JPS5754341A - Usuitahojisochi - Google Patents

Usuitahojisochi

Info

Publication number
JPS5754341A
JPS5754341A JP12931380A JP12931380A JPS5754341A JP S5754341 A JPS5754341 A JP S5754341A JP 12931380 A JP12931380 A JP 12931380A JP 12931380 A JP12931380 A JP 12931380A JP S5754341 A JPS5754341 A JP S5754341A
Authority
JP
Japan
Prior art keywords
wafer
holder
thin plate
come
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12931380A
Other languages
English (en)
Inventor
Susumu Aiuchi
Mineo Nomoto
Yukio Kenbo
Yasuo Nakagawa
Nobuyuki Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12931380A priority Critical patent/JPS5754341A/ja
Publication of JPS5754341A publication Critical patent/JPS5754341A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP12931380A 1980-09-19 1980-09-19 Usuitahojisochi Pending JPS5754341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12931380A JPS5754341A (ja) 1980-09-19 1980-09-19 Usuitahojisochi

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12931380A JPS5754341A (ja) 1980-09-19 1980-09-19 Usuitahojisochi

Publications (1)

Publication Number Publication Date
JPS5754341A true JPS5754341A (ja) 1982-03-31

Family

ID=15006476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12931380A Pending JPS5754341A (ja) 1980-09-19 1980-09-19 Usuitahojisochi

Country Status (1)

Country Link
JP (1) JPS5754341A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0134438A2 (en) * 1983-06-30 1985-03-20 International Business Machines Corporation Vacuum and/or electrostatic pinchuck for holding semiconductor wafers or other flat electrical components and method for making the same
JPS61285733A (ja) * 1985-06-12 1986-12-16 Mitsubishi Electric Corp パタ−ン転写装置
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
US5600530A (en) * 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54120585A (en) * 1978-01-23 1979-09-19 Western Electric Co Method of placing and smoothing substrate wafer having front and rear surfaces

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54120585A (en) * 1978-01-23 1979-09-19 Western Electric Co Method of placing and smoothing substrate wafer having front and rear surfaces

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0134438A2 (en) * 1983-06-30 1985-03-20 International Business Machines Corporation Vacuum and/or electrostatic pinchuck for holding semiconductor wafers or other flat electrical components and method for making the same
JPS61285733A (ja) * 1985-06-12 1986-12-16 Mitsubishi Electric Corp パタ−ン転写装置
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
US5600530A (en) * 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck

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