KR970703614A - 정전척 - Google Patents

정전척 Download PDF

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Publication number
KR970703614A
KR970703614A KR1019960706716A KR19960706716A KR970703614A KR 970703614 A KR970703614 A KR 970703614A KR 1019960706716 A KR1019960706716 A KR 1019960706716A KR 19960706716 A KR19960706716 A KR 19960706716A KR 970703614 A KR970703614 A KR 970703614A
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KR
South Korea
Prior art keywords
electrostatic chuck
members
ceramic
dielectric layer
metal
Prior art date
Application number
KR1019960706716A
Other languages
English (en)
Inventor
피터 클락 스미스
Original Assignee
그라함 스웨트맨, 데이빗 코커
더 모간 크루시블 캄파니 퍼블릭 리미티드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 그라함 스웨트맨, 데이빗 코커, 더 모간 크루시블 캄파니 퍼블릭 리미티드 캄파니 filed Critical 그라함 스웨트맨, 데이빗 코커
Publication of KR970703614A publication Critical patent/KR970703614A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Abstract

본 발명은 정전척과 이러한 척을 구성하는 방법에 관한 것이다. 이 척은 활성브레이징합금의 층으로 직접 결합되는 세라믹물질을 포함한다. 활성합금은 정전척의 전도성 층과, 척의 베이스에 유전제층을 결합시키기 위한 수단으로서 작용한다. 전극에 대한 전기관통단자가 활성전극을 이용하여 형성된다.

Description

정전척
[도면의 간단한 설명]
제4도는 제3도의 정전척의 제1변형형태를 보인 단면도.
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (18)

  1. 제1 및 제2부재와, 제1 및 제2부재의 적어도 일부분사이에 개재되어 이들과 화학적으로 접착되는 금속으로 구성된 전극으로 구성됨을 특징으로 하는 정전척.
  2. 청구범위 1항에 있어서, 제2부재를 통하여 연장되어 전극을 전원에 전기적으로 연결하기 위한 수단이 구성되어 있음을 특징으로 하는 정전척.
  3. 청구범위 1 또는 2항에 있어서, 금속에 의하여 결합되지 아니하는 제1 및 제2비금속부재의 부분사이에 개재된 비전도성물질이 구성되어 있음을 특징으로 하는 정전척.
  4. 전기 청구범위 어느 한 항에 있어서, 제1 및 제2부재가 세라믹이고 금속이 제1 및 제2부재를 브레이징토록 사용된 활성합금으로 구성됨을 특징으로 하는 정전척.
  5. 청구범위 2항에 종속하는 청구범위 4항에 있어서, 전기적인 연결수단이 제2부재에 형성된 개방부와 이 개방부를 통하여 연장되고 이에 결합된 활성합금으로 구성됨을 특징으로 하는 정전척.
  6. 청구범위 3항에 있어서, 비전도성 물질이 에폭시와 알루미나충만형 유기금속현탁액으로 구성된 그룹으로부터 선택됨을 특징으로 하는 정전척.
  7. 전기 청구범위의 어느 한 항에 있어서, 베이스부분, 유전체층과, 이들 베이스부분 및 유전체층 사이에 개재되어 전압전원에 연결가능만 하나 이상의 전극으로 구성되고. 베이스부분과 유전체층이 세라믹으로 구성되며, 하나 이상의 전극이 유전체층을 베이스부분에 결합시키는 활성브레이징합금으로 구성됨을 특징으로 하는 정전척.
  8. 청구범위 7항에 있어서, 유전체층의 두께가 0.020인치 이하임을 특징으로 하는 정전척.
  9. 청구범위 8항에 있어서, 유전체층의 두께가 0.004-0.010인치의 범위임을 특징으로 하는 정전척.
  10. 청구범위 7-9항의 어느 한 항에 있어서, 600°C의 온도에서 사용가능함을 특징으로 하는 정전척.
  11. 청구범위 4항에 종속하는 청구범위 5-10항의 어느 한 항에 있어서, 활성 합금의 열팽창계수가 제1부재의 열팽창계수보다 큼을 특징으로 하는 정전척.
  12. 전기 청구범위의 어느 항 항에 있어서, 제1 및 제2부재의 적어도 하나가 알루미나로 구성됨을 특징으로 하는 정전척.
  13. 청구범위 4항에 종속하는 청구범위 5-12항의 어느 한 항에 있어서, 활성합금이 비귀금속으로 구성됨을 특징으로 하는 정전척.
  14. 청구범위 3항에 있어서, 제1세라믹부재에 비전도성 금속이 주입되는 포트가 형성되어 있음을 특징으로 하는 정전척.
  15. 전기 청구범위의 어느 한 항에 있어서, 제1 및 제2세라믹 부재의 적어도 하나가 질화규소, 질화알루미늄, 티탄산 바륨 티탄산칼슘 및 사파이어로 구성되는 그룹으로부터 선택된 물질로 구성됨을 특징으로 하는 정전척.
  16. 처리된 반도체 웨이퍼를 고정하는 방법에 있어서, 이 방법이 전기 청구범위의 어느 한 항에 청구된 정전척을 이용하는 단계로 구성됨을 특징으로 하는 반도체 웨이퍼 고정 방법.
  17. 정전척의 구성방법에 있어서, 이 방법이 제1 및 제2세라믹부재의 적어도 일부분을 금속으로 화학 결합시키는 단계와 이후에 제l세라믹부재의 두께를 감소시키는 단계로 구성됨을 특징으로 하는 방법.
  18. 청구범위 17항에 있어서, 제1 및 제2세라믹부재의 결합단계가 제1 및 제2세라믹부재의 적어도 일부분을 활성합금으로 결합시키는 단계로 구성됨을 특징으로 하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960706716A 1994-06-10 1995-06-01 정전척 KR970703614A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/258,232 1994-06-10
US06/258,232 US5600530A (en) 1992-08-04 1994-06-10 Electrostatic chuck
PCT/GB1995/001257 WO1995034911A1 (en) 1994-06-10 1995-06-01 Electrostatic chuck

Publications (1)

Publication Number Publication Date
KR970703614A true KR970703614A (ko) 1997-07-03

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Application Number Title Priority Date Filing Date
KR1019960706716A KR970703614A (ko) 1994-06-10 1995-06-01 정전척

Country Status (5)

Country Link
US (1) US5600530A (ko)
EP (1) EP0764342A1 (ko)
JP (1) JPH10501925A (ko)
KR (1) KR970703614A (ko)
WO (1) WO1995034911A1 (ko)

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WO1995034911A1 (en) 1995-12-21
EP0764342A1 (en) 1997-03-26
JPH10501925A (ja) 1998-02-17
US5600530A (en) 1997-02-04

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