WO2008072654A1 - 鉛フリーはんだ用フラックスとはんだ付け方法 - Google Patents
鉛フリーはんだ用フラックスとはんだ付け方法 Download PDFInfo
- Publication number
- WO2008072654A1 WO2008072654A1 PCT/JP2007/073926 JP2007073926W WO2008072654A1 WO 2008072654 A1 WO2008072654 A1 WO 2008072654A1 JP 2007073926 W JP2007073926 W JP 2007073926W WO 2008072654 A1 WO2008072654 A1 WO 2008072654A1
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- WIPO (PCT)
- Prior art keywords
- soldering
- flux
- solder
- resin
- acidic
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Definitions
- the present invention relates to a soldering flux suitable as a post flux used when soldering by a flow soldering method using lead-free solder after mounting an electronic component on a printed circuit board.
- the flux of the present invention does not require cleaning of the flux residue after soldering, is a non-cleaning type, has a high tin content, and has a problem in soldering with a lead-free solder that is a tin-based alloy. Can prevent whisker generation
- Fixing and electrical connection of electronic components in electronic equipment, such as mounting of electronic components on a printed circuit board, is generally performed by soldering, which is most advantageous in terms of cost and reliability.
- soldering The methods generally used for this type of soldering include the flow soldering method in which a printed circuit board and electronic components are brought into contact with molten solder, and the form of solder paste, solder preform or solder ball. This is a reflow soldering method in which solder is remelted in a reflow furnace.
- Flux performs many useful functions including (1) to (3) below:
- Anti-reoxidation action Covers clean metal surface during soldering to block contact with oxygen and prevents re-oxidation of the metal surface by heating.
- the flux is an inorganic flux using a metal salt or an inorganic acid, polyethylene glycol It is roughly classified into water-soluble fluxes using water-soluble main ingredients such as ru and resin-based fluxes mainly containing resins such as rosin.
- the resin-based flux contains at least one active agent selected from organic acids, prominent salts of amines, halogen salts of amines, and the like. Therefore, it contains a solvent as needed.
- resins such as rosin contained as the main agent have insulating properties. After soldering by heating, the force that leaves a flux residue consisting mainly of the resin of the main agent remains. This flux residue does not corrode well at the normal temperature and covers the soldered part. Protect. Therefore, resin-based flux can be used without washing.
- JP-A-5-212584 discloses an acidic phosphate ester composed of a mixture of a solder paste composed of a flux and a powder solder in an amount of 5 to 40 parts by mass with respect to 100 parts by mass of the flux.
- a blended solder paste has been proposed. This solder paste is of a type in which the flux residue after soldering is washed with an organic solvent. Also, powder solder is not lead-free solder.
- Japanese Patent Laid-Open No. 2006-181635 discloses that a solder paste in which lead-free solder powder and a flux containing an organic halide are mixed contains an organic phosphorus compound in the flux, resulting from the organic halide. It has been disclosed to prevent blackening of soldered parts! Presented as an organophosphorus compound! /, Ruphosphate is a neutral phosphate such as trialkyl or aryl phosphite.
- Lead-free solder is generally a Sn-based alloy containing Sn as a main component.
- Presently proposed lead-free solders include Sn-Ag-Cu, Sn-Cu, Sn-Ag, Sn-Bi, and Sn-Zn. Except for Sn-Bi, which has a very low melting point of 150 ° C or less, most of these lead-free solders have a high Sn content of over 90% by mass.
- Sn—Ag—Cu-based lead-free solder means a Sn—Ag—Cu ternary alloy and an alloy obtained by adding a small amount of an additive element to this ternary alloy. It means to include. The same applies to other alloy “based” lead-free solders.
- soldering temperature is nearly 40 ° C higher than eutectic solder.
- Patent Document 1 JP-A-5-212584
- Patent Document 2 Japanese Unexamined Patent Publication No. 2006-181635
- the cause of the Sn-weiss force is the physical factor that metal molecules are pushed out by the stress remaining in the galvanized film after two to three years from electric galling, and grows like a whisker. It is considered that metal particles, moisture, etc. are adsorbed on the part where the dust adheres, and this is a chemical factor that promotes corrosion on the surface.
- the present invention is a technology that can prevent the generation of a twisting force in a soldering part by lead-free solder, thereby preventing a short circuit in an electronic circuit of a printed circuit board and extending the life of an electronic device. I will provide a.
- a more specific object of the present invention is to prevent the generation of a twist force even when used as a non-cleaning type post flux for soldering a printed circuit board by flow soldering. It is to provide a flux for lead-free solder that can be.
- the present inventors have different rates of occurrence depending on the type of whisker S and flux generated in the soldered portion of the printed circuit board when, for example, electronic components are soldered to the printed circuit board using lead-free solder. It has been found that the generation can be suppressed by adding a small amount of acidic phosphate ester to the flux.
- the present invention is characterized in that, in addition to the main resin and the activator, at least one compound selected from acidic phosphoric acid esters and derivatives thereof is contained in an amount of 0.2 to 4% by mass.
- This is a non-cleaning type resin flux for lead-free solder.
- This flux preferably further contains a polar solvent.
- the present invention provides at least one compound selected from acidic phosphate esters and derivatives thereof in an amount of 0.2 to 4% by mass in addition to the main resin, activator and polar solvent.
- the soldering method is characterized in that soldering is performed using lead-free solder for mounting on a printed circuit board without using post-soldering cleaning with the contained flux.
- the “phosphoric acid” of the “acidic phosphate ester” includes orthophosphoric acid, phosphonic acid (phosphorous acid), and phosphinic acid (hypophosphorous acid or phosphonite). It means phosphorus oxygen acid.
- acidic phosphate esters include acidic orthophosphate esters (acid phosphates), acidic phosphonate esters (acid phosphonates), and acidic phosphate esters (acid phosphinates).
- Preferred acidic phosphates are acidic phosphonic acid esters or acidic phosphinic acid esters.
- the main agent is a component that is present in the largest amount among components other than the solvent in the flux.
- the flux of the present invention is a resin-based flux whose main agent is a resin.
- the main resin is preferably one or more selected from rosin and rosin derivatives.
- Lead-free solder has a higher content of Sn, an active element that is susceptible to oxidation reactions
- Lead-free solder has poor wettability with molten solder. Therefore, in order to improve wettability, the flux for lead-free solder contains a larger amount of active ingredients, and this flux causes various chemical reactions when soldering;
- Lead-free solders such as Sn—Ag—Cu series have a high soldering temperature.
- whisker generation is different from the whisker force of the Sn plating film, which is mainly generated due to physical causes, but the metal (Sn) is pushed out in a whisker shape by local multiaxial compressive stress. The point is the same.
- the following mechanism can be considered for the generation of the Wis force generated in the lead-free soldering portion of the printed circuit board.
- Sn force contained in lead-free solder in soldered parts SnO is contained in humidity and flux residue! / And oxidized by halogen components, etc.
- SnO changes, SnO has a lower density than Sn, so its volume expands To do.
- Cu Sn which is an Sn-Cu intermetallic compound, is formed at the interface between the solder and the Cu land of the printed circuit board.
- intermetallic compounds are produced by the reaction of Ag, Fe, Ni and Sn used in electronic components.
- intermetallic compounds generate a shrinkage force with higher density than Sn, SnO, Cu, etc.
- multiaxial compressive stress acts on the printed circuit board to push the metal in a whisker-like manner, generating a whistling force and dropping it can cause an electrical short circuit in the electronic circuit.
- the surface of the resin residue flux residue is porous, and water molecules are easily taken into the surface.
- the water molecules taken in do not penetrate into the flat residue because resin such as pine resin does not pass water.
- flux residues and water molecules are always in contact.
- the activator in the flux is decomposed by heat during soldering.
- amine hydrohalides and organic halides used as activators decompose to form free halogens, which react with oxides to remove oxides.
- the activator may not completely decompose and remain in the flux residue.
- the undecomposed activator remaining in the flux residue oxidizes Sn in the solder to an oxide (SnO) in the presence of moisture, causing volume expansion.
- whiskers are generated mainly by oxidation of Sn in the solder, and thus are easily affected by the environment such as humidity. If the solder forms an alloy layer at the interface with the substrate due to the heat during soldering, the alloy layer itself becomes a barrier, making it difficult to cause further oxidation.
- soldering was performed at a temperature of about 215 to 230 ° C, which is about 30 ° C or more higher than the melting temperature of the solder (about 183 ° C).
- Sn—Ag—Cu lead-free solder which is currently in practical use, has a melting temperature of about 220 ° C. Since the heat resistance of electronic components has not changed significantly, the soldering temperature is 20% higher than the solder melting temperature. It is often set at a temperature of ⁇ 25 ° C. As a result, the time during which the soldered part is wet with molten solder is shortened, and the growth of the alloy layer during soldering is small. This point is also considered to be one of the causes of increased whistling power since lead-free solder was used.
- acidic phosphate ester in order to prevent whisker without washing and removing the flux residue, a small amount of acidic phosphate ester is contained in the flux. Acid phosphate ester reacts with Sn, the main component of lead-free solder, to form a complex with Sn, thereby preventing Sn oxidation and reaction (intermetallic compound formation). This can prevent whisker generation. Of the compounds complexed with Sn, acidic phosphates were found to be most effective in preventing whisker formation.
- Formation of a complex with a metal has a physical protective effect that is not only a chemical protective effect, because a sterically liganded compound is coordinated around the metal.
- Complex formation reagents that can form complexes with polyvalent metals such as Sn, which are easier to form complexes with monovalent metals such as Ag and Cu because they form a three-dimensional structure. ) Is limited. Specific examples of such reagents include dicarboxylic acid, 8-quinolino-inore, diphenylthiocanolebazone, in addition to acidic phosphate esters.
- the flux according to the present invention is soldered by lead-free soldering, for example, when soldering an electronic component to a printed circuit board, in both flow soldering and reflow soldering, after soldering It is possible to prevent whiskers from being generated in the soldered portion without cleaning. Therefore, it can be used for force reflow soldering which is especially useful as post flux in flow soldering, It is possible to prepare a solder paste for reflow soldering by mixing.
- the acidic phosphoric acid component in the flux remains in the flux residue even when heated to 260 ° C, and it is possible to prevent the oxidation of Sn.
- FIG. 1 is an optical micrograph showing the generation of a whisker force.
- the flux according to the present invention contains at least one compound selected from acidic phosphate esters and derivatives thereof (hereinafter collectively referred to as acidic phosphate esters) in addition to the main resin and the activator. . Further, it usually contains a solvent.
- the components of the flux and the blending ratio thereof may be basically the same as those of resin fluxes conventionally used except for acidic phosphates, but will be briefly described below.
- the main resin is a water-insoluble natural or synthetic resin.
- a preferred resin is one or more selected from rosin (pine resin) and derivatives thereof. As rosin derivatives
- Modified rosin eg, acrylic acid modified rosin
- hydrogenated rosin polymerized rosin
- disproportionated rosin e.g., rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , rosin , disproportionated rosin and the like.
- an organic acid a hydrohalic acid salt of an amine, an organic acid salt of an amine, a diol and the like
- organic acids are adipic acid, sebacic acid, p-tert-butylbenzoic acid and the like.
- amine hydrohalides include various amines and aromatics such as trialkylamines, cyclohexylamines, and anilines, heterocyclic amines such as pyridine, diphenyldanidines, and various other amine hydrochlorides.
- the organic acid salt of amine is a salt of the above amine and organic acid.
- the diol is preferably a halogenated diol, for example, 2,3 dibromo-2-butene 1,4 diol.
- the amount of the activator (the total amount in the case of two or more kinds) is within the range of 3 to 40% by mass with respect to the main resin. S is preferable, and more preferably 5 to 20% by mass. .
- the flux of the present invention is one kind selected from acidic phosphate esters and derivatives thereof. 2 or more in an amount of 0.2-4% by mass.
- An example of an acidic phosphate derivative is an acidic ester of a phosphate derivative in which H is substituted with an organic group (eg, an alkyl group or an aryl group) in the above general formula.
- acidic phosphoric acid ester forms include mono- and diesters of orthophosphoric acid, mono- and diesters of phosphonic acid, and mono-esters of phosphinic acid.
- acidic phosphate esters acidic orthophosphate ester (acid phosphate) disclosed in Patent Document 1 remains in the flux residue that is difficult to decompose by heat during soldering. Compared to phosphonates and phosphinates, there is a slight tendency to lower the insulation resistance of the flux residue after soldering. In high-density electronic equipment, the effect must be taken into account. It is in. Therefore, acidic phosphonic acid esters (acid phosphonates) and acidic phosphinic acid esters (acid phosphinates) are particularly preferred as acidic phosphoric acid esters.
- the ester group of the acidic phosphate ester is preferably an ester group derived from an alkyl group having 16 or less carbon atoms.
- acidic phosphates that can be used in the present invention include, but are not limited to, di (2-ethylhexyl) phosphonate, jetyl ( ⁇ -methylbenzyl) phosphonate, di (isodecyl) phosphonate, mono ( 2-Ethylhexinole) phosphinate, di (2-ethylhexyl) phosphate and the like.
- Acid phosphates are adsorbed on the solder surface to prevent oxidation of Sn, and remain in the flux residue after soldering and maintain the antioxidant effect by contacting the solder surface. Therefore, if the amount of acidic phosphates in the flux is small, the effect cannot be exerted, and if it is too large, the insulation resistance of the printed circuit board after soldering deteriorates. This In reason, the amount of acid phosphate esters in the flux is 0, 2-4 wt 0/0. A more preferred amount is 0.2-2% by mass.
- the balance of the flux is a solvent.
- the type and amount of the solvent are selected according to the type of flux used, but polar solvents, especially polar organic solvents such as alcohol and ketone, are preferred! Such polar organic solvents serve to improve the wettability of the molten solder during soldering.
- polar solvents are preferably highly volatile and low-viscosity! / ,. Examples of such polar solvents include lower alcohols such as isopropyl alcohol (isopropanol), ethanol and methanol.
- the post flux is applied by, for example, a spray fluxer or a foaming fluxer.
- Preferred proportions (mass%) of each component in post flux applied by spray fluxer! /, Examples are as follows:
- Main resin 5 to 15%, more preferably 8 to 12%,
- Activator 0.5-3%, more preferably;!-2.5%
- Acid phosphate esters 0.2-2%, more preferably 0.2-2%,
- the resin-based flux of the present invention can be used as a flux of reflow soldering or flux cored solder, and even in that case, the whisker prevention effect of the soldered portion can be obtained.
- the flux of flux cored solder generally contains substantially no solvent.
- the resin-based flack of the present invention is used as a solder paste by mixing with soot and solder powder, the effect of preventing whisker generation can be obtained.
- the secondary effect of extending the shelf life of the solder paste can be obtained by covering the solder powder with the acid phosphate to prevent the solder powder from being oxidized.
- the solder powder is fine and has a large surface area and high reactivity, and during the storage period until it is used for soldering, the flux components are the same as the solder powder. Because of the contact, it is preferable to adjust the amount of the acidic phosphate ester to be small (eg, 2% or less, more preferably 1% or less).
- the flux used for the solder paste is paste-like, and a high-viscosity solvent is used in a relatively small amount (for example, 60% by mass or less in the flux).
- suitable solvents include alkylene glycols such as hexylene glycol, canolebitonoles, tervineol and the like.
- an additive such as a thixotropic agent is usually added to the flux.
- the atmosphere at the time of soldering may be air, but if it is a nitrogen atmosphere, the effect of preventing the generation of whiskers appears more remarkably.
- the flux of the present invention can be used for all types of soldering using lead-free solder, as soldering is not limited to the soldering of electronic components to printed circuit boards. After soldering, the flux residue containing acid phosphate ester continues to provide anti-oxidation action against lead-free solder as described above, so the reliability of soldering can be improved without cleaning. There is no problem.
- a resin flux containing a rosin resin as the main ingredient is prepared by mixing the ingredients in the composition shown in Table 1, whisker generation after soldering, wettability of molten solder (zero cross test), insulation of flux residues. Tested for resistance. These test results are also shown in Table 1.
- printed circuit board for whisker firing test (commercial product of 180 X 180mm size with Cu land) is installed without mounting components. First, it was heated in a reflow furnace. Heating conditions are 160 ° CX for 1 minute preheating, followed by main heating for 20 seconds above 200 ° C (5 seconds at 240 ° C peak temperature). It was heat and was a common temperature in lead-free solder reflow soldering.
- Equipment SPF-300N2 manufactured by Senju Metal Industry
- Flux application spray method (application amount: 0.6ml / cm 2 )
- Substrate preheating temperature 110 ° C
- Atmosphere Air atmosphere or nitrogen atmosphere (oxygen content: l OOOppm)
- the printed circuit board after soldering was allowed to cool in the same atmosphere as that for soldering, returned to room temperature, and then placed in a constant temperature / humidity chamber at 85 ° C and 85% humidity. Every 200 hours, the whisker test substrate was taken out and returned to room temperature for 24 hours. At this time, the occurrence of Wishes was examined. Table 1 shows the number of whiskers generated after 1000 hours in the above-mentioned constant temperature / humidity chamber.
- a brass plate specified in JIS C 2600 was aged for 24 hours at a temperature of 85 ° C and a humidity of 85% to obtain a test plate for meniscograph.
- the zero cross time was measured after applying the flux to be tested.
- the measurement conditions are as follows.
- Solder Sn— 3.0Ag— 0.5Cu (Eko Solder M705 manufactured by Senju Metal Industry) Molten solder temperature: 250 ° C
- Flux application Immersion application (Place the flux 4mm deep in the petri dish, soak the test plate for 5 seconds and pull it up)
- the test was conducted according to JIS Z 3197. Apply 0.2mr of the flux to be tested to a commercially available printed board of 180 x 180mm size Cu land, and use only an automatic soldering device for flow soldering to perform preheating only at 100 ° C in the atmosphere. Carried out. Thereafter, the printed circuit board was placed in a constant temperature / humidity chamber having an atmospheric temperature of 85 ° C. and a humidity of 85%, and the insulation resistance of the substrate insulating portion was measured after 3 hours and 168 hours as an initial value.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
Description
Claims
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008549330A JP4325746B2 (ja) | 2006-12-12 | 2007-12-12 | 鉛フリーはんだ用フラックスとはんだ付け方法 |
CN200780040648XA CN101557903B (zh) | 2006-12-12 | 2007-12-12 | 无铅软钎料用焊剂和软钎焊方法 |
BRPI0718265-1A BRPI0718265B1 (pt) | 2006-12-12 | 2007-12-12 | Fluxo para solda livre de chumbo e método de soldagem |
US12/311,976 US9073154B2 (en) | 2006-12-12 | 2007-12-12 | Flux for lead-free solder and soldering method |
EP07850477.6A EP2100690B1 (en) | 2006-12-12 | 2007-12-12 | Flux for lead-free solder |
ES07850477.6T ES2614238T3 (es) | 2006-12-12 | 2007-12-12 | Fundente para soldadura exenta de plomo |
KR1020097008829A KR101163427B1 (ko) | 2006-12-12 | 2007-12-12 | 납프리 땜납용 플럭스와 납땜 방법 |
MX2009004793A MX2009004793A (es) | 2006-12-12 | 2007-12-12 | Fundente para suelda libre de plomo, y metodo de soldeo. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-335173 | 2006-12-12 | ||
JP2006335173 | 2006-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008072654A1 true WO2008072654A1 (ja) | 2008-06-19 |
Family
ID=39511671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/073926 WO2008072654A1 (ja) | 2006-12-12 | 2007-12-12 | 鉛フリーはんだ用フラックスとはんだ付け方法 |
Country Status (10)
Country | Link |
---|---|
US (1) | US9073154B2 (ja) |
EP (1) | EP2100690B1 (ja) |
JP (1) | JP4325746B2 (ja) |
KR (1) | KR101163427B1 (ja) |
CN (1) | CN101557903B (ja) |
BR (1) | BRPI0718265B1 (ja) |
ES (1) | ES2614238T3 (ja) |
HU (1) | HUE031395T2 (ja) |
MX (1) | MX2009004793A (ja) |
WO (1) | WO2008072654A1 (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011143445A (ja) * | 2010-01-14 | 2011-07-28 | Senju Metal Ind Co Ltd | フラックス,はんだ及び基板 |
US20110274937A1 (en) * | 2009-01-27 | 2011-11-10 | Koki Company Limited | Lead-free solder alloy, fatigue resistant soldering materials containing the solder alloy, and joined products using the soldering materials |
WO2012118075A1 (ja) * | 2011-03-02 | 2012-09-07 | 千住金属工業株式会社 | フラックス |
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JP2017136636A (ja) * | 2016-02-05 | 2017-08-10 | 株式会社弘輝 | フラックス及びはんだ組成物 |
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WO2019009191A1 (ja) * | 2017-07-03 | 2019-01-10 | 株式会社弘輝 | フラックス、やに入りはんだ及びソルダペースト |
JP2019013924A (ja) * | 2017-07-03 | 2019-01-31 | 株式会社弘輝 | フラックス、やに入りはんだ及びソルダペースト |
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JP7150232B2 (ja) | 2017-07-03 | 2022-10-11 | 株式会社弘輝 | フラックス、やに入りはんだ及びソルダペースト |
US11541485B2 (en) | 2017-07-03 | 2023-01-03 | Koki Company Limited | Flux, resin flux cored solder, and solder paste |
JP6322881B1 (ja) * | 2017-12-21 | 2018-05-16 | 千住金属工業株式会社 | フラックス及びフラックス用樹脂組成物 |
WO2019123674A1 (ja) | 2017-12-21 | 2019-06-27 | 千住金属工業株式会社 | フラックス及びフラックス用樹脂組成物 |
JP2019111541A (ja) * | 2017-12-21 | 2019-07-11 | 千住金属工業株式会社 | フラックス及びフラックス用樹脂組成物 |
US10556299B2 (en) | 2017-12-21 | 2020-02-11 | Senju Metal Industry Co., Ltd. | Flux and resin composition for flux |
Also Published As
Publication number | Publication date |
---|---|
KR101163427B1 (ko) | 2012-07-13 |
ES2614238T3 (es) | 2017-05-30 |
JP4325746B2 (ja) | 2009-09-02 |
BRPI0718265A2 (pt) | 2014-03-04 |
EP2100690B1 (en) | 2016-11-16 |
CN101557903A (zh) | 2009-10-14 |
CN101557903B (zh) | 2013-06-19 |
EP2100690A4 (en) | 2012-07-18 |
MX2009004793A (es) | 2009-05-21 |
HUE031395T2 (en) | 2017-07-28 |
JPWO2008072654A1 (ja) | 2010-04-02 |
EP2100690A1 (en) | 2009-09-16 |
BRPI0718265B1 (pt) | 2015-04-14 |
KR20090088359A (ko) | 2009-08-19 |
US20090308496A1 (en) | 2009-12-17 |
US9073154B2 (en) | 2015-07-07 |
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