JPS6418230A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6418230A
JPS6418230A JP17533687A JP17533687A JPS6418230A JP S6418230 A JPS6418230 A JP S6418230A JP 17533687 A JP17533687 A JP 17533687A JP 17533687 A JP17533687 A JP 17533687A JP S6418230 A JPS6418230 A JP S6418230A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
basket
faces
etching solution
uniform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17533687A
Other languages
Japanese (ja)
Inventor
Kenji Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP17533687A priority Critical patent/JPS6418230A/en
Publication of JPS6418230A publication Critical patent/JPS6418230A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To form a mesa groove whose depth is uniform and not irregular and whose shape is identical on semiconductor wafers by a method wherein an etching solution flows at a uniform speed and uniformly on the whole surface of all semiconductor wafers irrespective of their position inside a basket. CONSTITUTION:Semiconductor wafers 1 are placed inside a basket 2 not in an erect position but obliquely in an identical direction; the basket 2 is turned in an etching solution 3 on an axis of a handle 5 situated in the center of faces of the radially arranged semiconductor wafers 1; the etching solution 3 flows uniformly on the faces of the semiconductor wafers 1. Accordingly, the faces of the semiconductor wafers 1 are etched uniformly irrespective of the central part and a peripheral part. By this setup, it is possible to form a mesa groove whose depth is uniform and whose shape is identical over the whole surface of the semiconductor wafer 1.
JP17533687A 1987-07-14 1987-07-14 Manufacture of semiconductor device Pending JPS6418230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17533687A JPS6418230A (en) 1987-07-14 1987-07-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17533687A JPS6418230A (en) 1987-07-14 1987-07-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6418230A true JPS6418230A (en) 1989-01-23

Family

ID=15994285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17533687A Pending JPS6418230A (en) 1987-07-14 1987-07-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6418230A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035769A (en) * 1989-10-04 1991-07-30 The United States Of America As Represented By The United States Department Of Energy Nondestructive method for chemically machining crucibles or molds from their enclosed ingots and castings
KR100753694B1 (en) * 2007-03-20 2007-08-30 주식회사 엠코리아 Folding apparatus of work lifter for vehicle for working of bridge slab

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5035769A (en) * 1989-10-04 1991-07-30 The United States Of America As Represented By The United States Department Of Energy Nondestructive method for chemically machining crucibles or molds from their enclosed ingots and castings
KR100753694B1 (en) * 2007-03-20 2007-08-30 주식회사 엠코리아 Folding apparatus of work lifter for vehicle for working of bridge slab

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