeo.Info
- Publication number
- MX2009004793A MX2009004793A MX2009004793A MX2009004793A MX2009004793A MX 2009004793 A MX2009004793 A MX 2009004793A MX 2009004793 A MX2009004793 A MX 2009004793A MX 2009004793 A MX2009004793 A MX 2009004793A MX 2009004793 A MX2009004793 A MX 2009004793A
- Authority
- MX
- Mexico
- Prior art keywords
- flux
- soldering
- lead
- free solder
- development
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
Se describe un fundente para soldeo que puede prevenir el desarrollo de fibras de óxido metálico que está apto para ocurrir cuando partes electrónicas son soldadas a una tarjeta de circuito impreso con una suelda libre de plomo, por ejemplo, Sn-3.0Ag-0.5Cu, que tiene un mayor contenido de estaño y un mayor punto de fusión que las sueldas eutécticas; el fundente es adecuado para su uso como un post-fundente tipo sin limpieza en soldadura por ola; el fundente contiene por lo menos un compuesto seleccionado entre ésteres de ácido fosfórico y derivados de los mismos en una cantidad de 0.2 a 4% en masa, además de una colofonia como una resina que es el ingrediente principal, y un activador; mediante la realización del soldeo en una atmósfera de nitrógeno, el desarrollo de fibras de óxido metálico se previene más efectivamente.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006335173 | 2006-12-12 | ||
PCT/JP2007/073926 WO2008072654A1 (ja) | 2006-12-12 | 2007-12-12 | 鉛フリーはんだ用フラックスとはんだ付け方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX2009004793A true MX2009004793A (es) | 2009-05-21 |
Family
ID=39511671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX2009004793A MX2009004793A (es) | 2006-12-12 | 2007-12-12 | Fundente para suelda libre de plomo, y metodo de soldeo. |
Country Status (10)
Country | Link |
---|---|
US (1) | US9073154B2 (es) |
EP (1) | EP2100690B1 (es) |
JP (1) | JP4325746B2 (es) |
KR (1) | KR101163427B1 (es) |
CN (1) | CN101557903B (es) |
BR (1) | BRPI0718265B1 (es) |
ES (1) | ES2614238T3 (es) |
HU (1) | HUE031395T2 (es) |
MX (1) | MX2009004793A (es) |
WO (1) | WO2008072654A1 (es) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0507887D0 (en) * | 2005-04-20 | 2005-05-25 | Rohm & Haas Elect Mat | Immersion method |
JP4554713B2 (ja) * | 2009-01-27 | 2010-09-29 | 株式会社日本フィラーメタルズ | 無鉛はんだ合金及び該はんだ合金を含む耐疲労性はんだ接合材並びに該接合材を使用した接合体 |
JP2011143445A (ja) * | 2010-01-14 | 2011-07-28 | Senju Metal Ind Co Ltd | フラックス,はんだ及び基板 |
CN105945454B (zh) * | 2011-03-02 | 2018-09-25 | 千住金属工业株式会社 | 焊膏用助焊剂 |
JP5093373B2 (ja) * | 2011-03-08 | 2012-12-12 | 住友金属鉱山株式会社 | Pbフリーはんだペースト |
WO2012127642A1 (ja) * | 2011-03-23 | 2012-09-27 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
JP5594431B2 (ja) * | 2011-06-06 | 2014-09-24 | 千住金属工業株式会社 | 無洗浄型ソルダペースト用フラックス |
US9950393B2 (en) * | 2011-12-23 | 2018-04-24 | Intel Corporation | Hybrid low metal loading flux |
AP3940A (en) | 2012-02-02 | 2016-12-16 | Becton Dickinson Holdings Pte Ltd | Adaptor for coupling with a medical container |
CN102581522A (zh) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | 一种ZnSn系无铅钎料用松香基助焊剂及制备方法 |
JP5435186B1 (ja) * | 2012-06-11 | 2014-03-05 | 千住金属工業株式会社 | フラックス組成物、液状フラックス、やに入りはんだ及びソルダペースト |
CN102728967B (zh) * | 2012-07-19 | 2014-12-31 | 华南理工大学 | 一种镀镍层合金软钎焊焊锡丝芯用助焊剂及其制备方法 |
CN103350291A (zh) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | 一种助焊剂 |
CN103706966B (zh) * | 2013-12-11 | 2017-01-25 | 河南超威电源有限公司 | 铅酸蓄电池的汇流排的助焊剂 |
CN104384753A (zh) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | 一种环保型电路板焊接剂 |
CN105127616A (zh) * | 2015-09-28 | 2015-12-09 | 苏州龙腾万里化工科技有限公司 | 一种免洗助焊剂 |
JP6864189B2 (ja) * | 2016-02-05 | 2021-04-28 | 株式会社弘輝 | フラックス及びはんだ組成物 |
JP6370324B2 (ja) * | 2016-03-04 | 2018-08-08 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
CN105710556B (zh) * | 2016-04-08 | 2017-11-28 | 深圳市博士达焊锡制品有限公司 | 一种焊接用锡膏及其制备方法 |
JP2018098302A (ja) * | 2016-12-09 | 2018-06-21 | 株式会社デンソー | 電子装置 |
CN106684122B (zh) * | 2017-01-20 | 2020-04-24 | 京东方科技集团股份有限公司 | 导电层、薄膜晶体管及其制作方法、阵列基板和显示装置 |
JP6274344B1 (ja) * | 2017-05-25 | 2018-02-07 | 千住金属工業株式会社 | フラックス |
JP7150232B2 (ja) * | 2017-07-03 | 2022-10-11 | 株式会社弘輝 | フラックス、やに入りはんだ及びソルダペースト |
JP6583391B2 (ja) * | 2017-11-14 | 2019-10-02 | 千住金属工業株式会社 | フラックス、やに入りはんだおよびフラックスコートペレット |
JP6322881B1 (ja) | 2017-12-21 | 2018-05-16 | 千住金属工業株式会社 | フラックス及びフラックス用樹脂組成物 |
CN110202293B (zh) * | 2019-05-19 | 2021-05-11 | 深圳市可为锡业有限公司 | 一种高性能无卤无铅焊锡膏及其制备方法 |
CN114980559B (zh) * | 2022-05-27 | 2024-05-14 | 中国电子科技集团公司第二十研究所 | 一种挠性镍铬合金印制线路板的焊接方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2740193A (en) * | 1953-07-01 | 1956-04-03 | Rca Corp | Method of soldering printed circuits |
US4196024A (en) * | 1978-11-02 | 1980-04-01 | E. I. Du Pont De Nemours And Company | Alkyl phosphate soldering fluxes |
JPS61242790A (ja) | 1985-04-19 | 1986-10-29 | Asahi Kagaku Kenkyusho:Kk | 半田付け用フラツクス |
JPS6390390A (ja) | 1986-09-30 | 1988-04-21 | Asahi Chem Res Lab Ltd | 半田付け用フラツクス |
JPS63115693A (ja) | 1986-11-04 | 1988-05-20 | Asahi Chem Res Lab Ltd | クリ−ムはんだ |
JPH05212584A (ja) | 1992-01-31 | 1993-08-24 | Senju Metal Ind Co Ltd | ソルダーペースト |
JPH0788687A (ja) * | 1993-09-27 | 1995-04-04 | Tamura Kaken Kk | はんだ付用フラックス |
JPH1043882A (ja) * | 1996-08-05 | 1998-02-17 | Hitachi Ltd | はんだペースト |
US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
US20020046627A1 (en) | 1998-06-10 | 2002-04-25 | Hitoshi Amita | Solder powder, flux, solder paste, soldering method, soldered circuit board, and soldered joint product |
BRPI0017633B1 (pt) * | 1999-12-03 | 2016-10-04 | Fry S Metals Inc D B A Alpha Metals Inc | processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso |
EP1348513B1 (en) | 2000-11-29 | 2008-07-09 | Senju Metal Industry Co., Ltd. | Solder pastes |
TWI228132B (en) | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
JP2003225795A (ja) * | 2002-01-30 | 2003-08-12 | Showa Denko Kk | ハンダ付け用フラックスおよびハンダペースト |
CN100339446C (zh) * | 2002-04-15 | 2007-09-26 | 日本瑞翁株式会社 | 清漆、成型物、电绝缘膜、层压物、阻燃剂淤浆以及阻燃剂粒子和清漆的制造方法 |
US20030221748A1 (en) * | 2002-05-30 | 2003-12-04 | Fry's Metals, Inc. | Solder paste flux system |
JP4215235B2 (ja) * | 2002-10-18 | 2009-01-28 | 日鉱金属株式会社 | Sn合金に対する表面処理剤及び表面処理方法 |
JP4094982B2 (ja) * | 2003-04-15 | 2008-06-04 | ハリマ化成株式会社 | はんだ析出方法およびはんだバンプ形成方法 |
JP2006181635A (ja) | 2004-12-28 | 2006-07-13 | Senju Metal Ind Co Ltd | 鉛フリーはんだの黒化防止方法およびソルダペースト |
JP5212584B2 (ja) | 2005-11-22 | 2013-06-19 | 富士ゼロックス株式会社 | 像形成ユニット及び画像形成装置 |
WO2007086433A1 (ja) | 2006-01-26 | 2007-08-02 | Toeikasei Co., Ltd. | 水分散型フラックス組成物、電子部品付き電子回路基板、およびそれらの製造方法 |
-
2007
- 2007-12-12 WO PCT/JP2007/073926 patent/WO2008072654A1/ja active Application Filing
- 2007-12-12 BR BRPI0718265-1A patent/BRPI0718265B1/pt active IP Right Grant
- 2007-12-12 EP EP07850477.6A patent/EP2100690B1/en active Active
- 2007-12-12 US US12/311,976 patent/US9073154B2/en active Active
- 2007-12-12 ES ES07850477.6T patent/ES2614238T3/es active Active
- 2007-12-12 JP JP2008549330A patent/JP4325746B2/ja active Active
- 2007-12-12 HU HUE07850477A patent/HUE031395T2/en unknown
- 2007-12-12 CN CN200780040648XA patent/CN101557903B/zh active Active
- 2007-12-12 MX MX2009004793A patent/MX2009004793A/es active IP Right Grant
- 2007-12-12 KR KR1020097008829A patent/KR101163427B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP2100690A1 (en) | 2009-09-16 |
BRPI0718265B1 (pt) | 2015-04-14 |
ES2614238T3 (es) | 2017-05-30 |
JP4325746B2 (ja) | 2009-09-02 |
BRPI0718265A2 (pt) | 2014-03-04 |
WO2008072654A1 (ja) | 2008-06-19 |
JPWO2008072654A1 (ja) | 2010-04-02 |
HUE031395T2 (en) | 2017-07-28 |
KR20090088359A (ko) | 2009-08-19 |
US20090308496A1 (en) | 2009-12-17 |
KR101163427B1 (ko) | 2012-07-13 |
CN101557903A (zh) | 2009-10-14 |
EP2100690A4 (en) | 2012-07-18 |
CN101557903B (zh) | 2013-06-19 |
US9073154B2 (en) | 2015-07-07 |
EP2100690B1 (en) | 2016-11-16 |
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Legal Events
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FG | Grant or registration |