JPS54120585A - Method of placing and smoothing substrate wafer having front and rear surfaces - Google Patents

Method of placing and smoothing substrate wafer having front and rear surfaces

Info

Publication number
JPS54120585A
JPS54120585A JP565679A JP565679A JPS54120585A JP S54120585 A JPS54120585 A JP S54120585A JP 565679 A JP565679 A JP 565679A JP 565679 A JP565679 A JP 565679A JP S54120585 A JPS54120585 A JP S54120585A
Authority
JP
Japan
Prior art keywords
placing
rear surfaces
substrate wafer
smoothing substrate
smoothing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP565679A
Other languages
Japanese (ja)
Other versions
JPS6015147B2 (en
Inventor
Andoriyuu Fuaashiyon Buikutaa
Richiyaado Heriotsuto Donarudo
Eringusen Pourusen Maachin
Rongubudo Reifu
Edowaado Sandaasu Toomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/965,304 external-priority patent/US4213698A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS54120585A publication Critical patent/JPS54120585A/en
Publication of JPS6015147B2 publication Critical patent/JPS6015147B2/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
JP54005656A 1978-01-23 1979-01-23 Method for holding and flattening a substrate wafer having both front and back outer surfaces Expired JPS6015147B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US87147778A 1978-01-23 1978-01-23
US871477 1978-01-23
US05/965,304 US4213698A (en) 1978-12-01 1978-12-01 Apparatus and method for holding and planarizing thin workpieces
US965304 1978-12-01

Publications (2)

Publication Number Publication Date
JPS54120585A true JPS54120585A (en) 1979-09-19
JPS6015147B2 JPS6015147B2 (en) 1985-04-17

Family

ID=27128208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54005656A Expired JPS6015147B2 (en) 1978-01-23 1979-01-23 Method for holding and flattening a substrate wafer having both front and back outer surfaces

Country Status (7)

Country Link
JP (1) JPS6015147B2 (en)
DE (1) DE2901968A1 (en)
FR (1) FR2415368A1 (en)
GB (1) GB2016166B (en)
IT (1) IT1118308B (en)
NL (1) NL7900497A (en)
SE (1) SE444526B (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754341A (en) * 1980-09-19 1982-03-31 Hitachi Ltd Thin plate holder
JPS5898941A (en) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ Wafer chuck
JPS58153344A (en) * 1982-03-05 1983-09-12 Hitachi Ltd Retainer type wafer chuck
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
JP2003142566A (en) * 2001-11-07 2003-05-16 New Creation Co Ltd Vacuum sucker and its manufacturing method
JP2012119591A (en) * 2010-12-02 2012-06-21 Fuji Electric Co Ltd Suction device and suction method
JP2015065298A (en) * 2013-09-25 2015-04-09 芝浦メカトロニクス株式会社 Suction stage, bonding device and bonding method

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099538A (en) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 Pin chuck
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
DE3706735A1 (en) * 1986-03-03 1987-09-10 Canon Kk DEVICE FOR ADJUSTING THE OPTICAL SYSTEM OF A CAMERA
US4903681A (en) * 1987-02-24 1990-02-27 Tokyo Seimitus Co., Ltd. Method and apparatus for cutting a cylindrical material
NL8701603A (en) * 1987-07-08 1989-02-01 Philips & Du Pont Optical VACUUM DEVICE FOR SECURING WORKPIECES.
US6228438B1 (en) * 1999-08-10 2001-05-08 Unakis Balzers Aktiengesellschaft Plasma reactor for the treatment of large size substrates
DE20206490U1 (en) * 2002-04-24 2002-07-18 Schmalz J Gmbh suction blocks
DE102011001879A1 (en) 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB280154A (en) * 1926-11-02 1928-03-28 Wesel Mfg Company F Improvements in photo-engravers' printing frame
FR1517154A (en) * 1967-03-02 1968-03-15 Elektromat Veb Method and device for removing small bodies with adherent surfaces
DE1646147A1 (en) * 1967-05-13 1971-01-07 Telefunken Patent Device for holding a semiconductor wafer when transferring a pattern by contact copying or by projection masking
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754341A (en) * 1980-09-19 1982-03-31 Hitachi Ltd Thin plate holder
JPS5898941A (en) * 1981-11-30 1983-06-13 テンコ−・インストルメンツ Wafer chuck
JPS58153344A (en) * 1982-03-05 1983-09-12 Hitachi Ltd Retainer type wafer chuck
JPH0361340B2 (en) * 1982-03-05 1991-09-19 Hitachi Ltd
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
JP2003142566A (en) * 2001-11-07 2003-05-16 New Creation Co Ltd Vacuum sucker and its manufacturing method
JP2012119591A (en) * 2010-12-02 2012-06-21 Fuji Electric Co Ltd Suction device and suction method
JP2015065298A (en) * 2013-09-25 2015-04-09 芝浦メカトロニクス株式会社 Suction stage, bonding device and bonding method

Also Published As

Publication number Publication date
NL7900497A (en) 1979-07-25
SE444526B (en) 1986-04-21
FR2415368B1 (en) 1984-05-04
IT1118308B (en) 1986-02-24
JPS6015147B2 (en) 1985-04-17
SE7900230L (en) 1979-07-24
DE2901968C2 (en) 1988-08-11
GB2016166A (en) 1979-09-19
FR2415368A1 (en) 1979-08-17
IT7967112A0 (en) 1979-01-18
DE2901968A1 (en) 1979-07-26
GB2016166B (en) 1982-06-09

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