SE7900230L - WAY TO KEEP THE THIN WORKS - Google Patents

WAY TO KEEP THE THIN WORKS

Info

Publication number
SE7900230L
SE7900230L SE7900230A SE7900230A SE7900230L SE 7900230 L SE7900230 L SE 7900230L SE 7900230 A SE7900230 A SE 7900230A SE 7900230 A SE7900230 A SE 7900230A SE 7900230 L SE7900230 L SE 7900230L
Authority
SE
Sweden
Prior art keywords
abutments
article
area
intervening
keep
Prior art date
Application number
SE7900230A
Other languages
Swedish (sv)
Other versions
SE444526B (en
Inventor
V A Firtion
D R Harriott
M E Poulsen
L Rongved
T E Saunders
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/965,304 external-priority patent/US4213698A/en
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of SE7900230L publication Critical patent/SE7900230L/en
Publication of SE444526B publication Critical patent/SE444526B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A laminar article (14) is held in a planar configuration by urging it, for example by means of a vacuum (applied via 16) against a plurality of small-area abutments (18) which define a planar surface. The smallness of the area of the abutments (18) reduces the probability of there being any intervening dirt particles to perturb the planarity of the article (14) and there is a tendency for any such particles to be squeezed out. Preferably the article (14) is given a slight lateral movement after bringing it into contact with the abutments (18) to dislodge remaining intervening dirt particles. The invention is particularly applicable to holding semiconductor wafers during pattern exposure but may be used to hold workpieces during polishing, grinding or machining. <IMAGE>
SE7900230A 1978-01-23 1979-01-10 PUT IN PLACE AND PLAN TO PLACE A SUBSTRATE DISH SE444526B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87147778A 1978-01-23 1978-01-23
US05/965,304 US4213698A (en) 1978-12-01 1978-12-01 Apparatus and method for holding and planarizing thin workpieces

Publications (2)

Publication Number Publication Date
SE7900230L true SE7900230L (en) 1979-07-24
SE444526B SE444526B (en) 1986-04-21

Family

ID=27128208

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7900230A SE444526B (en) 1978-01-23 1979-01-10 PUT IN PLACE AND PLAN TO PLACE A SUBSTRATE DISH

Country Status (7)

Country Link
JP (1) JPS6015147B2 (en)
DE (1) DE2901968A1 (en)
FR (1) FR2415368A1 (en)
GB (1) GB2016166B (en)
IT (1) IT1118308B (en)
NL (1) NL7900497A (en)
SE (1) SE444526B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754341A (en) * 1980-09-19 1982-03-31 Hitachi Ltd Thin plate holder
US4433835A (en) * 1981-11-30 1984-02-28 Tencor Instruments Wafer chuck with wafer cleaning feature
JPS58153344A (en) * 1982-03-05 1983-09-12 Hitachi Ltd Retainer type wafer chuck
JPS59106118A (en) * 1982-12-10 1984-06-19 Hitachi Ltd Thin plate deforming apparatus
JPS6099538A (en) * 1983-11-01 1985-06-03 横河・ヒュ−レット・パッカ−ド株式会社 Pin chuck
US4656791A (en) * 1984-09-27 1987-04-14 Libbey-Owens-Ford Company Abrasive fluid jet cutting support
DE3706735A1 (en) * 1986-03-03 1987-09-10 Canon Kk DEVICE FOR ADJUSTING THE OPTICAL SYSTEM OF A CAMERA
US4903681A (en) * 1987-02-24 1990-02-27 Tokyo Seimitus Co., Ltd. Method and apparatus for cutting a cylindrical material
NL8701603A (en) * 1987-07-08 1989-02-01 Philips & Du Pont Optical VACUUM DEVICE FOR SECURING WORKPIECES.
US6228438B1 (en) * 1999-08-10 2001-05-08 Unakis Balzers Aktiengesellschaft Plasma reactor for the treatment of large size substrates
JP2003142566A (en) * 2001-11-07 2003-05-16 New Creation Co Ltd Vacuum sucker and its manufacturing method
DE20206490U1 (en) * 2002-04-24 2002-07-18 Schmalz J Gmbh suction blocks
JP5810517B2 (en) * 2010-12-02 2015-11-11 富士電機株式会社 Adsorption device and adsorption method
DE102011001879A1 (en) 2011-04-07 2012-10-11 Jenoptik Automatisierungstechnik Gmbh Device for clamping wafer utilized in e.g. micro system technology, has suction port connected with vacuum ejector via distributor, and suction insert provided in suction port and includes resilient hollow body opened at its two sides
JP6178683B2 (en) * 2013-09-25 2017-08-09 芝浦メカトロニクス株式会社 Adsorption stage, pasting device, and pasting method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB280154A (en) * 1926-11-02 1928-03-28 Wesel Mfg Company F Improvements in photo-engravers' printing frame
FR1517154A (en) * 1967-03-02 1968-03-15 Elektromat Veb Method and device for removing small bodies with adherent surfaces
DE1646147A1 (en) * 1967-05-13 1971-01-07 Telefunken Patent Device for holding a semiconductor wafer when transferring a pattern by contact copying or by projection masking
US3627338A (en) * 1969-10-09 1971-12-14 Sheldon Thompson Vacuum chuck
US3747282A (en) * 1971-11-29 1973-07-24 E Katzke Apparatus for polishing wafers

Also Published As

Publication number Publication date
NL7900497A (en) 1979-07-25
SE444526B (en) 1986-04-21
JPS54120585A (en) 1979-09-19
FR2415368B1 (en) 1984-05-04
IT1118308B (en) 1986-02-24
JPS6015147B2 (en) 1985-04-17
DE2901968C2 (en) 1988-08-11
GB2016166A (en) 1979-09-19
FR2415368A1 (en) 1979-08-17
IT7967112A0 (en) 1979-01-18
DE2901968A1 (en) 1979-07-26
GB2016166B (en) 1982-06-09

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