JPS54113615A - Method of planting metal in ceramic substrate - Google Patents
Method of planting metal in ceramic substrateInfo
- Publication number
- JPS54113615A JPS54113615A JP2190878A JP2190878A JPS54113615A JP S54113615 A JPS54113615 A JP S54113615A JP 2190878 A JP2190878 A JP 2190878A JP 2190878 A JP2190878 A JP 2190878A JP S54113615 A JPS54113615 A JP S54113615A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- planting metal
- planting
- metal
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Ceramic Products (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2190878A JPS54113615A (en) | 1978-02-27 | 1978-02-27 | Method of planting metal in ceramic substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2190878A JPS54113615A (en) | 1978-02-27 | 1978-02-27 | Method of planting metal in ceramic substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54113615A true JPS54113615A (en) | 1979-09-05 |
JPS5648462B2 JPS5648462B2 (en) | 1981-11-16 |
Family
ID=12068184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2190878A Granted JPS54113615A (en) | 1978-02-27 | 1978-02-27 | Method of planting metal in ceramic substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113615A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (en) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | Heat dissipating structure for printed circuit board and method for manufacturing the same |
JP2021027076A (en) * | 2019-07-31 | 2021-02-22 | 三菱電機株式会社 | Wiring substrate, semiconductor device, and manufacturing method of wiring substrate |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5959263U (en) * | 1982-10-07 | 1984-04-18 | 都築 弘 | whetstone correction tool |
JPH0112953Y2 (en) * | 1985-02-23 | 1989-04-14 |
-
1978
- 1978-02-27 JP JP2190878A patent/JPS54113615A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (en) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | Heat dissipating structure for printed circuit board and method for manufacturing the same |
JP2021027076A (en) * | 2019-07-31 | 2021-02-22 | 三菱電機株式会社 | Wiring substrate, semiconductor device, and manufacturing method of wiring substrate |
Also Published As
Publication number | Publication date |
---|---|
JPS5648462B2 (en) | 1981-11-16 |
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