MY130149A - Process for smoothing the edge of semiconductor wafers. - Google Patents
Process for smoothing the edge of semiconductor wafers.Info
- Publication number
- MY130149A MY130149A MYPI94001563A MYPI9401563A MY130149A MY 130149 A MY130149 A MY 130149A MY PI94001563 A MYPI94001563 A MY PI94001563A MY PI9401563 A MYPI9401563 A MY PI9401563A MY 130149 A MY130149 A MY 130149A
- Authority
- MY
- Malaysia
- Prior art keywords
- edge
- smoothing
- semiconductor wafers
- semiconductor wafer
- working surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
Abstract
THE INVENTION RELATES TO A PROCESS FOR SMOOTHING THE EDGE OF SEMICONDUCTOR WAFERS, IF REQUIRED ALSO IN THE NOTCH OF A SEMICONDUCTOR WAFER, IN WHICH A COMPRESSIBLE CLOTH IMPREGNATED WITH DIAMONDS IS PRESSED, AS WORKING SURFACE OF A POLISHING TOOL, WITH A SPECIFIED FORCE AGAINST THE EDGE OF A SEMICONDUCTOR WAFER AND THE SEMICONDUCTOR WAFER AND/OR THE WORKING SURFACE EXECUTE A ROTATIONAL MOVEMENT.(FIG 2)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4325518A DE4325518A1 (en) | 1993-07-29 | 1993-07-29 | Method for smoothing the edge of semiconductor wafers |
Publications (1)
Publication Number | Publication Date |
---|---|
MY130149A true MY130149A (en) | 2007-06-29 |
Family
ID=6494026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI94001563A MY130149A (en) | 1993-07-29 | 1994-06-16 | Process for smoothing the edge of semiconductor wafers. |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPH0760624A (en) |
KR (1) | KR950004435A (en) |
CN (1) | CN1103511A (en) |
DE (1) | DE4325518A1 (en) |
IT (1) | IT1272345B (en) |
MY (1) | MY130149A (en) |
TW (1) | TW260812B (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11245151A (en) * | 1998-02-27 | 1999-09-14 | Speedfam Co Ltd | Work periphery polishing device |
JP3197253B2 (en) * | 1998-04-13 | 2001-08-13 | 株式会社日平トヤマ | Wafer chamfering method |
JP2000158315A (en) * | 1998-11-27 | 2000-06-13 | Speedfam-Ipec Co Ltd | Notch polishing method of notch polishing device in end surface polishing device |
KR20000076987A (en) * | 1999-03-31 | 2000-12-26 | 다구마시로오 | Method and apparatus for grinding a workpiece |
JP3510584B2 (en) * | 2000-11-07 | 2004-03-29 | スピードファム株式会社 | Peripheral polishing device for disk-shaped workpiece |
JP2002329687A (en) * | 2001-05-02 | 2002-11-15 | Speedfam Co Ltd | Apparatus and method of polishing periphery of device wafer |
JP3949941B2 (en) * | 2001-11-26 | 2007-07-25 | 株式会社東芝 | Semiconductor device manufacturing method and polishing apparatus |
JP5112703B2 (en) * | 2007-01-18 | 2013-01-09 | ダイトエレクトロン株式会社 | Wafer chamfering method and apparatus |
DE102009030294B4 (en) | 2009-06-24 | 2013-04-25 | Siltronic Ag | Process for polishing the edge of a semiconductor wafer |
JP2011194561A (en) * | 2010-02-26 | 2011-10-06 | Nakamura Tome Precision Ind Co Ltd | Chamfering device for disk-like workpiece |
CN102642253B (en) * | 2012-05-04 | 2014-12-10 | 上海华力微电子有限公司 | Silicon slice edge cutting method and device of silicon slice edge cutting method |
KR101985219B1 (en) * | 2012-05-07 | 2019-06-03 | 신에쯔 한도타이 가부시키가이샤 | Circumferential polishing device for disc-shaped workpieces |
DE102013210057A1 (en) | 2013-05-29 | 2014-12-04 | Siltronic Ag | Process for polishing the edge of a semiconductor wafer |
CN113182971B (en) * | 2021-05-12 | 2022-11-25 | 四川雅吉芯电子科技有限公司 | High-precision edge grinding device for monocrystalline silicon epitaxial wafer |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184662A (en) * | 1981-05-09 | 1982-11-13 | Hitachi Ltd | Chamfering method and device of wafer |
JPS5958827A (en) * | 1982-09-28 | 1984-04-04 | Toshiba Corp | Semiconductor wafer and method and apparatus for manufacturing semiconductor wafer |
JP2719855B2 (en) * | 1991-05-24 | 1998-02-25 | 信越半導体株式会社 | Mirror chamfering device around wafer |
US5128281A (en) * | 1991-06-05 | 1992-07-07 | Texas Instruments Incorporated | Method for polishing semiconductor wafer edges |
DE4120003A1 (en) * | 1991-06-18 | 1992-12-24 | Mueller Georg Nuernberg | DEVICE AND METHOD FOR EDGE-ROUNDING SEMICONDUCTOR RODS |
US5185965A (en) * | 1991-07-12 | 1993-02-16 | Daito Shoji Co., Ltd. | Method and apparatus for grinding notches of semiconductor wafer |
-
1993
- 1993-07-29 DE DE4325518A patent/DE4325518A1/en not_active Withdrawn
-
1994
- 1994-06-16 MY MYPI94001563A patent/MY130149A/en unknown
- 1994-06-30 CN CN94107806A patent/CN1103511A/en active Pending
- 1994-07-12 TW TW083106329A patent/TW260812B/zh active
- 1994-07-20 JP JP6189009A patent/JPH0760624A/en active Pending
- 1994-07-20 KR KR1019940017541A patent/KR950004435A/en not_active Application Discontinuation
- 1994-07-27 IT ITRM940495A patent/IT1272345B/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE4325518A1 (en) | 1995-02-02 |
ITRM940495A0 (en) | 1994-07-27 |
IT1272345B (en) | 1997-06-16 |
CN1103511A (en) | 1995-06-07 |
TW260812B (en) | 1995-10-21 |
ITRM940495A1 (en) | 1996-01-27 |
JPH0760624A (en) | 1995-03-07 |
KR950004435A (en) | 1995-02-18 |
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