FR2415368A1 - PROCEDURE FOR HOLDING THIN PARTS - Google Patents

PROCEDURE FOR HOLDING THIN PARTS

Info

Publication number
FR2415368A1
FR2415368A1 FR7901510A FR7901510A FR2415368A1 FR 2415368 A1 FR2415368 A1 FR 2415368A1 FR 7901510 A FR7901510 A FR 7901510A FR 7901510 A FR7901510 A FR 7901510A FR 2415368 A1 FR2415368 A1 FR 2415368A1
Authority
FR
France
Prior art keywords
procedure
wafer
thin parts
holding thin
exposure operation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7901510A
Other languages
French (fr)
Other versions
FR2415368B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/965,304 external-priority patent/US4213698A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2415368A1 publication Critical patent/FR2415368A1/en
Application granted granted Critical
Publication of FR2415368B1 publication Critical patent/FR2415368B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne l'industrie des semiconducteurs. Pour maintenir en position une tranche mince de semiconducteur pendant une opération d'exposition d'un processus de photogravure, on utilise une embase 10 qui comporte une périphérie surélevée 11 et un certain nombre de broches 17 dont les pointes supportant une tranche 14 lorsqu'on fait le vide dans la chambre intérieure 15. Cette configuration permet de rendre la tranche parfaitement plane pendant l'operation d'exposition. Application à la fabrication des circuits intégrés.The invention relates to the semiconductor industry. To hold a thin semiconductor wafer in position during an exposure operation of a photoetching process, a header 10 is used which has a raised periphery 11 and a number of pins 17, the tips of which support a wafer 14 when. creates a vacuum in the inner chamber 15. This configuration makes it possible to make the wafer perfectly flat during the exposure operation. Application to the manufacture of integrated circuits.

FR7901510A 1978-01-23 1979-01-22 PROCEDURE FOR HOLDING THIN PARTS Granted FR2415368A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87147778A 1978-01-23 1978-01-23
US05/965,304 US4213698A (en) 1978-12-01 1978-12-01 Apparatus and method for holding and planarizing thin workpieces

Publications (2)

Publication Number Publication Date
FR2415368A1 true FR2415368A1 (en) 1979-08-17
FR2415368B1 FR2415368B1 (en) 1984-05-04

Family

ID=27128208

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7901510A Granted FR2415368A1 (en) 1978-01-23 1979-01-22 PROCEDURE FOR HOLDING THIN PARTS

Country Status (7)

Country Link
JP (1) JPS6015147B2 (en)
DE (1) DE2901968A1 (en)
FR (1) FR2415368A1 (en)
GB (1) GB2016166B (en)
IT (1) IT1118308B (en)
NL (1) NL7900497A (en)
SE (1) SE444526B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554250A1 (en) * 1983-11-01 1985-05-03 Varian Associates PIN CHUCK
EP0280245A2 (en) * 1987-02-24 1988-08-31 Tokyo Seimitsu Co.,Ltd. Method and apparatus for cutting a cylindrical material
EP0298564A1 (en) * 1987-07-08 1989-01-11 Philips and Du Pont Optical Company Vacuum apparatus for holding workpieces

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754341A (en) * 1980-09-19 1982-03-31 Hitachi Ltd Thin plate holder
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
JPS58153344A (en) * 1982-03-05 1983-09-12 Hitachi Ltd Retainer type wafer chuck
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
GB2189328B (en) * 1986-03-03 1990-12-19 Canon Kk Optical system adjustment device for camera
US6228438B1 (en) * 1999-08-10 2001-05-08 Unakis Balzers Aktiengesellschaft Plasma reactor for the treatment of large size substrates
JP2003142566A (en) * 2001-11-07 2003-05-16 New Creation Co Ltd Vacuum sucker and its manufacturing method
DE20206490U1 (en) * 2002-04-24 2002-07-18 J. Schmalz GmbH, 72293 Glatten suction blocks
JP5810517B2 (en) * 2010-12-02 2015-11-11 富士電機株式会社 Adsorption device and adsorption method
DE102011001879A1 (en) 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
JP6178683B2 (en) * 2013-09-25 2017-08-09 芝浦メカトロニクス株式会社 Adsorption stage, pasting device, and pasting method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB280154A (en) * 1926-11-02 1928-03-28 Wesel Mfg Company F Improvements in photo-engravers' printing frame
FR1517154A (en) * 1967-03-02 1968-03-15 Elektromat Veb Method and device for removing small bodies with adherent surfaces
DE1646147A1 (en) * 1967-05-13 1971-01-07 Telefunken Patent Device for holding a semiconductor wafer when transferring a pattern by contact copying or by projection masking

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB280154A (en) * 1926-11-02 1928-03-28 Wesel Mfg Company F Improvements in photo-engravers' printing frame
FR1517154A (en) * 1967-03-02 1968-03-15 Elektromat Veb Method and device for removing small bodies with adherent surfaces
DE1646147A1 (en) * 1967-05-13 1971-01-07 Telefunken Patent Device for holding a semiconductor wafer when transferring a pattern by contact copying or by projection masking

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
EXBK/70 *
EXBK/71 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2554250A1 (en) * 1983-11-01 1985-05-03 Varian Associates PIN CHUCK
EP0280245A2 (en) * 1987-02-24 1988-08-31 Tokyo Seimitsu Co.,Ltd. Method and apparatus for cutting a cylindrical material
EP0280245A3 (en) * 1987-02-24 1990-10-24 Tokyo Seimitsu Co.,Ltd. Method and apparatus for cutting a cylindrical material
EP0298564A1 (en) * 1987-07-08 1989-01-11 Philips and Du Pont Optical Company Vacuum apparatus for holding workpieces

Also Published As

Publication number Publication date
GB2016166A (en) 1979-09-19
FR2415368B1 (en) 1984-05-04
SE444526B (en) 1986-04-21
SE7900230L (en) 1979-07-24
JPS6015147B2 (en) 1985-04-17
DE2901968A1 (en) 1979-07-26
GB2016166B (en) 1982-06-09
NL7900497A (en) 1979-07-25
IT1118308B (en) 1986-02-24
IT7967112A0 (en) 1979-01-18
JPS54120585A (en) 1979-09-19
DE2901968C2 (en) 1988-08-11

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